CN101068946A - 钛－铜－镍基合金的用途 - Google Patents

钛－铜－镍基合金的用途 Download PDF

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CN101068946A
CN101068946A CNA200580041611XA CN200580041611A CN101068946A CN 101068946 A CN101068946 A CN 101068946A CN A200580041611X A CNA200580041611X A CN A200580041611XA CN 200580041611 A CN200580041611 A CN 200580041611A CN 101068946 A CN101068946 A CN 101068946A
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titanium
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M·马丁
F·法韦容
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Hydromecanique et Frottement SAS
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C14/00—Alloys based on titanium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T428/14—Layer or component removable to expose adhesive
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  • Engineering & Computer Science (AREA)
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  • Laminated Bodies (AREA)
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Abstract

本发明涉及钛－铜－镍基合金，所述合金用来在聚合物基材上形成至少一个电阻薄层。

Description

钛-铜-镍基合金的用途
技术领域
本发明涉及聚合物基材，其至少一个面被设置为构成加热区。
背景技术
对于在基材上制备加热电阻，已经提出了各种技术解决方案。例如，可将包括铜线的电阻形式的加热元件粘合到基材上。但是，这种解决方案并不令人满意，因为它需要长时间和高费用的制造过程，产生集成限制，并且在热循环过程中加热元件的至少一部分可能会脱离，这与环境的湿度变化有关。
替代粘合的另一种解决方案是电阻材料的电解沉积。但是，除了所获得的粘着程度并不令人满意之外，该电解似乎限于沉积少量的材料，在不通过选择性沉积、蚀刻或标记的复杂方法制备电阻电路的情况下，这些材料的电阻率太低而不能构成加热元件。
鉴于以上内容，为了解决获得高的和耐久的粘着性所提出的问题，同时为了宽范围选择具有满意电阻率的材料，看起来真空沉积技术(尤其通过阴极溅射)可提供令人满意的解决方案。
因此，美国专利6 365 483描述了通过本领域技术人员已知的电阻材料的真空沉积来制造加热系统的方法。该文件中所述的技术解决方案并不令人满意，因为它使用长时间和高费用的方法，包括至少一个通过照相平版印刷技术制备电阻电路的步骤，以获得期望的膜电阻。
根据预期的应用，当加热系统必须在腐蚀性环境中操作时，关于所用的材料出现另一个要解决的技术问题。例如对于机动车后视镜的除霜来说情况就是如此，其中接受反射部分的基材可被加热。电阻层(也就是加热层)必须承受这种类型的环境。而且，电阻层必须有利地能够提供有例如12V或48V的电压，但是必须不能太薄到无法容易地被常规方法控制，也不能太厚，以避免由于本领域技术人员众所周知的原因(断裂、残余应力等)而增加其成本和降低其使用寿命。一方面由于预定的厚度并且另一方面由于电源电压的需要而产生的这种双重限制限定了选择材料的必需的可接受电阻率范围。
看来其电阻率性质已知的目前可获得的材料不适合于实现这些目标。
令人惊奇地和出人意料地，看来钛-铜-镍基合金构成了令人满意的解决所提出问题的方案，因为这种合金的电阻率为200～300μΩ/cm，并且还具有依照NFX41002标准的优良的耐腐蚀性(在盐雾中大于400小时)。
虽然这种钛-铜-镍合金是本领域技术人员非常熟悉的，由于其生物相容性(专利US 4 774 953)而可作为钎焊合金(专利US 3 651 099、US 3 652 237)，或者作为金属基质复合材料中的粘合促进剂(专利US 410 133、US 5 645 747、US 5 530 228)，但是并不知道它们具有电阻率性质，没有出版物报道过这种性质。
还观察到，与在薄层中沉积的大多数材料相反，这个系列的钛-铜-镍合金具有甚至在几个加热-冷却循环之后仍保持恒定电阻率的特殊特性。
发明内容
考虑到这种发现，本发明涉及钛-铜-镍基合金用于在基材上形成至少一个电阻薄层的用途。
为了解决制备具有预定厚度的电阻薄层所提出的问题，通过阴极溅射将该合金施涂到基材上。该薄层的厚度为约100～160nm。
有利地，该合金由质量分数为69重量％的钛、15.5重量％的铜和15.5重量％的镍组成。更一般地，该合金由50～80重量％的钛、10～25重量％的铜和10～25重量％的镍组成。
根据一种示例性实施方式，该基材构成平表面，其与涂覆有包含钛-铜-镍合金的电阻层的面相对的面涂覆有反射层，使所述电阻层置于能量源的影响下，以使其承受约12V或48V的电压。
基材可有利地构成机动车后视镜的“镜、”部分的支撑物，尤其是通过使用所述电阻层来给所述镜除霜。
具体实施方式
由下面提供的实施例将更好地理解本发明，该实施例是为了说明，而不是限制。
根据本发明的实施例：
需要使用12V电源电压在矩形聚碳酸酯基材上耗散12W的功率，这导致限定电阻层的总电阻为12Ω。通过用等离子体蒸汽沉积(PVD)向此表面施涂具有组成Ti69、Cu15.5、Ni15.5(质量分数)的钛-铜-镍合金层，其电阻率在250μΩ/cm下测定，从而对于130nm的层厚度获得12Ω的电阻。由此获得的电阻层可以在12V的电压下、1000h的持续时间内耗散12W的功率，而没有出现层的任何脱离或劣化。在完成该试验时，电阻率相对于其初始值仅变化了3％。而且，经受根据NFX41002标准的盐雾，电阻率没有变化(根据本发明类似地提供其它实施例)。
不符合本发明的实施例：
-具有Ti2Cu66Ni32质量组成的钛-铜-镍合金。它的电阻率为42μΩ/cm，其在与实施例1相同的条件下对于22nm的层厚度将产生12Ω的电阻，这在非平面部件上是完全不现实的。
-用纯钛层进行试验，其电阻率在140μΩ/cm下测定，该层的必需厚度因此为90～100nm。类似地，包含4％钒的镍/钒合金已知用于这种用途，其80μΩ/cm的电阻率产生厚度为20～50nm的层。这些厚度接近于用已知工业方法可获得的具有充分可靠性的厚度极限。而且，在聚合物基材上观察到，对于小于100nm的厚度来说，不可能耗散12W的功率而不引起电阻层的过早破坏。
本发明并不限于该明确描述的实施方式，而是包括其各种替代选择和普遍化，它们包含在权利要求的范围内。
从说明书清楚地可见这些优点。

