CN202878772U - PC (polycarbonate) composite board for mobile phone - Google Patents

PC (polycarbonate) composite board for mobile phone Download PDF

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Publication number
CN202878772U
CN202878772U CN 201220593966 CN201220593966U CN202878772U CN 202878772 U CN202878772 U CN 202878772U CN 201220593966 CN201220593966 CN 201220593966 CN 201220593966 U CN201220593966 U CN 201220593966U CN 202878772 U CN202878772 U CN 202878772U
Authority
CN
China
Prior art keywords
plate
mobile phone
layers
die cavity
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220593966
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Chinese (zh)
Inventor
黎文坚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Integrated Industry (kunshan) Co Ltd
Original Assignee
Integrated Industry (kunshan) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integrated Industry (kunshan) Co Ltd filed Critical Integrated Industry (kunshan) Co Ltd
Priority to CN 201220593966 priority Critical patent/CN202878772U/en
Application granted granted Critical
Publication of CN202878772U publication Critical patent/CN202878772U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a PC (polycarbonate) composite board for a mobile phone. A basal body of the composite board is a PC board, a mold cavity which is depressed in one surface is integrally formed on the surface of the PC board, film-coated layers are sputtered on the surface of the PC board and the inner side wall of the mold cavity, the film-coated layer positioned on the surface of the PC board is in smooth transition connection with the film-coated layer positioned on the inner side wall of the mold cavity, thin film layers are additionally sputtered on the film-coated layers, and transparent printing ink protective layers are printed on the thin film layers, wherein the film-coated layers can enhance the adhesion force of the thin film layers with the PC board, and the transparent printing ink protective layers can reduce the damages to the thin film layers caused by an environment and further ensure the quality of plated films.

Description

Mobile phone PC composite plate
Technical field
The utility model relates to PC composite plate technical field of vacuum plating, and a kind of mobile phone PC composite plate specifically is provided.
Background technology
The protection screen of mobile phone, panel computer etc. mostly adopts the PC sheet material of anti-finger line in the market, but PC sheet material is because himself attribute, and the film that is plated in above it can be easy to peel off, thereby quality and the aesthetics of using product caused certain damage.
Summary of the invention
In order to overcome defects, the utility model provides a kind of mobile phone PC composite plate, and the coating quality of this PC composite plate is good.
The utility model for the technical scheme that solves its technical problem and adopt is: a kind of mobile phone PC composite plate; the matrix of this composite plate is the PC plate; be formed with one on a surface of described PC plate and be depressed in this surperficial die cavity; and on the madial wall of this surface of described PC plate and described die cavity all sputter film layer is arranged; and being positioned at this lip-deep film layer of described PC plate is connected smoothly with the film layer that is positioned on the described die cavity madial wall; sputter has thin layer on described film layer in addition, is printed with the transparent ink protective layer at described thin layer.
As further improvement of the utility model, described PC plate should the surface non-die cavity zone and described film layer between also be printed with ink lay.
As further improvement of the utility model, be provided with laser pattern at the thin layer of described die cavity madial wall engraving.
As further improvement of the utility model, described film layer is the cured coating film of UV light curing agent through being polymerized.
The beneficial effects of the utility model are: the matrix of this composite plate is the PC plate, and be formed with one on a surface of described matrix and be depressed in this surperficial die cavity, in addition on the madial wall of this surface of described PC plate and described die cavity all sputter film layer is arranged, sputter has thin layer on described film layer, is printed with the transparent ink protective layer at described thin layer; Wherein, film layer can the enhanced film layer and the adhesive force of PC plate, and the transparent ink protective layer can reduce environment for use to the damage of thin layer, thereby has guaranteed the quality of plated film.
Description of drawings
Fig. 1 is the profile of PC composite plate described in the utility model.
By reference to the accompanying drawings, make the following instructions:
1---PC plate 10---die cavity
2---ink lay 3---film layer
4---thin layer 5---transparent ink protective layer
The specific embodiment
Describe embodiment of the present utility model in detail below in conjunction with accompanying drawing 1.A kind of mobile phone PC composite plate provided by the utility model; the matrix of this composite plate is PC plate 1; be formed with one on a surface of described PC plate and be depressed in this surperficial die cavity 10; and on the madial wall of this surface of described PC plate and described die cavity all sputter film layer 3 is arranged; and being positioned at this lip-deep film layer of described PC plate is connected smoothly with the film layer that is positioned on the described die cavity madial wall; sputter has thin layer 4 on described film layer 3 in addition, is printed with transparent ink protective layer 5 at described thin layer 4.
In the present embodiment, described PC plate should the surface non-die cavity zone and described film layer 3 between also be printed with ink lay 2; Thin layer engraving at described die cavity madial wall is provided with laser pattern.
In the present embodiment, described film layer is the cured coating film of UV light curing agent through being polymerized.
In the utility model, described mobile phone includes following steps with the preparation technology of PC composite plate in addition:
A) choose the PC plate of suitable dimension size, the thickness of described PC plate is 1mm~3mm, and is printed with ink lay 2 on a surface of described PC plate;
B) carry out milling on this surface of the above-mentioned PC plate that prints, mill out one and be depressed in this surperficial die cavity 10;
C) utilize High Rotation Speed sputter spray equipment the UV curing agent to be sprayed on the madial wall of this surface of described PC plate and described die cavity, wherein, by weight, the prescription of described UV curing agent is: epoxy acrylate 30wt%~50wt%, simple function 40wt%~60wt%, light trigger 1wt%~10wt%;
D) to step c) in this surface of PC plate and the madial wall of described die cavity carry out light-wave irradiation, make the UV curing agent on it aggregate into insoluble molten cured coating film, wherein, optical wavelength is 100nm~400nm, light energy is 200mj/cm 2~400mj/cm 2
E) with steps d) in the PC plate be placed on the anode of sputter coating machine, negative electrode adopts chromium target, will be evacuated to high vacuum state in the sputter coating machine first, vacuum is 4 * 10 -7MBar~4 * 10 -6MBar is filled with argon gas again, and adds 3000V between negative electrode and anode~5000V voltage, makes that sputter has a thin layer on the described film layer;
F) utilize laser machine to carve laser pattern at the thin layer of described die cavity madial wall, the radium-shine wavelength of this laser machine is 1064nm~2000nm;
G) to step e) and f) in thin layer and laser pattern on be printed with the transparent ink protective layer.Mobile phone described in the utility model can prepare with the PC composite plate to be finished.

