CN101126907B - 微光刻投影曝光设备的投影物镜 - Google Patents

微光刻投影曝光设备的投影物镜 Download PDF

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Publication number
CN101126907B
CN101126907B CN200710152722.9A CN200710152722A CN101126907B CN 101126907 B CN101126907 B CN 101126907B CN 200710152722 A CN200710152722 A CN 200710152722A CN 101126907 B CN101126907 B CN 101126907B
Authority
CN
China
Prior art keywords
lens
projection objective
lens element
curvature
radius
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200710152722.9A
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English (en)
Chinese (zh)
Other versions
CN101126907A (zh
Inventor
D·克拉默
J·劳夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Zeiss SMT GmbH
Original Assignee
Carl Zeiss SMT GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss SMT GmbH filed Critical Carl Zeiss SMT GmbH
Publication of CN101126907A publication Critical patent/CN101126907A/zh
Application granted granted Critical
Publication of CN101126907B publication Critical patent/CN101126907B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
    • G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
    • G03F7/70966—Birefringence
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/14—Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation
    • G02B13/143—Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation for use with ultraviolet radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Toxicology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Lenses (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Microscoopes, Condenser (AREA)
  • Electron Beam Exposure (AREA)
CN200710152722.9A 2006-08-15 2007-08-14 微光刻投影曝光设备的投影物镜 Expired - Fee Related CN101126907B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006038398A DE102006038398A1 (de) 2006-08-15 2006-08-15 Projektionsobjektiv einer mikrolithographischen Projektionsbelichtungsanlage
DE102006038398.2 2006-08-15

Publications (2)

Publication Number Publication Date
CN101126907A CN101126907A (zh) 2008-02-20
CN101126907B true CN101126907B (zh) 2013-06-12

Family

ID=38954802

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200710152722.9A Expired - Fee Related CN101126907B (zh) 2006-08-15 2007-08-14 微光刻投影曝光设备的投影物镜

Country Status (8)

Country Link
US (1) US7679831B2 (enExample)
EP (1) EP1890193B1 (enExample)
JP (1) JP5317156B2 (enExample)
KR (1) KR101388297B1 (enExample)
CN (1) CN101126907B (enExample)
AT (1) ATE486302T1 (enExample)
DE (2) DE102006038398A1 (enExample)
TW (1) TWI425245B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008087827A1 (ja) * 2007-01-16 2008-07-24 Nikon Corporation 結像光学系、露光装置、およびデバイス製造方法
JP2008216498A (ja) * 2007-03-01 2008-09-18 Canon Inc 投影光学系、露光装置及びデバイス製造方法
JP2009031603A (ja) * 2007-07-27 2009-02-12 Canon Inc 投影光学系、露光装置及びデバイス製造方法
JP2009086038A (ja) * 2007-09-27 2009-04-23 Canon Inc 投影光学系、露光装置及びデバイス製造方法
CN111302297A (zh) * 2020-02-17 2020-06-19 福建晶安光电有限公司 图形化镥铝石榴石晶片结构及其制备方法、包括该结构的发光装置封装件和投影仪

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030086157A1 (en) * 2001-10-30 2003-05-08 Mcguire James P Reducing aberration in optical systems comprising cubic crystalline optical elements
US20030137733A1 (en) * 2001-07-18 2003-07-24 Carl Zeiss Semiconductor Manufacturing Technologies Ag Objective with lenses made of a crystalline material

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2699706A (en) * 1949-11-08 1955-01-18 Boone Philip Ornamental object having birefringent and polarizing layers
JPH1020197A (ja) * 1996-06-28 1998-01-23 Nikon Corp 反射屈折光学系及びその調整方法
DE60124524T2 (de) * 2000-04-25 2007-03-08 Asml Holding, N.V. Optisches reduktionssystem mit kontrolle der belichtungspolarisation
DE10040998A1 (de) * 2000-08-22 2002-03-14 Zeiss Carl Projektionsbelichtungsanlage
WO2002093209A2 (de) * 2001-05-15 2002-11-21 Carl Zeiss Objektiv mit fluorid-kristall-linsen
US6683710B2 (en) * 2001-06-01 2004-01-27 Optical Research Associates Correction of birefringence in cubic crystalline optical systems
US6775063B2 (en) * 2001-07-10 2004-08-10 Nikon Corporation Optical system and exposure apparatus having the optical system
US6958864B2 (en) 2002-08-22 2005-10-25 Asml Netherlands B.V. Structures and methods for reducing polarization aberration in integrated circuit fabrication systems
US7239450B2 (en) * 2004-11-22 2007-07-03 Carl Zeiss Smt Ag Method of determining lens materials for a projection exposure apparatus
KR20070105976A (ko) * 2005-02-25 2007-10-31 칼 짜이스 에스엠티 아게 광학시스템, 특히 마이크로리소그래픽 투사노출장치용대물렌즈 또는 조명장치
DE102006013560A1 (de) 2005-04-19 2006-10-26 Carl Zeiss Smt Ag Projektionsobjektiv einer mikrolithographischen Projektionsbelichtungsanlage sowie Verfahren zu dessen Herstellung
DE102006025044A1 (de) 2005-08-10 2007-02-15 Carl Zeiss Smt Ag Abbildungssystem, insbesondere Projektionsobjektiv einer mikrolithographischen Projektionsbelichtungsanlage

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030137733A1 (en) * 2001-07-18 2003-07-24 Carl Zeiss Semiconductor Manufacturing Technologies Ag Objective with lenses made of a crystalline material
US20030086157A1 (en) * 2001-10-30 2003-05-08 Mcguire James P Reducing aberration in optical systems comprising cubic crystalline optical elements

Also Published As

Publication number Publication date
TWI425245B (zh) 2014-02-01
KR20080015755A (ko) 2008-02-20
CN101126907A (zh) 2008-02-20
JP5317156B2 (ja) 2013-10-16
DE602007010060D1 (de) 2010-12-09
JP2008046641A (ja) 2008-02-28
US7679831B2 (en) 2010-03-16
EP1890193A1 (en) 2008-02-20
US20080043331A1 (en) 2008-02-21
TW200831943A (en) 2008-08-01
KR101388297B1 (ko) 2014-04-22
EP1890193B1 (en) 2010-10-27
DE102006038398A1 (de) 2008-02-21
ATE486302T1 (de) 2010-11-15

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130612

Termination date: 20210814

CF01 Termination of patent right due to non-payment of annual fee