CN101090074A - 用于电子元件封装件的印刷电路板及其制造方法 - Google Patents

用于电子元件封装件的印刷电路板及其制造方法 Download PDF

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CN101090074A
CN101090074A CNA2007100906196A CN200710090619A CN101090074A CN 101090074 A CN101090074 A CN 101090074A CN A2007100906196 A CNA2007100906196 A CN A2007100906196A CN 200710090619 A CN200710090619 A CN 200710090619A CN 101090074 A CN101090074 A CN 101090074A
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insulating barrier
pad
circuit board
printed circuit
solder ball
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姜明杉
闵炳烈
金俊成
柳济光
崔宗奎
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Abstract

本发明涉及一种印刷电路板，具体地说，涉及一种用于电子元件的封装件的印刷电路板及其制造方法。本发明的一个方面提供了一种用于电子元件封装件的印刷电路板的制造方法，该方法包括：在第一绝缘层的一侧上形成包括焊盘的电路图案；将第二绝缘层层压到第一绝缘层的一侧上；以及通过去除与形成焊盘的位置相对应的第一绝缘层和第二绝缘层的部分而露出焊盘。并且该方法提供一个不需要引线接合法就可以封装电子元件的单层电路图案。

Description

用于电子元件封装件的印刷电路板及其制造方法
相关申请交叉参考
本申请要求2006年6月16日向韩国知识产权局提交的第2006-0054459号韩国专利申请的权益，其公开内容整体结合于此作为参考。
技术领域
本发明涉及一种印刷电路板，具体地说，涉及一种用于电子元件封装件的印刷电路板及其制造方法。
背景技术
随着电子行业的发展，安装有存储芯片的存储封装件在电子器件中的使用迅速增加。而且，随着公司将其业务扩展到与存储封装件有关的领域，制造和供应存储封装件的公司也在增加。在这种竞争市场的形势下，提出了各种建议来降低成本。
近来，在多数情况下，存储封装件通过利用引线接合法制作一个封装件而实现，如图1A、1B中所示，并且该封装件被称为BOC(晶片(芯片)贴板)。BOC尤其已被研发得适合于存储芯片的特征，并且使得存储芯片的焊盘位于基板的中心处，而所设置的焊盘的结构用于直接与基板连接。BOC是这样的结构，其中在设置焊盘的位置形成有狭槽，以便将存储芯片附在基板下方，其中可以通过该狭槽进行引线接合。因此，BOC仅需一个金属层，这提供了存储封装件在价格竞争方面的优势。
但是，随着制造半导体技术的飞速发展，存储封装件的容量也在增加。这就在使用传统BOC情况下造成了引线处的信号损失的风险。
发明内容
本发明的一方面在于提供一种用于安装电子元件封装件的印刷电路板及其制造方法，该方法使得可以安装高容量存储芯片。
从包含附图和权利要求的以下详细描述中，本发明的其它方面和优点将变得显而易见且更容易理解，或者可以从本发明的实践中获知。
本发明的一个方面提供了一种用于电子元件封装件的印刷电路板的制造方法，该方法包括：(a)在第一绝缘层的一侧上形成包括焊盘的电路图案；(b)将第二绝缘层层压到第一绝缘层的一侧上；以及(c)通过去除与形成焊盘的位置相对应的第一绝缘层和第二绝缘层的部分而露出焊盘。并且用于电子元件封装件的该印刷电路板具有单层电路图案，不需要引线接合法就可以封装电子元件。
电路图案可以进一步包括焊球盘(solder ball pad)，并且该步骤(c)可以进一步包括：通过去除与焊球盘的位置相对应的第一绝缘层的部分或第二绝缘层的部分而露出焊球盘。
步骤(a)可以进一步包括：(a1)将晶种层层压到载板上；(a2)在晶种层上形成电路图案；(a3)将第一绝缘层层压到载板上，使得电路图案埋入到第一绝缘层中；以及(a4)去除载板和晶种层。
第一绝缘层和第二绝缘层可以包含光刻胶材料，并且该步骤(c)包括：通过曝光和显影，去除部分第一绝缘层和第二绝缘层。使用光刻胶材料的话，很容易去除部分第一绝缘层和第二绝缘层。
本发明的另一方面提供了一种用于电子元件封装件的印刷电路板，该印刷电路板包括：第一绝缘层；电路图案，其层压到第一绝缘层的一侧上，并且包括焊盘和焊球盘；第二绝缘层，其层压到第一绝缘层的所述一侧上；腔室，其通过去除与焊盘和焊球盘的位置相对应的第一绝缘层的部分和第二绝缘层的部分而形成，用于露出焊盘和焊球盘。