Claims (4)

1. mobile phone PC composite plate; the matrix of this composite plate is PC plate (1); it is characterized in that: be formed with one on a surface of described PC plate and be depressed in this surperficial die cavity (10); and on the madial wall of this surface of described PC plate and described die cavity all sputter film layer (3) is arranged; and being positioned at this lip-deep film layer of described PC plate is connected smoothly with the film layer that is positioned on the described die cavity madial wall; at the upper sputter of described film layer (3) thin layer (4) is arranged in addition, be printed with transparent ink protective layer (5) at described thin layer (4).
2. mobile phone according to claim 1 PC composite plate is characterized in that: described PC plate should the surface non-die cavity zone and described film layer (3) between also be printed with ink lay (2).
3. mobile phone according to claim 1 PC composite plate is characterized in that: carve at the thin layer of described die cavity madial wall and be provided with laser pattern.
4. mobile phone according to claim 1 PC composite plate, it is characterized in that: described film layer is the cured coating film of UV light curing agent through being polymerized.
CN 201220593966 2012-11-12 2012-11-12 PC (polycarbonate) composite board for mobile phone Expired - Fee Related CN202878772U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220593966 CN202878772U (en) 2012-11-12 2012-11-12 PC (polycarbonate) composite board for mobile phone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220593966 CN202878772U (en) 2012-11-12 2012-11-12 PC (polycarbonate) composite board for mobile phone

Publications (1)

Publication Number Publication Date
CN202878772U true CN202878772U (en) 2013-04-17

Family

ID=48070234

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220593966 Expired - Fee Related CN202878772U (en) 2012-11-12 2012-11-12 PC (polycarbonate) composite board for mobile phone

Country Status (1)

Country Link
CN (1) CN202878772U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103738008A (en) * 2013-12-30 2014-04-23 东莞劲胜精密组件股份有限公司 Strengthened organic glass window for cellphone and manufacture method of window
CN104097369A (en) * 2014-06-05 2014-10-15 安徽物宝光电材料有限公司 Organic glass screen
US11624902B2 (en) 2017-11-24 2023-04-11 Hamamatsu Photonics K.K. Wafer inspection method and wafer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103738008A (en) * 2013-12-30 2014-04-23 东莞劲胜精密组件股份有限公司 Strengthened organic glass window for cellphone and manufacture method of window
CN103738008B (en) * 2013-12-30 2015-09-30 东莞劲胜精密组件股份有限公司 A kind of mobile phone strengthening lucite form and preparation method thereof
CN104097369A (en) * 2014-06-05 2014-10-15 安徽物宝光电材料有限公司 Organic glass screen
US11624902B2 (en) 2017-11-24 2023-04-11 Hamamatsu Photonics K.K. Wafer inspection method and wafer

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130417

Termination date: 20171112

CF01 Termination of patent right due to non-payment of annual fee