Claims (6)

1.钛-铜-镍基合金用于在聚合物基材上形成至少一个电阻薄层的用途。
2.权利要求1的用途，其特征在于通过阴极溅射将该合金施加到基材上。
3.权利要求1的用途，其特征在于该合金由50～80重量％的钛、10～25重量％的铜和10～25重量％的镍组成。
4.权利要求1的用途，其特征在于该薄层的厚度为约100～160nm。
5.权利要求3的用途，其特征在于该合金有利地由69重量％的钛、15.5重量％的铜和15.5重量％的镍组成。
6.权利要求1的用途，其特征在于该基材构成平表面，其与涂覆有包含钛-铜-镍合金的电阻层的面相对的面涂覆有反射层，使所述电阻层置于能量源的影响下，以使其承受约12V的电压。
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FR0452535A FR2877677B1 (fr) 2004-11-05 2004-11-05 Utilisation d'un alliage a base de titane-cuivre-nickel
FR0452535 2004-11-05

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EP (1) EP1815039B1 (zh)
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KR (1) KR101205291B1 (zh)
CN (1) CN100552079C (zh)
AT (1) ATE503032T1 (zh)
AU (1) AU2005300432B2 (zh)
BR (1) BRPI0517068B1 (zh)
CA (1) CA2586281C (zh)
DE (1) DE602005027103D1 (zh)
ES (1) ES2362193T3 (zh)
FR (1) FR2877677B1 (zh)
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CN102041480A (zh) * 2009-10-22 2011-05-04 Smr专利责任有限公司 将加热器功能应用于塑料玻璃的工艺

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BRPI0517068B1 (pt) 2016-01-26
ES2362193T3 (es) 2011-06-29
CA2586281C (fr) 2012-11-20
AU2005300432B2 (en) 2010-08-26
KR20070085726A (ko) 2007-08-27
US7883744B2 (en) 2011-02-08
WO2006048568A3 (fr) 2007-01-18
JP2008519162A (ja) 2008-06-05
ATE503032T1 (de) 2011-04-15
JP4855409B2 (ja) 2012-01-18
AU2005300432A1 (en) 2006-05-11
CN100552079C (zh) 2009-10-21
BRPI0517068A (pt) 2008-09-30
MX2007005342A (es) 2007-06-25
EP1815039A2 (fr) 2007-08-08
CA2586281A1 (fr) 2006-05-11
US20070297933A1 (en) 2007-12-27
KR101205291B1 (ko) 2012-11-27
DE602005027103D1 (de) 2011-05-05
EP1815039B1 (fr) 2011-03-23
FR2877677B1 (fr) 2006-12-15
WO2006048568A2 (fr) 2006-05-11
FR2877677A1 (fr) 2006-05-12

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