CN101158649A - 外观检查装置及外观检查方法 - Google Patents
外观检查装置及外观检查方法 Download PDFInfo
- Publication number
- CN101158649A CN101158649A CNA2007101616576A CN200710161657A CN101158649A CN 101158649 A CN101158649 A CN 101158649A CN A2007101616576 A CNA2007101616576 A CN A2007101616576A CN 200710161657 A CN200710161657 A CN 200710161657A CN 101158649 A CN101158649 A CN 101158649A
- Authority
- CN
- China
- Prior art keywords
- inspection
- menu
- wafer
- mentioned
- condition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000011179 visual inspection Methods 0.000 title abstract 6
- 238000007689 inspection Methods 0.000 claims abstract description 114
- 230000008859 change Effects 0.000 claims abstract description 30
- 230000008569 process Effects 0.000 claims abstract description 12
- 238000003780 insertion Methods 0.000 claims description 16
- 230000037431 insertion Effects 0.000 claims description 16
- 238000012545 processing Methods 0.000 claims description 16
- 230000002950 deficient Effects 0.000 claims description 9
- 230000000007 visual effect Effects 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims 1
- 238000003384 imaging method Methods 0.000 abstract description 3
- 230000002093 peripheral effect Effects 0.000 abstract 3
- 230000006870 function Effects 0.000 description 18
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000005286 illumination Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000005055 memory storage Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 238000012790 confirmation Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- RUZYUOTYCVRMRZ-UHFFFAOYSA-N doxazosin Chemical compound C1OC2=CC=CC=C2OC1C(=O)N(CC1)CCN1C1=NC(N)=C(C=C(C(OC)=C2)OC)C2=N1 RUZYUOTYCVRMRZ-UHFFFAOYSA-N 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- PGLIUCLTXOYQMV-GHVWMZMZSA-N 2-[2-[4-[(r)-(4-chlorophenyl)-phenylmethyl]piperazine-1,4-diium-1-yl]ethoxy]acetic acid;dichloride Chemical compound Cl.Cl.C1CN(CCOCC(=O)O)CCN1[C@@H](C=1C=CC(Cl)=CC=1)C1=CC=CC=C1 PGLIUCLTXOYQMV-GHVWMZMZSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9503—Wafer edge inspection
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006268478A JP2008089351A (ja) | 2006-09-29 | 2006-09-29 | 外観検査装置及び外観検査方法 |
| JP2006268478 | 2006-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101158649A true CN101158649A (zh) | 2008-04-09 |
Family
ID=39260790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101616576A Pending CN101158649A (zh) | 2006-09-29 | 2007-09-27 | 外观检查装置及外观检查方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20080079932A1 (https=) |
| JP (1) | JP2008089351A (https=) |
| CN (1) | CN101158649A (https=) |
| TW (1) | TW200822260A (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108204982A (zh) * | 2016-12-16 | 2018-06-26 | 由田新技股份有限公司 | 多视角影像撷取装置及多视角影像检测设备 |
| CN108508031A (zh) * | 2017-02-28 | 2018-09-07 | 上海微电子装备（集团）股份有限公司 | 一种双面检测装置及检测方法 |
| CN114088724A (zh) * | 2021-11-20 | 2022-02-25 | 深圳市北科检测科技有限公司 | 一种显示屏边缘缺陷检测装置 |
| CN114113140A (zh) * | 2021-11-26 | 2022-03-01 | 深圳市北科检测科技有限公司 | 一种多工位led灯板检测装置 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007024525B4 (de) * | 2007-03-19 | 2009-05-28 | Vistec Semiconductor Systems Gmbh | Vorrichtung und Verfahren zur Bewertung von Defekten am Randbereich eines Wafers |