第一绝缘层和第二绝缘层可以是感光的。
附图说明
从下面结合附图对实施例的描述，本发明总发明构思的这些和/或其它方面和优点将变得显而易见且更容易理解，附图中：
图1A是根据现有技术的电子元件封装件的透视图；
图1B是根据现有技术的电子元件封装件的横截面视图；
图2是根据本发明第一公开实施例的用于电子元件封装件的印刷电路板的制造方法的流程图；
图3是根据本发明第一公开实施例的存储封装件的制造示图；
图4是根据本发明第二公开实施例的用于电子元件封装件的印刷电路板的横截面视图。
具体实施方式
下面将参照附图更详细地描述根据本发明的用于电子元件封装件的印刷电路板及其制造方法的实施例。在参照附图的描述中，与图号无关，相同或相关的那些部件以相同的参考标号表示，并省略重复的描述。
图2是根据本发明第一公开实施例的用于电子元件封装件的印刷电路板的制造方法的流程图，而图3是根据本发明第一公开实施例的存储封装件的制造示图。参照图3，示出了载板31、晶种层32、干膜33、第一绝缘层34a、第二绝缘层34b、焊球盘36a、电路图案36、焊盘36c、以及镀层37。
图2的S21是用于在第一绝缘层34a上形成电路图案36的操作，该电路图案包括焊盘36c和焊球盘36a。图3的(a)至(f)对应于S21。
图3的(a)描绘出了用于将晶种层32层压到载板31上的操作。晶种层32可以通过化学镀形成，但可以使用任何附着有薄铜箔的材料。任何允许迅速分离的材料都可以用作载板31。
图3的(b)描绘出了用于将干膜33层压到晶种层32上以及通过曝光和显影工艺去除干膜33的其中将形成电路图案36的部分的工艺，该电路图案包括焊球盘36a和焊盘36c。在电镀并去除干膜33之后，包括焊盘36c和焊球盘36a的电路图案36形成在晶种层32上，如图3所示。
图3的(d)是用于将载板31层压到第一绝缘层34a上的工艺。此时，将电路图案36浸渍(impregnate)到第一绝缘层34a中，如图3所示。
之后，去除载板31和晶种层32，如图3的(e)和(f)中所示，此时完成了埋入式图案基板30。埋入式图案基板30具有可容易地安装半导体芯片的优点，因为埋入式图案基板30的表面是平坦的。
除了图3的(a)至(f)所示的方法外，还可以采用各种方法来形成图2的S21中的埋入式图案基板。例如，可以使用在去除铜箔层压板的铜箔之后形成电路图案的削减法，或在将晶种层层压到绝缘层上之后形成电路图案的半加成法。
图2的S22是用于将第二绝缘层34b层压到第一绝缘层34a一侧上的操作。图3的(g)和(h)描绘出了与S22相对应的步骤。将第二绝缘层34b层压到第一绝缘层34a的其上已浸渍有电路图案36的一侧上，如图3的(g)中所示。随后，将包括焊盘36c和焊球盘36a的电路图案36设置在第一绝缘层34a与第二绝缘层34b之间，如图3的(i)中所示。
图2的S23是用于在去除第一绝缘层34a的部分以及第二绝缘层34b的部分之后露出焊盘36c和焊球盘36a的操作。第一绝缘层34a和第二绝缘层34b可以由感光材料制成，从而在曝光和显影工艺之后第一绝缘层34a和第二绝缘层34b可以被去除。如图3的(j)中所示，由于去除第一绝缘层34a而露出焊球盘36a，并且在去除第二绝缘层34b之后而露出焊盘36c。焊盘36c是半导体芯片将被安装的部分，而焊球盘36a是焊球将被附着的部分。
可以在露出的焊球盘36a和露出的焊盘36c上附加地进行表面处理工艺。在表面处理完成之后形成镀层37。镀层37通过在镀镍之后镀金而形成。
图4是根据第二公开实施例的用于电子元件封装件的印刷电路板的横截面视图。参照图4，示出了用于封装件的印刷电路板40、第一绝缘层44a、第二绝缘层44b、焊球盘46a、电路图案46、焊盘46c、以及腔室47。
如图4中所示，根据本实施例的用于封装件的印刷电路板40具有电路图案46b，该电路图案包括焊球盘46a和焊盘46c，它们定位在介于第一绝缘层44a与第二绝缘层44b之间的一个层上。
第一绝缘层44a和第二绝缘层44b可以由感光材料制成，并去除第一绝缘层44a和第二绝缘层44b的部分，以便露出焊球盘46a和焊盘46c。该去除步骤可以通过在第一感光绝缘层44a和第二感光绝缘层44b上进行的曝光和显影工艺而实现。同时，由于腔室47的形成而露出焊球盘46a和焊盘46c。可以对露出的焊球盘46a进行表面处理。表面处理的形式可以是在镍镀层上镀金。
根据上面所述的本发明的某些实施例，信号线的长度变得比用于电子元件封装件的传统印刷电路板中的要短，并且可以进行快速的信号处理。而且，由于半加成方法的使用，可以形成高密度电路。此外，由于电路图案层表现为单层，所以获得了极好的散热特性。
尽管上面的描述在应用于各个实施例时，已经指出了本发明的新颖性特征，但本领域技术人员将理解，在不背离本发明范围的前提下，在所示的装置或工艺的形式和细节方面可以进行各种省略、替换和改变。因此，本发明的范围由所附权利要求限定，而不是由上面的描述限定。在权利要求等同物的意义和范围内的各种改变也包含在权利要求的范围内。

