CN101066002A - 焊接柔性电路 - Google Patents
焊接柔性电路 Download PDFInfo
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- CN101066002A CN101066002A CNA2005800355794A CN200580035579A CN101066002A CN 101066002 A CN101066002 A CN 101066002A CN A2005800355794 A CNA2005800355794 A CN A2005800355794A CN 200580035579 A CN200580035579 A CN 200580035579A CN 101066002 A CN101066002 A CN 101066002A
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Abstract
本发明公开了在柔性电路(180)焊接到微机电结构的应用中用于控制焊料流动的技术。金属层(170)形成于基板上。焊料掩模(195)形成于金属层(170)上,使得部分金属层(170)被掩模(195)覆盖,部分被暴露。柔性电路(180)至少在金属层(170)被暴露的一些区域焊接到金属层(170)。
Description
技术领域
本发明涉及将柔性电路焊接到例如打印头致动器的装置上的电学接触。
背景技术
喷墨打印机通过选择性地将墨沉积到接收介质上而形成图像。在传统喷墨打印机系统中,墨存储于墨存储单元例如墨贮存器或墨盒,并从该存储单元引入到如图1所示的打印头100内。在打印头100内,墨流入墨泵浦腔体120并流到喷嘴130,墨在喷嘴130被喷射。通常,该打印头包括迫使墨通过喷嘴130流出打印头100的致动器。两种常见类型的致动器包括电阻加热致动器和压电致动器。在压电致动器150内,压电材料层165可以形成为毗邻墨泵浦腔体120。在压电材料165上施加电压导致压电材料弯曲或者变形,压电材料165的变形导致压力波穿过墨泵浦腔体120传播,将墨从喷嘴130挤出到接收介质上。通常,电极160、170形成于压电层165的任意侧,使得电压可以施加在层165上。
在所谓的“按需滴落(drop-on-demand)”打印机中,可以在单个打印头100内形成多个流道108a和108b(如图2中的虚线所示)以及相关的喷嘴130,且各个喷嘴130可以被分别激励。因此,仅当期望来自某个特定喷嘴的墨滴时,该喷嘴才喷射墨。为了激励打印头上的特定致动器,电学信号通常单独传达至该致动器。该电学信号可以通过连接到打印头的柔性电路传达到该致动器。
发明内容
一般而言,一方面,本发明的特征为具有第一和第二电极以及置于这些电极之间的压电层的致动器。掩模形成于第一电极上,其中该掩模毗邻第一电极的第一部分。焊接材料由该第一电极支撑并毗邻该第一电极的第二部分。第一电极的第一部分不交叠第一电极的第二部分,且该掩模包括当焊接材料熔化时基本上不会被该焊接材料湿润的材料。
该掩模可包括氧化物材料。该掩模厚度可以介于约0.1至2微米之间,例如约为0.5微米。该焊接材料可以将电极电连接到集成电路。该致动器可以附着到柔性电路。第一部分可对应于当第二电极接合到装置时该装置的位置。
另一方面,本发明的特征为形成微机电装置的方法。该方法包括在基板顶面上形成致动器,该致动器包括压电层、第一电极和第二电极。焊料掩模形成于第一电极上,使得第一电极的第一部分暴露于环境且第一电极的第二部分被该焊料掩模覆盖。焊料涂敷到位于第一电极第一部分的第一电极。柔性电路接触该焊料。加热该焊料,使该焊料将柔性电路电连接到第一电极,其中在焊料被加热时,该焊料掩模可以防止焊料在第一部分上流动。
具体实施可包括一个以上(或者不包括)下述优点。通过在打印头的泵浦腔体上形成焊料掩模,可以减小在泵浦腔体上流动的焊料的数量。致动器上的焊料层会致使致动器变得异常僵硬并难以致动。此外,致动器上的焊料层会增大致动器的质量。因此,降低各个泵浦腔体上焊料数量,可以改善从流道到流道以及从打印头到打印头的致动器的质量和扰曲模量的一致性。这可以直接改善致动器特性例如驱动特性的一致性。因此,避免有源区存在焊料有助于在流道之间和打印头之间维持一致的驱动特性。非常薄的焊料掩模层例如氧化物,可以非常小地改变致动器特性。该掩模材料趋于导致至少某些类型的熔化焊料流动离开氧化物,而流向例如金属的可湿润材料。与无焊料掩模控制熔化焊料相比,控制焊料掩模的尺寸和位置更为容易。由添加焊料掩模引起的致动器性能的任何变化都可以得到一致地控制。控制焊料流动还可以防止打印头的电学短路。在附图和下述描述中陈述了本发明的一个或多个实施方案的细节。通过该描述和附图并根据权利要求,本发明的其他特征、目标和优点将变得显而易见。