| JP2010002216A (ja) * | 2008-06-18 | 2010-01-07 | Kobelco Kaken:Kk | 端面観察装置 |
| US20110199480A1 (en) * | 2009-07-09 | 2011-08-18 | Camtek Ltd. | Optical inspection system using multi-facet imaging |
| US8786850B2 (en) * | 2012-10-29 | 2014-07-22 | Kla-Tencor Corporation | Illumination energy management in surface inspection |
| CN110490458A (zh) * | 2013-03-20 | 2019-11-22 | 生活时间品牌公司 | 一种移动质量管理检查系统 |
| CN105472252B (zh) * | 2015-12-31 | 2018-12-21 | 天津远度科技有限公司 | 一种无人机获取图像的系统及方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100416791B1 (ko) * | 2001-03-19 | 2004-01-31 | 삼성전자주식회사 | 반도체 웨이퍼 검사용 현미경장치 및 그 검사방법 |
| JP3629244B2 (ja) * | 2002-02-19 | 2005-03-16 | 本多エレクトロン株式会社 | ウエーハ用検査装置 |
| JP2004227671A (ja) * | 2003-01-23 | 2004-08-12 | Tdk Corp | 光記録媒体製造装置 |
-
2006
- 2006-09-29 JP JP2006268478A patent/JP2008089351A/ja not_active Withdrawn
-
2007
- 2007-09-27 CN CNA2007101616576A patent/CN101158649A/zh active Pending
- 2007-09-28 TW TW096136196A patent/TW200822260A/zh unknown
- 2007-09-28 US US11/906,072 patent/US20080079932A1/en not_active Abandoned
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108204982A (zh) * | 2016-12-16 | 2018-06-26 | 由田新技股份有限公司 | 多视角影像撷取装置及多视角影像检测设备 |
| CN108508031A (zh) * | 2017-02-28 | 2018-09-07 | 上海微电子装备（集团）股份有限公司 | 一种双面检测装置及检测方法 |
| CN114088724A (zh) * | 2021-11-20 | 2022-02-25 | 深圳市北科检测科技有限公司 | 一种显示屏边缘缺陷检测装置 |
| CN114088724B (zh) * | 2021-11-20 | 2023-08-18 | 深圳市北科检测科技有限公司 | 一种显示屏边缘缺陷检测装置 |
| CN114113140A (zh) * | 2021-11-26 | 2022-03-01 | 深圳市北科检测科技有限公司 | 一种多工位led灯板检测装置 |
| CN114113140B (zh) * | 2021-11-26 | 2023-07-07 | 深圳市北科检测科技有限公司 | 一种多工位led灯板检测装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008089351A (ja) | 2008-04-17 |
| US20080079932A1 (en) | 2008-04-03 |
| TW200822260A (en) | 2008-05-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101158649A (zh) | 外观检查装置及外观检查方法 | |
| CN101153852B (zh) | 外观检查装置 | |
| JP3161787B2 (ja) | レンズ屈折力分布観察装置 | |
| US7456947B2 (en) | Inspecting apparatus and inspecting method | |
| US20020131166A1 (en) | Microscope for inspecting semiconductor wafer | |
| EP2239095A1 (en) | Eyeglass lens processing apparatus | |
| JPH11287972A (ja) | 軸出装置 | |
| US9421720B2 (en) | Apparatus having cup attaching unit | |
| JP3842953B2 (ja) | カップ取付け装置 | |
| JP3782525B2 (ja) | 基板検査装置 | |
| JP3675657B2 (ja) | 投影測定装置 | |
| JP2008076218A (ja) | 外観検査装置 | |
| JP2004280267A (ja) | 加工装置用表示装置、加工装置用表示装置の表示方法、加工装置用表示装置の表示プログラム及び記録媒体 | |
| CN110986786B (zh) | 一种跨尺度测量分析仪 | |
| JP2004264690A (ja) | 芯ずれ補正装置及びその方法 | |
| JP7692554B2 (ja) | プロファイル研削盤用付加システム | |
| JP2018066911A (ja) | 拡大観察装置 | |
| JP4672623B2 (ja) | 半導体検査方法及び装置 | |
| CN210863562U (zh) | 小型化贴片晶振产品用镜检滑台系统 | |
| JP5202568B2 (ja) | 半導体検査装置及びそのコンピュータプログラム | |
| US20240152038A1 (en) | Digital projector, machine tool, and projected image display method | |
| JP7713787B2 (ja) | 加工装置 | |
| JP2003114195A (ja) | 画像取得装置 | |
| JPS61219200A (ja) | 電子部品搭載装置 | |
| JP2007292683A (ja) | 試料測定装置および試料測定装置の試料台調節方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20080409 |