CN110337184A - A kind of mixed pressure processing method of high-frequency high-speed motherboard - Google Patents
A kind of mixed pressure processing method of high-frequency high-speed motherboard Download PDFInfo
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- CN110337184A CN110337184A CN201910356509.2A CN201910356509A CN110337184A CN 110337184 A CN110337184 A CN 110337184A CN 201910356509 A CN201910356509 A CN 201910356509A CN 110337184 A CN110337184 A CN 110337184A
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- 238000003672 processing method Methods 0.000 title claims abstract description 20
- 238000005553 drilling Methods 0.000 claims abstract description 65
- 238000003825 pressing Methods 0.000 claims abstract description 43
- 239000003292 glue Substances 0.000 claims abstract description 23
- 238000007747 plating Methods 0.000 claims abstract description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052737 gold Inorganic materials 0.000 claims abstract description 19
- 239000010931 gold Substances 0.000 claims abstract description 19
- 238000003466 welding Methods 0.000 claims abstract description 14
- 238000000465 moulding Methods 0.000 claims abstract description 12
- 238000007689 inspection Methods 0.000 claims abstract description 8
- 238000012546 transfer Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 122
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 48
- 239000011889 copper foil Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 239000010949 copper Substances 0.000 claims description 20
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 238000007711 solidification Methods 0.000 claims description 11
- 230000008023 solidification Effects 0.000 claims description 11
- 241001074085 Scophthalmus aquosus Species 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 230000003139 buffering effect Effects 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- 208000002193 Pain Diseases 0.000 claims description 7
- 230000003628 erosive effect Effects 0.000 claims description 7
- 238000007731 hot pressing Methods 0.000 claims description 7
- 239000012943 hotmelt Substances 0.000 claims description 7
- 230000003647 oxidation Effects 0.000 claims description 7
- 238000007254 oxidation reaction Methods 0.000 claims description 7
- 238000005554 pickling Methods 0.000 claims description 7
- 239000012286 potassium permanganate Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000007906 compression Methods 0.000 abstract description 4
- 238000005530 etching Methods 0.000 description 12
- 238000007654 immersion Methods 0.000 description 12
- 238000003475 lamination Methods 0.000 description 11
- 238000012545 processing Methods 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000009172 bursting Effects 0.000 description 6
- 238000012864 cross contamination Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000000428 dust Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000013021 overheating Methods 0.000 description 6
- 238000002203 pretreatment Methods 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 6
- 230000003068 static effect Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000003079 width control Methods 0.000 description 6
- 241000283725 Bos Species 0.000 description 2
- 240000000249 Morus alba Species 0.000 description 2
- 235000008708 Morus alba Nutrition 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 244000163122 Curcuma domestica Species 0.000 description 1
- 235000003392 Curcuma domestica Nutrition 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000003373 curcuma longa Nutrition 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 235000013976 turmeric Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a kind of mixed pressure processing method of high-frequency high-speed motherboard, characterized by comprising the following steps: sawing sheet → internal layer → internal layer AOI → pressing → drilling → remove glue → whole plate plating → outer graphics transfer → graphic plating → middle inspection → welding resistance → text → change gold → molding.The scale of mass production of the mixed-compression board of 10 layers of motherboard of high-frequency high-speed Megtron6 plate can be achieved in the present invention.
Description
Technical field
The invention belongs to wiring board processing technique fields, and in particular to a kind of 10 layers of host of high-frequency high-speed Megtron6 plate
The mixed pressure processing method of plate.
Background technique
Using compared with low-k and compared with the high frequency plate of low dielectric loss in printed circuit board, high frequency height can satisfy
In printed circuit board, using partial hybrid high frequency material technology, high-frequency high-speed signal may be implemented in the demand for development of fast signal
Transmission requirement, and the processing cost of printed circuit board can be reduced.
But in the prior art, the difficulty of processing of high-frequency high-speed motherboard is big, cannot achieve large-scale volume production, especially
It is to lack the knowhow of the mixed-compression board of 10 layers of motherboard of high-frequency high-speed Megtron6 plate.In the high-frequency high-speed of the prior art
In the 10 layers of motherboard production of Megtron6 plate, have the following problems: 1.Megtron6 plate AOI easily reports false point；
2.Megtron6 plate viscosity point is high, poor fluidity；3.Megtron6 slab interior contains some low one's share of expenses for a joint undertaking materials, before solidifying easily
Volatilization；Caused by 4.Megtron6 plate formula itself, hardness is big, and the abrasion of brill group is big, it is not easy to drill；5.Megtron6 plate exists
When doing golden watch surface treatment, it may appear that edge turmeric in the face great Jin is bad.
Summary of the invention
In view of this, the present invention provides a kind of mixed pressure processing and fabricating side of 10 layers of motherboard of high-frequency high-speed Megtron6 plate
Method, the present invention can improve above-mentioned technical problem, realize the big rule of the mixed-compression board of 10 layers of motherboard of high-frequency high-speed Megtron6 plate
Mould mass production.
The technical solution of the present invention is as follows: a kind of mixed pressure processing method of high-frequency high-speed motherboard, which is characterized in that packet
Include following steps: sawing sheet → internal layer → internal layer AOI → pressing → drilling → except glue → whole plate plating → outer graphics transfer → figure
Shape plating → middle inspection → welding resistance → text → change gold → molding.