附图说明
图1为具有压电致动器的打印头内的单个流道的侧视图。
图2为具有多个喷嘴的打印头的仰视图。
图3为具有致动器和电路的打印头流道的剖面视图。
图4为打印头流道的剖面视图,其中部分地形成致动器。
图5A和5B为具有焊料掩模的打印头的剖面视图。
图6为隔膜和致动器结构的平面视图。
图7为具有焊料掩模和焊料的打印头的剖面视图。
图8示出了具有接合到致动器的柔性电路的打印头。
各个图示中相同的参考符号表示相似的元件。
具体实施方式
本发明提供了当焊料熔化在致动器上时用于控制焊料的位置的技术。可以实施这些技术,从而控制用于将集成电路连接到例如喷墨打印头的微机电装置的致动器的焊料的流动。
参考图3,打印头100包括其中形成了多个流道108的基板105。单个流道108可包括进墨口142、上升部135、泵浦腔体120、下降部138和喷嘴130。压电致动器150由基板105支撑。致动器150可包括隔膜140,隔膜140密封泵浦腔体120。致动器150包括下电极160、压电层165和上电极170。电极160、170厚度约为2微米以下,例如约0.5微米。压电层165厚度约为1和25微米之间,例如厚度为约8至约18微米。电极160、170由例如金属的导电材料形成,该金属为例如铜、金、钨、锡、氧化铟锡(ITO)、钛、铂、镍、镍铬合金、或者金属的组合。可以将信号提供给电极160、170以电学激励致动器150。电极分隔172可以分隔上电极170和下电极160。
切口(kerf)176分隔各个致动器,并允许电极连接。第一切口(未示出)可以将一个流道上的致动器与相邻流道上的致动器分隔。致动器150内的第二致动器176可以分隔相邻的致动器。此外,第二切口176可以减小致动器尺寸,使得致动器仅位于各个相应流道的一部分上。这些切口可以减小致动器之间的串扰。
参考图4,在基板105上形成致动器,其中在基板105内形成了流道部件。致动器可以通过任何合适的方式形成。下面描述一种具体的方法。首先压电层165和下电极160可以提供到基板105的背侧。在一个实施例中,压电层165被随后将形成下电极160的金属金属化。压电层165可以由陶瓷胚片(green sheet)或者预先焙烧的压电材料形成。可以通过溅射沉积金属。用于沉积的金属可以包括铜、金、钨、锡、氧化铟锡(ITO)、钛、铂、镍、镍铬合金、或者两种以上这些金属的组合。例如采用粘合剂或者采用两种金属之间的共晶接合,将压电层165接合到基板上。在另一个实施例中,基板105被金属化,且通过例如物理气相沉积(PVD)、溶胶-凝胶涂敷、接合陶瓷胚片或者其他合适的沉积工艺,压电层165形成于金属层上。
切口176形成于压电层165内。可以通过切割、解理、锯切或者蚀刻而在压电层165内形成切口176。切口176可以延伸到下电极160以及压电层165内。压电层165例如可以通过真空沉积例如溅射而金属化,从而在压电层165上形成上电极170、下电极接触区域162和通孔123。顶部金属化可以被图案化以除去切口176内以及电极分隔172内的金属。
参照图5A,打印头100示有焊料掩模195。焊料掩模195形成于上电极170上,位于泵浦腔体120上的上电极170的第一区域194上。焊料掩模195的边缘可以延伸到第一区域194的边缘,或者延伸到第一区域194外。从一个流道到下一个流道,焊料掩模195的宽度保持一致以改进流道间的一致性。焊料掩模195可以具有介于约0.1至5微米之间的厚度,例如约为0.5微米。焊料掩模可以配置成覆盖更多或更少的上电极170。在一个实施例中,焊料掩模195配置成控制焊料在下电极接触区域162上的位置,如图5B所示。
为了形成焊料掩模195,例如通过等离子体增强化学气相沉积技术,在上电极170上沉积用于制作掩模的材料层。焊料掩模195可以由氧化物例如氧化硅形成。可光构图材料或光致抗蚀剂提供在焊料掩模材料的表面上。掩模设于与泵浦腔体120上的区域194相对应的光致抗蚀剂上。光致抗蚀剂被曝光并显影。例如通过干法蚀刻工艺,蚀刻光致抗蚀剂不再覆盖的区域中的焊料掩模材料。感应耦合等离子体反应离子蚀刻为可以用于蚀刻焊料掩模材料的暴露部分的蚀刻工艺的一个示例。在焊料掩模材料蚀刻之后,剩余材料基本上限制在位于泵浦腔体120上方的区域194。随后从上电极170除去剩余光致抗蚀剂。
参照图6,该平面视图示出了隔膜140的一部分,其具有上电极170、暴露的压电层165、下电极接触区域162、焊料掩模195和切口176。
