CN100586250C - Method for processing step ladder PCB plate - Google Patents
Method for processing step ladder PCB plate Download PDFInfo
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- CN100586250C CN100586250C CN 200810142379 CN200810142379A CN100586250C CN 100586250 C CN100586250 C CN 100586250C CN 200810142379 CN200810142379 CN 200810142379 CN 200810142379 A CN200810142379 A CN 200810142379A CN 100586250 C CN100586250 C CN 100586250C
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Abstract
The invention relates to a method for processing a ladder PCB plate, which includes the following steps: an inner layer core plate is provided; prepregs are provided; a ladder groove is arranged at the prepregs correspondingly with the inner layer core plate and the two prepregs are attached to the two sides of the inner layer core plate; corresponding silicon rubber slices are placed in the ladder groove of the prepregs; steel sheets are positioned at the external sides of the two prepregs and are pressed by a pressing machine which carries out the gummosis and molding to the prepregs; the silicon rubber slices are taken out of the ladder groove. The method for processing the ladder PCB plate fills the silicon rubber slices in the ladder groove of the prepregs to barrier the gummosis and ensures that the gummosis amount is stable, controllable and meets the design requirement of customers; in addition, the silicon rubber slices can be easily taken out without sticking to the bottom of the groove, are simple and effective and are convenient and suitable for processing the ladder PCB plate.
Description
Technical field
The present invention relates to printed circuit board and make the field, relate in particular to the processing method of a stepped PCB board.
Background technology
In the manufacturing process of step ladder PCB plate, step trough bit stream glue instability, inhomogeneous, do not meet the terminal client designing requirement and influence and mount components and parts.
For solving the problems of the technologies described above, existing process using supplies stop, flow to bottom land and can not take out the problem that this stops auxiliary material by the slit yet gummosis occurs.
Summary of the invention
The object of the present invention is to provide the processing method of a stepped PCB board, adopt the silica gel sheet to be filled in the step trough gummosis is stopped, guarantee that the gummosis amount is stable, controlled, can take out easily again simultaneously, not sticking bottom land.
For achieving the above object, the invention provides the processing method of a stepped PCB board, may further comprise the steps:
Step 1: core material is provided;
Step 2: prepreg is provided, and prepreg is offered step trough corresponding to core material, and two prepregs is attached at the two sides of core material;
Step 3: in the step trough of prepreg, place corresponding silica gel sheet;
Step 4: the arranged outside steel disc at two prepregs, carry out pressing by the pressing machine, prepreg gummosis, moulding;
Step 5: take out the silica gel sheet in the step trough.
Beneficial effect of the present invention: adopt the silica gel sheet to be filled in the step trough of prepreg gummosis is stopped, guarantee that the gummosis amount is stable, controlled, meet client's designing requirement; Can take out easily again simultaneously, not sticking bottom land simply effectively and conveniently is applicable to the processing step ladder PCB plate.
In order further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet appended graphic only provide with reference to and the explanation usefulness, be not to be used for the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing,, will make technical scheme of the present invention and other beneficial effects apparent by the specific embodiment of the present invention is described in detail.
In the accompanying drawing,
Fig. 1 is the flow chart of the processing method of step ladder PCB plate of the present invention;
Fig. 2 is the schematic diagram of prepreg and silica gel sheet;
Embodiment
Describe the present invention below in conjunction with accompanying drawing.
Shown in Fig. 1-2, the processing method of step ladder PCB plate of the present invention comprises the steps:
Step 1: core material is provided; Can adopt general core material.
Step 2: prepreg is provided, and prepreg is offered step trough corresponding to core material, and two prepregs is attached at the two sides of core material; Consult Fig. 2, in this step, described prepreg 6 is offered step trough 61 according to step ladder PCB plate drawing and suitable precompensation, and prepreg is the prepreg of lazy flow, selects suitable prepreg to guarantee the gummosis amount of step trough position.
Step 3: in the step trough of prepreg, place corresponding silica gel sheet; Consult Fig. 2, in this step, described silica gel sheet 7 is selected according to the shape and the specification of step trough, and silica gel sheet 7 is a filled-type silica gel sheet, and can leave certain surplus between the step trough 61.Described silica gel sheet is high temperature resistant more than 220 ℃ of * 3H.
Step 4: the arranged outside steel disc at two prepregs, carry out pressing by the pressing machine, prepreg gummosis, moulding; Process for pressing can pass through existing techniques in realizing, and in the pressing process, the elastic reaction that utilizes the silica gel sheet makes the gummosis of step trough position be stopped by the silica gel sheet and be controlled.
Step 5: the interior silica gel sheet of step trough that takes out step ladder PCB plate.Because the silica gel sheet is not molten mutually with prepreg, therefore, the not sticking bottom land of silica gel sheet can take out easily.