Claims (6)

1.一种用于电子元件封装件的印刷电路板的制造方法，所述方法
包括：
(a)在第一绝缘层的一侧上形成包括焊盘的电路图案；
(b)将第二绝缘层层压到所述第一绝缘层的所述一侧上；
以及
(c)通过去除与所述焊盘的位置相对应的所述第一绝缘层和所述第二绝缘层的部分，而露出所述焊盘。
2.根据权利要求1所述的方法，其中，所述电路图案进一步包括焊球盘，并且所述步骤(c)进一步包括：通过去除与所述焊球盘的位置相对应的所述第一绝缘层的部分或所述第二绝缘层的部分而露出所述焊球盘。
3.根据权利要求1所述的方法，其中，所述步骤(a)进一步包括：
(a1)将晶种层层压到载板上；
(a2)在所述晶种层上形成所述电路图案；
(a3)将所述第一绝缘层层压到所述载板上，使得所述电路图案埋入到所述第一绝缘层中；以及
(a4)去除所述载板和所述晶种层。
4.根据权利要求1所述的方法，其中，所述第一绝缘层和所述第二绝缘层包含光刻胶材料，并且所述步骤(c)包括：通过曝光和显影，去除所述第一绝缘层的部分和所述第二绝缘层的部分。
5.一种用于电子元件封装件的印刷电路板，所述印刷电路板包括：
第一绝缘层；
电路图案，其层压到所述第一绝缘层的一侧上，并且包括焊盘和焊球盘；
第二绝缘层，其层压到所述第一绝缘层的所述一侧上；
腔室，其对应于所述焊盘和所述焊球盘的位置而形成，用于露出所述焊盘和所述焊球盘，并且通过去除所述第一绝缘层的部分和所述第二绝缘层的部分而形成。
6.根据权利要求5所述的印刷电路板，其中，所述第一绝缘层和所述第二绝缘层是感光的。
CNA2007100906196A 2006-06-16 2007-03-30 用于电子元件封装件的印刷电路板及其制造方法 Pending CN101090074A (zh)

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