参照图7,焊料190提供到上电极170。焊料190可被强迫通过掩模到达基板上。焊料190提供到上电极170以形成用于上电极170的电学接触。焊料192提供到下电极接触162区域内以形成与下电极160的电学接触。焊料包括导电材料,例如金属,包括锡和铅,可以加热到一温度使得该金属流动并与另一种导电材料例如上电极和下电极170、160形成电学接合。
参照图8,集成电路电学连接到上电极和下电极170、160,该集成电路例如为附着到柔性电路180的集成电路。柔性电路可包括电学连接到该集成电路的接触焊垫。该接触焊垫允许柔性电路电连接到上电极和下电极170、160。在一个实施例中,上电极接触焊垫提供驱动电压,而下电极焊垫电连接到接地。
柔性电路180和基板105经历一个热循环,例如约183℃,致使焊料流动。熔化的焊料与电极及接触焊垫都形成接合。电极因此通过接触焊垫而导电连接到集成电路。焊料掩模195防止熔化的焊料流到掩模195上,因为焊料掩模195不被焊料190湿润。当焊料返回到低于焊料流动温度时,焊料返回到固态形式。
在接合柔性电路之前在致动器上形成焊料掩模的优点在于,当焊料熔化时掩模可以控制焊料的位置。没有氧化物层时,焊料会在致动器上不受控制地散布。在致动器的某些部分,切割切口以电学隔离各层,例如上电极和下电极。在一个实施例中,焊料掩模可以提供在切口176内。如果焊料流动到应该电学隔离的焊料连接层的区域,则电学短路会出现。这些区域内的焊料掩模可以防止电极之间的短路,例如电极分隔172内。
焊料掩模可以形成于泵浦腔体上的致动器区域上以及不期望出现焊料的任何其他区域。例如氧化硅的氧化物可以选择用于焊料掩模,因为氧化物不会被熔化的焊料湿润。氧化物趋于稳定,且可以形成为非常薄的层并同时保持不湿润的特性。然而,其他材料,例如氮化物、聚酰亚胺或其他可图案化材料,可以备选地用于形成焊料掩模。
如前所述,施加焊料掩模防止焊料覆盖位于泵浦腔体上方的致动器区域。这维持了从一个致动器到下一个致动器的一致的焊料应用。一致的焊料应用有助于维持一致的致动器特性。位于泵浦腔体上方的致动器部分的质量可以保持为略小于致动器元件即电极、压电层和隔膜的质量。来自氧化物层的任何附加质量可以得到控制。相反,来自焊料的附加质量更难控制。增加有源区质量是不期望的,因为这会改变相关致动器的驱动特性。此外,为致动器添加焊料层提高了致动器的硬度,使得致动器更难弯曲。为各个致动器形成尺寸基本上一致的焊料掩模并防止焊料流到有源区上,这样的组合有助于打印头的致动器之间或者打印头之间的一致性。
已经描述了本发明的多个实施方式。然而,应该理解,在不背离本发明的精神和范围的情形下可以进行各种修正。例如,压电驱动器可以形成泵浦腔体的侧壁。焊料掩模可以提供到仅在压电层一侧上具有电极而不是在两侧上具有电极的致动器。本发明还可以应用于从微机电结构喷射除了墨以外的流体。备选地,本发明可以应用于需要将连接接合到集成电路的任何传感器微机电结构。当将任何元件焊接到微机电装置上时,上文所披露的技术可以用于控制焊料的布置。因此,其他实施方式也落在权利要求的范围内。
(按照条约第19条的修改)
1.一种致动器,包括:
第一电极;
支撑所述第一电极的包括压电材料的支撑基板;
形成于所述第一电极上的掩模,其中所述掩模毗邻所述第一电极的第一部分;以及
焊料材料,其中所述焊料材料由所述第一电极支撑并毗邻所述第一电极的第二部分,其中所述第一电极的第一部分不交叠所述第一电极的第二部分,且所述掩模包括基本上不会被熔化时的所述焊料材料湿润的材料。
2.权利要求1所述的致动器,其中:
所述掩模包括氧化物材料。
3.权利要求1所述的致动器,还包括:
第二电极,其中所述焊料材料将所述第一和第二电极电连接到集成电路。
4.权利要求1所述的致动器,还包括:
柔性电路,其中所述焊料材料将所述柔性电路电连接到所述第一电极。
5.权利要求1所述的致动器,其中:
当所述第二电极接合到装置时,所述第一部分对应于所述装置内腔体的位置。
6.权利要求1所述的致动器,其中:
所述掩模厚度为约0.1至约2微米。
7.权利要求6所述的致动器,其中:
所述掩模厚度约为0.5微米。
8.一种打印头,包括:
基板,其中形成有流道部件,所述流道部件包括泵浦腔体和喷嘴;以及
致动器,接合到所述基板,所述致动器包括:
压电层;
由所述压电层支撑的第一电极;
形成于所述第一电极上的掩模,其中所述掩模毗邻所述第一电极的第一部分,且所述第一电极的第一部分基本上位于所述泵浦腔体上方;以及
焊料材料,其中所述焊料材料由所述第一电极支撑并毗邻所述第一电极的第二部分,其中所述第一电极的第一部分不交叠所述第一电极的第二部分,且所述掩模包括基本上不会被熔化时的所述焊料材料湿润的材料。