In sum, the processing method of step ladder PCB plate of the present invention adopts the silica gel sheet to be filled in the step trough of prepreg gummosis to be stopped, guarantee that the gummosis amount is stable, controlled, meet client's designing requirement; Can take out easily again simultaneously, not sticking bottom land simply effectively and conveniently is applicable to the processing step ladder PCB plate.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of accompanying Claim of the present invention.
Claims (3)
1, the processing method of a stepped PCB board is characterized in that, may further comprise the steps:
Step 1: core material is provided;
Step 2: prepreg is provided, and prepreg is offered step trough corresponding to core material, and two prepregs is attached at the two sides of core material;
Step 3: in the step trough of prepreg, place corresponding silica gel sheet;
Step 4: the arranged outside steel disc at two prepregs, carry out pressing by the pressing machine, prepreg gummosis, moulding;
Step 5: take out the silica gel sheet in the step trough.
2, the processing method of step ladder PCB plate as claimed in claim 1 is characterized in that, described silica gel sheet is a filled-type silica gel sheet, and described prepreg is the prepreg of lazy flow.
3, the processing method of step ladder PCB plate as claimed in claim 1 is characterized in that, described silica gel sheet is high temperature resistant 220 ℃ reach more than the 3H.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810142379 CN100586250C (en) | 2008-08-15 | 2008-08-15 | Method for processing step ladder PCB plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810142379 CN100586250C (en) | 2008-08-15 | 2008-08-15 | Method for processing step ladder PCB plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101351078A CN101351078A (en) | 2009-01-21 |
| CN100586250C true CN100586250C (en) | 2010-01-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810142379 Active CN100586250C (en) | 2008-08-15 | 2008-08-15 | Method for processing step ladder PCB plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100586250C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102365005A (en) * | 2011-10-20 | 2012-02-29 | 深圳市五株电路板有限公司 | Printed circuit board (PCB) processing method |
| CN102365006A (en) * | 2011-10-20 | 2012-02-29 | 深圳市五株电路板有限公司 | Processing method of multi-layer circuit board |
Families Citing this family (12)
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| CN101712224B (en) * | 2009-10-26 | 2012-10-10 | 广东生益科技股份有限公司 | Method for manufacturing cover clad laminate preventing resin from flowing during pressing process |
| CN103068150B (en) * | 2011-10-19 | 2015-07-01 | 上海嘉捷通信息科技有限公司 | Novel ladder microwave plate |
| CN103140058B (en) * | 2011-11-23 | 2016-04-13 | 无锡江南计算技术研究所 | The excessive glue control method of laminar structure |
| CN104254206B (en) * | 2013-06-28 | 2017-08-04 | 深南电路股份有限公司 | Processing method with step groove printed circuit board (PCB) |
| CN103779242B (en) * | 2014-02-18 | 2017-02-08 | 无锡江南计算技术研究所 | Glue control method of step package substrate |
| CN104661427B (en) * | 2015-02-15 | 2018-09-21 | 华为技术有限公司 | Printed circuit board and board, printed circuit board manufacturing method |
| CN105120596B (en) * | 2015-09-17 | 2018-11-13 | 深圳市迅捷兴科技股份有限公司 | Ladder form drag glue laminated closes structure and ladder form drag glue laminated closes method |
| CN107205314A (en) * | 2016-03-17 | 2017-09-26 | 上海嘉捷通电路科技股份有限公司 | A kind of ladder golden finger PCB and preparation method thereof |
| CN106304696B (en) * | 2016-08-11 | 2019-03-08 | 广州杰赛科技股份有限公司 | Has the printed wiring board and preparation method thereof that multilayer intersects blind slot |
| CN106973526A (en) * | 2017-05-09 | 2017-07-21 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
| CN108990319B (en) * | 2018-08-01 | 2023-12-05 | 广州美维电子有限公司 | Stepped plate pressing and stacking structure and manufacturing method thereof |
| CN114501861A (en) * | 2022-01-19 | 2022-05-13 | 昆山沪利微电有限公司 | Prepreg tape-out control method |
-
2008
- 2008-08-15 CN CN 200810142379 patent/CN100586250C/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102365005A (en) * | 2011-10-20 | 2012-02-29 | 深圳市五株电路板有限公司 | Printed circuit board (PCB) processing method |
| CN102365006A (en) * | 2011-10-20 | 2012-02-29 | 深圳市五株电路板有限公司 | Processing method of multi-layer circuit board |
| CN102365006B (en) * | 2011-10-20 | 2013-03-27 | 深圳市五株科技股份有限公司 | Processing method of multi-layer circuit board |
| CN102365005B (en) * | 2011-10-20 | 2013-03-27 | 深圳市五株科技股份有限公司 | Printed circuit board (PCB) processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101351078A (en) | 2009-01-21 |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523000 Dongcheng District (Dongguan) science and Technology Industrial Park, Guangdong, China Patentee before: Dongguan Shengyi Electronics Ltd. |