CN101052670A - 适合用于透明叠层材料的热塑性树脂组合物 - Google Patents
适合用于透明叠层材料的热塑性树脂组合物 Download PDFInfo
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- CN101052670A CN101052670A CNA2005800376235A CN200580037623A CN101052670A CN 101052670 A CN101052670 A CN 101052670A CN A2005800376235 A CNA2005800376235 A CN A2005800376235A CN 200580037623 A CN200580037623 A CN 200580037623A CN 101052670 A CN101052670 A CN 101052670A
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- B32B17/1099—After-treatment of the layered product, e.g. cooling
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/44—Preparation of metal salts or ammonium salts
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- C—CHEMISTRY; METALLURGY
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/04—Homopolymers or copolymers of ethene
- C08J2323/08—Copolymers of ethene
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/31678—Of metal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Landscapes
- Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Joining Of Glass To Other Materials (AREA)
- Laminated Bodies (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
实施例 | 基础树脂的MI(熔体指数) | 共聚物中的酸,重量% | 90°剥离强度(磅/英寸) | 中和% | 浊度 | ||
20min | 60min | 120min | |||||
C1 | 29.1 | 21.5 | ND1 | 14.1 | 2.42 | 2.83 | 4.96 |
C2 | 29.1 | 21.5 | 27.8 | 17.1 | 2.42 | 2.50 | 3.82 |
C3 | 29.1 | 21.5 | 26.1 | 17.9 | 2.28 | 2.54 | 3.56 |
1 | 29.1 | 21.5 | 17.0 | 22.1 | 1.88 | 2.18 | 3.07 |
2 | 29.1 | 21.5 | 2.4 | 22.4 | 1.78 | 2.01 | 2.98 |
3 | 29.1 | 21.5 | 11 | 24 | 1.28 | 1.50 | 2.96 |
4 | 29.1 | 21.5 | 14.7 | 28.7 | 1.33 | 1.48 | 2.85 |
5 | 29.1 | 21.5 | 11.1 | 28.9 | 1.08 | 1.01 | 1.87 |
6 | 29.1 | 21.5 | 11.4 | 31.1 | 1.03 | 0.89 | 1.19 |
7 | 29.1 | 21.5 | 12.0 | 32.5 | 0.74 | 0.74 | 1.09 |
8 | 29.1 | 21.5 | 4.6 | 34.5 | 0.80 | 0.79 | 0.81 |
C4 | 60 | 21.5 | 18.4 | 24.8 | 4.02 | 4.73 | 6.18 |
C5 | 60 | 21.5 | 6.5 | 26 | 4.10 | 4.71 | 6.18 |
C6 | 60 | 21.5 | 8.7 | 28.7 | 3.52 | 3.55 | 4.67 |
C7 | 60 | 21.5 | 9.4 | 30.3 | 2.75 | 3.13 | 4.26 |
9 | 60 | 21.5 | 8.0 | 32.8 | 2.08 | 2.19 | 2.98 |
10 | 60 | 21.5 | 7.2 | 35.3 | 1.76 | 1.72 | 2.28 |
11 | 60 | 21.5 | 9.6 | 37.3 | 1.27 | 1.19 | 1.63 |
12 | 60 | 21.5 | 5.2 | 39.7 | 1.22 | 1.19 | 1.48 |
13 | 60 | 21.5 | 4.8 | 41.1 | 1.62 | 1.04 | 1.56 |
14 | 60 | 21.5 | 4.7 | 43.8 | 1.01 | 0.99 | 1.08 |
C9 | 60 | 21.5 | 3.9 | 47.5 | 0.90 | 0.92 | 1.04 |
C10 | 60 | 19 | 5.7 | 37 | 1.57 | 1.64 | 4.76 |
C11 | 60 | 19 | 6.5 | 36.8 | 1.08 | 1.16 | 3.38 |
C12 | 60 | 19 | 37 | 1.02 | 1.35 | 3.98 |
实施例 | Wt%酸 | 水分(wt%) | 层压温度(℃) | 180°剥离强度(lb/inch) |
C10 | 19 | 0.066 | 105 | 2.7 |
15 | 21.5 | 0.054 | 105 | 19.3 |
16 | 21.5 | 0.494 | 105 | 9 |
17 | 21.5 | 0.054 | 135 | 22.6 |
C10 | 19 | 0.066 | 135 | 3.5 |
C11 | 19 | 0.407 | 135 | <0.3 |
实施例 | 基础树脂的熔体指数(g/10min) | 共聚物中的酸,wt% | 中和% | 90°剥离强度(lb/inch) | 拉力冲击能量,kJ/m2 |
C1 | 29.1 | 21.5 | 14.1 | 50.0 | 347 |
C2 | 29.1 | 21.5 | 17.1 | - | 418 |
C3 | 29.1 | 21.5 | 17.9 | 45.3 | 404 |
1 | 29.1 | 21.5 | 22.1 | 38.3 | 398 |
2 | 29.1 | 21.5 | 22.4 | 46.7 | 374 |
3 | 29.1 | 21.5 | 24 | 23.9 | 452 |