9.权利要求8的打印头,还包括:
第二电极,其中所述基板较所述第一电极更靠近所述第二电极。
10.权利要求8的打印头,其中:
所述掩模厚度介于约0.1微米至约2微米之间。
11.权利要求10的打印头,其中:
所述掩模厚度约为0.5微米。
12.权利要求8的打印头,其中:
所述掩模包括氧化物。
13.一种形成微机电装置的方法,包括:
在基板顶面上形成致动器,所述致动器包括压电层和第一电极;
在所述第一电极上形成焊料掩模,使得所述第一电极的第一部分暴露于环境且所述第一电极的第二部分被所述焊料掩模覆盖;
在所述第一电极的第一部分将焊料施加到第一电极;
将柔性电路接触所述焊料;以及
加热所述焊料,使所述焊料将所述柔性电路电连接到所述第一电极,其中在所述焊料被加热时,所述焊料掩模防止所述焊料在所述第一部分上流动。
14.权利要求13的方法,其中:
形成焊料掩模包括涂敷一种基本上不会被熔化时的所述焊料湿润的材料。
15.权利要求13的方法,其中:
形成焊料掩模包括沉积氧化物。
16.权利要求15的方法,其中:
提供所述基板,其中所述基板包括泵浦腔体;以及
形成焊料掩模包括形成在等于或低于所述焊料的熔化温度时不会熔化且基本上位于所述泵浦腔体上方的焊料掩模,使得当所述焊料被加热时,所述焊料掩模防止所述焊料在所述泵浦腔体上流动。
17.权利要求16的方法,其中:
形成所述焊料掩模包括形成厚度介于约0.1至约2微米之间的焊料掩模。
18.权利要求17的方法,其中:
形成所述焊料掩模包括形成厚度约为0.5微米的焊料掩模。
Claims (19)
1.一种致动器,包括:
第一电极;
用于所述第一电极的支撑基板;
形成于所述第一电极上的掩模,其中所述掩模毗邻所述第一电极的第一部分;以及
焊料材料,其中所述焊料材料由所述第一电极支撑并毗邻所述第一电极的第二部分,其中所述第一电极的第一部分不交叠所述第一电极的第二部分,且所述掩模包括基本上不会被熔化时的所述焊料材料湿润的材料。
2.权利要求1所述的致动器,其中:
所述掩模包括氧化物材料。
3.权利要求1所述的致动器,还包括:
第二电极,其中所述焊料材料将所述第一和第二电极电连接到集成电路。
4.权利要求1所述的致动器,还包括:
柔性电路,其中所述焊料材料将所述柔性电路电连接到所述第一电极。
5.权利要求1所述的致动器,其中:
当所述第二电极接合到装置时,所述第一部分对应于所述装置内腔体的位置。
6.权利要求1所述的致动器,其中:
所述掩模厚度为约0.1至约2微米。
7.权利要求6所述的致动器,其中:
所述掩模厚度约为0.5微米。
8.权利要求1所述的致动器,其中:
所述支撑基板包括压电层。
9.一种打印头,包括:
基板,其中形成有流道部件,所述流道部件包括泵浦腔体和喷嘴;以及
致动器,接合到所述基板,所述致动器包括:
压电层;
由所述压电层支撑的第一电极;
形成于所述第一电极上的掩模,其中所述掩模毗邻所述第一电极的第一部分,且所述第一电极的第一部分基本上位于所述泵浦腔体上方;以及
焊料材料,其中所述焊料材料由所述第一电极支撑并毗邻所述第一电极的第二部分,其中所述第一电极的第一部分不交叠所述第一电极的第二部分,且所述掩模包括基本上不会被熔化时的所述焊料材料湿润的材料。
10.权利要求9的打印头,还包括:
第二电极,其中所述基板较所述第一电极更靠近所述第二电极。
11.权利要求9的打印头,其中:
所述掩模厚度介于约0.1微米至约2微米之间。
12.权利要求11的打印头,其中:
所述掩模厚度约为0.5微米。
13.权利要求9的打印头,其中:
所述掩模包括氧化物。
14.一种形成微机电装置的方法,包括:
在基板顶面上形成致动器,所述致动器包括压电层和第一电极;
在所述第一电极上形成焊料掩模,使得所述第一电极的第一部分暴露于环境且所述第一电极的第二部分被所述焊料掩模覆盖;
在所述第一电极的第一部分将焊料施加到第一电极;
将柔性电路接触所述焊料;以及
加热所述焊料,使所述焊料将所述柔性电路电连接到所述第一电极,其中在所述焊料被加热时,所述焊料掩模防止所述焊料在所述第一部分上流动。
15.权利要求14的方法,其中:
形成焊料掩模包括施加基本上不会被熔化时的所述焊料湿润的材料。
16.权利要求14的方法,其中:
形成焊料掩模包括沉积氧化物。
17.权利要求16的方法,其中:
提供所述基板,其中所述基板包括泵浦腔体;以及
形成焊料掩模包括形成在等于或低于所述焊料的熔化温度时不会熔化且基本上位于所述泵浦腔体上方的焊料掩模,使得当所述焊料被加热时,所述焊料掩模防止所述焊料在所述泵浦腔体上流动。
18.权利要求17的方法,其中:
形成所述焊料掩模包括形成厚度介于约0.1至约2微米之间的焊料掩模。
