CN101149613A - 开孔加工方法以及激光加工机 - Google Patents
开孔加工方法以及激光加工机 Download PDFInfo
- Publication number
- CN101149613A CN101149613A CNA2007101418908A CN200710141890A CN101149613A CN 101149613 A CN101149613 A CN 101149613A CN A2007101418908 A CNA2007101418908 A CN A2007101418908A CN 200710141890 A CN200710141890 A CN 200710141890A CN 101149613 A CN101149613 A CN 101149613A
- Authority
- CN
- China
- Prior art keywords
- machine table
- height
- workpiece
- table surface
- computing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000003754 machining Methods 0.000 title abstract description 8
- 238000005553 drilling Methods 0.000 title abstract 2
- 230000005055 memory storage Effects 0.000 claims description 4
- 238000003860 storage Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 241001269238 Data Species 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T408/00—Cutting by use of rotating axially moving tool
- Y10T408/55—Cutting by use of rotating axially moving tool with work-engaging structure other than Tool or tool-support
- Y10T408/567—Adjustable, tool-guiding jig
Abstract
Description
Claims (2)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-255744 | 2006-09-21 | ||
JP2006255744A JP4272667B2 (ja) | 2006-09-21 | 2006-09-21 | 穴明け加工方法およびレーザ加工機 |
JP2006255744 | 2006-09-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101149613A true CN101149613A (zh) | 2008-03-26 |
CN101149613B CN101149613B (zh) | 2012-05-16 |
Family
ID=39223820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007101418908A Active CN101149613B (zh) | 2006-09-21 | 2007-08-15 | 开孔加工方法以及激光加工机 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7952050B2 (zh) |
JP (1) | JP4272667B2 (zh) |
KR (1) | KR101399533B1 (zh) |
CN (1) | CN101149613B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101850471A (zh) * | 2009-03-31 | 2010-10-06 | 三菱电机株式会社 | 激光加工装置以及激光加工方法 |
CN114007787A (zh) * | 2019-06-18 | 2022-02-01 | 德马吉森精机株式会社 | 机床、机床的控制方法以及机床的控制程序 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120019649A (ko) * | 2010-08-26 | 2012-03-07 | 삼성엘이디 주식회사 | 레이저 스크라이빙 장치 및 그의 스크라이빙 방법 |
TW201315554A (zh) * | 2011-09-15 | 2013-04-16 | Panasonic Corp | 雷射加工裝置及雷射加工方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07204876A (ja) * | 1994-01-14 | 1995-08-08 | Advantest Corp | Ic表面保護膜の穴あけ装置及びこの装置を用いた穴あけ方法 |
JPH08150599A (ja) * | 1994-11-29 | 1996-06-11 | Matsushita Electric Works Ltd | プリント配線板の孔加工方法及びこのプリント配線板の孔加工方法を使用した孔加工装置 |
JP3222360B2 (ja) * | 1995-06-22 | 2001-10-29 | 株式会社サン・ブライト | 平面ラップ盤及びこれを用いた研磨方法 |
JP3375113B2 (ja) | 1996-04-16 | 2003-02-10 | 日立ビアメカニクス株式会社 | プリント基板の穴明け加工方法 |
JP2000052190A (ja) * | 1998-08-03 | 2000-02-22 | Amada Co Ltd | 板材加工機による加工方法および板材加工機 |
DE19950254C2 (de) | 1999-10-18 | 2003-06-26 | Ims Messsysteme Gmbh | Verfahren zur Bestimmung eines Dickenquerprofils und des Dickenlängsprofils eines laufenden Materialbandes |
JP2001276986A (ja) | 2000-03-29 | 2001-10-09 | Nec Corp | レーザ加工装置及び方法 |
DE10110386A1 (de) * | 2001-03-03 | 2002-09-19 | Karlsruhe Forschzent | Verfahren und Vorrichtung zur spanabhebenden Bearbeitung |
GB2377664A (en) * | 2001-06-22 | 2003-01-22 | Nippei Toyama Corp | Laser beam machining apparatus and laser beam machining method |
JP2004142082A (ja) * | 2002-10-28 | 2004-05-20 | Sumitomo Heavy Ind Ltd | 加工計画方法及び装置 |
JP2005122332A (ja) * | 2003-10-15 | 2005-05-12 | Olympus Corp | 自由曲面加工装置及び自由曲面加工方法 |
-
2006
- 2006-09-21 JP JP2006255744A patent/JP4272667B2/ja active Active
-
2007
- 2007-08-07 KR KR1020070078976A patent/KR101399533B1/ko active IP Right Grant
- 2007-08-15 CN CN2007101418908A patent/CN101149613B/zh active Active
- 2007-08-23 US US11/843,807 patent/US7952050B2/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101850471A (zh) * | 2009-03-31 | 2010-10-06 | 三菱电机株式会社 | 激光加工装置以及激光加工方法 |
CN114007787A (zh) * | 2019-06-18 | 2022-02-01 | 德马吉森精机株式会社 | 机床、机床的控制方法以及机床的控制程序 |
CN114007787B (zh) * | 2019-06-18 | 2023-11-10 | 德马吉森精机株式会社 | 机床、机床的控制方法以及机床的控制程序 |
Also Published As
Publication number | Publication date |
---|---|
CN101149613B (zh) | 2012-05-16 |
US20080073329A1 (en) | 2008-03-27 |
JP2008073806A (ja) | 2008-04-03 |
KR101399533B1 (ko) | 2014-05-30 |
JP4272667B2 (ja) | 2009-06-03 |
KR20080027128A (ko) | 2008-03-26 |
US7952050B2 (en) | 2011-05-31 |
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