4 | 29.1 | 21.5 | 28.7 | 18.1 | 479 |
5 | 29.1 | 21.5 | 28.9 | 26.1 | 511 |
6 | 29.1 | 21.5 | 31.1 | 19.2 | 517 |
7 | 29.1 | 21.5 | 32.5 | 28.8 | 548 |
8 | 29.1 | 21.5 | 34.5 | 20.3 | 672 |
C4 | 60 | 21.5 | 24.8 | 18.6 | - |
C5 | 60 | 21.5 | 26 | 7.1 | 380 |
C6 | 60 | 21.5 | 28.7 | 21.5 | 418 |
C7 | 60 | 21.5 | 30.3 | 15.5 | 413 |
9 | 60 | 21.5 | 32.8 | 15.8 | 438 |
10 | 60 | 21.5 | 35.3 | 8.4 | 532 |
11 | 60 | 21.5 | 37.3 | 5.4 | 455 |
12 | 60 | 21.5 | 39.7 | 5 | 543 |
C4 | 60 | 21.5 | 41.1 | 5.3 | 520 |
C5 | 60 | 21.5 | 43.8 | 4.1 | 505 |
C6 | 60 | 21.5 | 47.5 | 3.1 | - |
C7 | 60 | 19 | 37 | 6.2 | 323 |
C8 | 60 | 19 | 36.8 | 9.1 | 488 |
C9 | 60 | 19 | 37 | 9.7 | - |
穿透能 | ||||
试样# | 酸% | 基础树脂的熔体指数 | 总和% | (J) |
1 | 19.0 | 60.0 | 37.0 | 304 |
2 | 21.5 | 29.1 | 24.0 | 324 |
3 | 21.5 | 29.1 | 28.7 | 332 |
4 | 21.5 | 29.1 | 28.9 | 313 |
玻璃损失(g) | ||||
试样# | 酸% | 基础树脂的熔体指数 | 中和% | |
1 | 19.0 | 60.0 | 37.0 | 64 |
2 | 21.5 | 29.1 | 24.0 | 27 |
3 | 21.5 | 29.1 | 28.7 | 36 |
4 | 21.5 | 29.1 | 28.9 | 27 |
表A | ||
空气压力循环数 | 压力计划* | 压力范围[磅/英尺2(帕)]例如,70磅/英尺2(3352帕) |
正压(朝内作用) | ||
3,500 | 0.2P to 0.5P | 14 to 35(672-1680帕) |
300 | 0.0P to 0.6P | 0 to 42(0-2016帕) |
600 | 0.5P to 0.8P | 35 to 56(1680-2688帕) |
100 | 0.3P to 1.0P | 21 to 70(1008-3360帕) |
负压(朝外作用) | ||
50 | -0.3P to-1.0P | -21 to-70(-1008 to-3360帕) |
1,060 | -0.5P to-0.8P | -35 to-56(-1680 to-2688帕) |
50 | 0.0P to-0.6P | -0 to-42(0 to-2016帕) |
3,350 | -0.2P to-0.5P | -14 to-35(-672 to-1680帕) |
夹层类型 | 层压的离聚物树脂冲击撕裂长度(cm)速度(英尺/秒) | |||
50英尺/秒 | 55英尺/秒 | 60英尺/秒 | 65英尺/秒 | |
离聚物“A”基础树脂熔体指数60共聚物中的酸19%37%中和 | 0 | 12.1 | 15.3 | 29.8 |
离聚物“B”基础树脂熔体指数30共聚物中的酸21.5%32%中和 | 0 | 0 | 10.2 | 27.3 |
叠层材料样品为77.2cm×121.9cm,夹层厚度:2.28mm |
正压,向内作用 | 负压,向外作用 | |||||
压力(磅/英尺2) | 循环 | 结果 | 压力(磅/英尺2) | 循环 | 结果 | |
离聚物“A” | 100 | 4500 | 合格 | 100 | <18 | 不合格 |
离聚物“B” | 100 | 4500 | 合格 | 100 | 4500 | 合格 |
离聚物“B” | 100 | 4500 | 合格 | 125 | 4500 | 合格 |
层压样品为1.52m×2.44mw/两片与2.28mm离聚物夹层层压在一起的6mm“热-强化玻璃”,使用硅酮密封剂和26mm的玻璃与框的重叠将其安装到“商业铝框系统”中。 |
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US60/623,479 | 2004-10-29 | ||
PCT/US2005/039328 WO2006057771A2 (en) | 2004-10-29 | 2005-10-31 | Thermoplastic resin compositions suitable for use in transparent laminates |
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CN102169849A (zh) * | 2009-12-25 | 2011-08-31 | 日东电工株式会社 | 芯片保持用胶带、其制造方法及使用它制造半导体装置的方法、及芯片状工件的保持方法 |
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CN101052670B (zh) | 2010-06-16 |
EP2374837B1 (en) | 2016-07-20 |
AU2005309953A1 (en) | 2006-06-01 |
WO2006057771A2 (en) | 2006-06-01 |
ES2596882T3 (es) | 2017-01-12 |
AU2005309953B2 (en) | 2011-06-02 |
US7951865B1 (en) | 2011-05-31 |
US7763360B2 (en) | 2010-07-27 |
JP5252923B2 (ja) | 2013-07-31 |
EP2374837A1 (en) | 2011-10-12 |
EP1805249A2 (en) | 2007-07-11 |
ES2363783T3 (es) | 2011-08-16 |
JP2008519104A (ja) | 2008-06-05 |
WO2006057771A3 (en) | 2006-08-24 |
US20060182983A1 (en) | 2006-08-17 |
EP1805249B1 (en) | 2011-04-20 |
ATE506394T1 (de) | 2011-05-15 |
DE602005027590D1 (de) | 2011-06-01 |
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