CN101083231A - 集成电路封装体及其装配方法 - Google Patents
集成电路封装体及其装配方法 Download PDFInfo
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- CN101083231A CN101083231A CNA200710109234XA CN200710109234A CN101083231A CN 101083231 A CN101083231 A CN 101083231A CN A200710109234X A CNA200710109234X A CN A200710109234XA CN 200710109234 A CN200710109234 A CN 200710109234A CN 101083231 A CN101083231 A CN 101083231A
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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- H01L2924/19101—Disposition of discrete passive components
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- H01L2924/351—Thermal stress
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Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US80368106P | 2006-06-01 | 2006-06-01 | |
US60/803,681 | 2006-06-01 | ||
US11/527,573 | 2006-09-27 |
Publications (2)
Publication Number | Publication Date |
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CN101083231A true CN101083231A (zh) | 2007-12-05 |
CN100477176C CN100477176C (zh) | 2009-04-08 |
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Application Number | Title | Priority Date | Filing Date |
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CNB200710109234XA Active CN100477176C (zh) | 2006-06-01 | 2007-05-24 | 集成电路封装体及其装配方法 |
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Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102194797A (zh) * | 2010-03-11 | 2011-09-21 | 矽品精密工业股份有限公司 | 能避免电磁干扰的四方形扁平无引脚封装结构及其制法 |
CN102779811A (zh) * | 2012-07-20 | 2012-11-14 | 华为技术有限公司 | 一种芯片封装及封装方法 |
CN103295922A (zh) * | 2012-03-02 | 2013-09-11 | 瑞萨电子株式会社 | 半导体器件的制造方法和半导体器件 |
CN104465541A (zh) * | 2013-09-17 | 2015-03-25 | 南茂科技股份有限公司 | 芯片封装结构及其制作方法 |
CN104952856A (zh) * | 2015-06-27 | 2015-09-30 | 华东光电集成器件研究所 | 一种双面组装集成电路 |
CN105514056A (zh) * | 2016-01-15 | 2016-04-20 | 中山芯达电子科技有限公司 | 一种利于热量散逸的芯片封装结构 |
CN105679737A (zh) * | 2016-01-15 | 2016-06-15 | 中山芯达电子科技有限公司 | 一种多芯片封装结构 |
CN107411459A (zh) * | 2017-07-17 | 2017-12-01 | 陈锋 | 一种防电磁辐射的被子 |
CN108029228A (zh) * | 2015-09-29 | 2018-05-11 | 日立汽车系统株式会社 | 电子控制装置 |
CN109273418A (zh) * | 2018-11-08 | 2019-01-25 | 中国科学院苏州纳米技术与纳米仿生研究所南昌研究院 | 一种芯片封装结构及方法 |
CN109742061A (zh) * | 2019-01-14 | 2019-05-10 | 清华大学 | 柔性电子器件及其制造方法 |
CN110676233A (zh) * | 2019-09-10 | 2020-01-10 | 深圳第三代半导体研究院 | 一种压接式功率开关模块及其制备方法 |
CN113809023A (zh) * | 2020-06-17 | 2021-12-17 | 华为数字能源技术有限公司 | 一种散热器、封装结构及电子设备 |
-
2007
- 2007-05-24 CN CNB200710109234XA patent/CN100477176C/zh active Active
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102194797A (zh) * | 2010-03-11 | 2011-09-21 | 矽品精密工业股份有限公司 | 能避免电磁干扰的四方形扁平无引脚封装结构及其制法 |
CN103295922A (zh) * | 2012-03-02 | 2013-09-11 | 瑞萨电子株式会社 | 半导体器件的制造方法和半导体器件 |
CN103295922B (zh) * | 2012-03-02 | 2017-07-18 | 瑞萨电子株式会社 | 半导体器件的制造方法和半导体器件 |
US9484311B2 (en) | 2012-07-20 | 2016-11-01 | Huawei Technologies Co., Ltd. | Chip package and packaging method |
CN102779811A (zh) * | 2012-07-20 | 2012-11-14 | 华为技术有限公司 | 一种芯片封装及封装方法 |
CN102779811B (zh) * | 2012-07-20 | 2015-02-04 | 华为技术有限公司 | 一种芯片封装及封装方法 |
CN104465541A (zh) * | 2013-09-17 | 2015-03-25 | 南茂科技股份有限公司 | 芯片封装结构及其制作方法 |
CN104952856A (zh) * | 2015-06-27 | 2015-09-30 | 华东光电集成器件研究所 | 一种双面组装集成电路 |
CN108029228A (zh) * | 2015-09-29 | 2018-05-11 | 日立汽车系统株式会社 | 电子控制装置 |
CN105679737A (zh) * | 2016-01-15 | 2016-06-15 | 中山芯达电子科技有限公司 | 一种多芯片封装结构 |
CN105514056A (zh) * | 2016-01-15 | 2016-04-20 | 中山芯达电子科技有限公司 | 一种利于热量散逸的芯片封装结构 |
CN107411459A (zh) * | 2017-07-17 | 2017-12-01 | 陈锋 | 一种防电磁辐射的被子 |
CN109273418A (zh) * | 2018-11-08 | 2019-01-25 | 中国科学院苏州纳米技术与纳米仿生研究所南昌研究院 | 一种芯片封装结构及方法 |
CN109742061A (zh) * | 2019-01-14 | 2019-05-10 | 清华大学 | 柔性电子器件及其制造方法 |
CN110676233A (zh) * | 2019-09-10 | 2020-01-10 | 深圳第三代半导体研究院 | 一种压接式功率开关模块及其制备方法 |
CN110676233B (zh) * | 2019-09-10 | 2021-09-24 | 深圳第三代半导体研究院 | 一种压接式功率开关模块及其制备方法 |
CN113809023A (zh) * | 2020-06-17 | 2021-12-17 | 华为数字能源技术有限公司 | 一种散热器、封装结构及电子设备 |
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CN100477176C (zh) | 2009-04-08 |
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