19.权利要求18的方法,其中:
形成所述焊料掩模包括形成厚度约为0.5微米的焊料掩模。
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US10/950,284 | 2004-09-23 | ||
US10/950,284 US7249826B2 (en) | 2004-09-23 | 2004-09-23 | Soldering a flexible circuit |
PCT/US2005/034181 WO2006034457A1 (en) | 2004-09-23 | 2005-09-22 | Soldering a flexible circuit |
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CN101066002B CN101066002B (zh) | 2012-01-04 |
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US (2) | US7249826B2 (zh) |
EP (1) | EP1808059A1 (zh) |
JP (1) | JP2008513221A (zh) |
KR (1) | KR101224045B1 (zh) |
CN (1) | CN101066002B (zh) |
WO (1) | WO2006034457A1 (zh) |
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CN111216452A (zh) * | 2018-11-27 | 2020-06-02 | 西安增材制造国家研究院有限公司 | 一种压电式mems喷墨打印头及制作方法 |
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KR100968850B1 (ko) * | 2007-01-29 | 2010-07-09 | (주)울텍 | 마이크로 인젝팅 디바이스 |
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JP4994968B2 (ja) * | 2007-06-21 | 2012-08-08 | キヤノン株式会社 | インクジェットプリントヘッドの製造方法 |
TW201034129A (en) * | 2009-03-11 | 2010-09-16 | High Conduction Scient Co Ltd | Frame-type copper- clad ceramic substrate and the manufacturing method thereof |
CN106000753A (zh) * | 2016-07-12 | 2016-10-12 | 佛山市科日压电器件有限公司 | 复合式雾化片及其应用的雾化器 |
CN109365205A (zh) * | 2018-12-13 | 2019-02-22 | 佛山市科日压电器件有限公司 | 新型超声雾化片及其应用的雾化装置 |
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CN111216452A (zh) * | 2018-11-27 | 2020-06-02 | 西安增材制造国家研究院有限公司 | 一种压电式mems喷墨打印头及制作方法 |
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CN101066002B (zh) | 2012-01-04 |
US7249826B2 (en) | 2007-07-31 |
US20080010820A1 (en) | 2008-01-17 |
KR20070057226A (ko) | 2007-06-04 |
US20060061630A1 (en) | 2006-03-23 |
US7681307B2 (en) | 2010-03-23 |
WO2006034457A1 (en) | 2006-03-30 |
EP1808059A1 (en) | 2007-07-18 |
WO2006034457B1 (en) | 2006-05-11 |
KR101224045B1 (ko) | 2013-01-18 |
JP2008513221A (ja) | 2008-05-01 |
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