Further, the high-frequency high-speed motherboard carries out sawing sheet using PP plate, when PP plate is cut, need to first clean table top,
Avoid PP cross contamination；The PP plate has to be sealed before and after use, < 8 hours under unlimited environment, temperature and humidity
Control condition :≤23 DEG C ,≤50%；
Further, it before the process for pressing, needs internal layer process treated that core plate carries out oxidation processes, pass through brownification mode
It is aoxidized, is toasted 1-2 hours at 110 DEG C -120 DEG C after brownification；It also needs to toast 3-4 at 130 DEG C -180 DEG C before brownification
Hour.
Further, after core plate brownification to start pressing plate time control in 12 hours, folded plate into press when
Between control in 2 hours.It when padded coaming is there are when moisture absorption risk, needs to carry out drying and processing to it, due to material property, hold
Easy static electrification when lamination, need to give special heed to adsorption of foreign matter on PP.
Further, in the sheeting process, vaccum pressing plate equipment is just used, heating rate is controlled in 3-3.5 DEG C/s, will be warm
Degree rises to 100 DEG C -170 DEG C, and the temperature for turning high pressure spot is 90-110 DEG C, and the pressure of high pressure is 420-480PSI, temperature when solidification
Control is at 180-250 DEG C, curing time 70-120min；The duration control vacuumized is in 30-50min, hot pressing material temperature < out
130℃。
Further, in the process for pressing, for the control of brownification microetch amount in 55-75u ", walkthrough uses+4 rivets of hot melt,
Copper foil uses normal copper foil when typesetting, and copper foil is inverted, i.e., smooth surface places 20 completely new oxen close to core plate, artificial lid copper foil up and down
Mulberry paper lamination, it is ensured that better plate thickness uniformity, middle layer add buffering paper.
Further, in the bore process, including laser drilling and through-hole drilling；The laser drilling technique is using straight
The mode of drilling is connect, to 8um hereinafter, compared to FR4 material, energy and rifle number increase outer layer copper thickness microetch.
Further, in the through-hole bore process, cover board uses LE aluminium flake, for≤1.0mm brill nozzle, selects completely new bore
Nozzle, drilling parameter selection reduce feed speed and withdrawing speed, and 11 folded, insert rack baking sheet 190 DEG C × 3 hours after drilling.
Further, described except in adhesive process, using+1 potassium permanganate of 1 plasma except glue, stinging erosion rate except glue is
0.3-0.6mg/cm2；In the immersion process, 150 DEG C baking 6-8 hours before change gold；In the interior layer process, pre-treatment microetch
In 17-35u ", exposure selects the operation on fully automatic exposure machine for amount control, confirms film harmomegathus and very poor, every life before upper machine
A film, glass platform must all be cleaned by producing 20PNL plate, and the replacement frequency of dust sticky paper is that every 20PNL is changed once, line width after etching
By intermediate value control on the upper side.
In the present invention, motherboard after the process for pressing, at 185 DEG C of Tg (DSC)/210 DEG C (TMA), through overheating
288 DEG C of tin furnaces are soaked in shock-testing, and 10 seconds/time, 6 times without white point without plate bursting, pulling force >=3.5Lb/in.
Further, in bore process, drilling parameter: thick copper sheet parameter, bores nozzle using completely new, bores the nozzle service life by 1/folded
Baking sheet is first cleaned again 180 DEG C/2 hours in 500 holes after drilling, it is desirable that and hole is thick≤1000u ", ailhead≤2 times.
Further, in the outer graphics shifting process, emphasis control contraposition precision is needed；The graphic plating technique
In, by 700u " copper facing, line width control is on the upper side in intermediate value after etching；In the welding resistance technique, it can not move back and wash；The immersion process
In, it microetch 80-100 seconds, activates 160-280 seconds, latter pickling 160-280 seconds, nickel slot MTO control produced within 2.0；It is described at
In type technique, using high TG parameter, 2/folded.
The beneficial effects of the present invention are:
1. selecting the scanning of laser light AOI machine, improve since material intrinsic colour whitens, the relatively obvious problem of weavy grain；
2. heating rate, which is controlled, increases buffering effect using completely new brown paper in 3-4 DEG C/min, high pressure >=400PSI, lamination,
It is appropriate to reduce the lamination number of plies, increase brown paper between plate and plate and buffer, is improved using the mode of PACOPADD due to material
The problem of Megtron6 plate viscosity point caused by material characteristic is high, poor fluidity；
3. pumpdown time control improves before Megtron6 plate solidifies easily in 30-50min and increasing frame mode when lamination
The problem of volatilization；
4. improving due to caused by material formula itself by modification drilling parameter and using LE aluminium flake, hardness is big, bores nozzle abrasion
Greatly, it is not easy to the problem of drilling；
5. increasing nickel slot circular flow by baking sheet 150 DEG C/6-8 hours before changing gold, increase the phosphorus content of liquid medicine in nickel slot, drop
The mode of low residual copper ratio is improved due to there is certain elements incompatible with nickel slot liquid medicine in Megtron6 plate, leads to heavy nickel not
It is good, so as to cause the face great Jin edge gold containing thick insufficient；
6. realizing the scale of mass production of the mixed-compression board of 10 layers of motherboard of high-frequency high-speed Megtron6 plate.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, below in conjunction with specific embodiment, to this
Invention is described in further detail.It should be understood that the specific embodiments described herein are only to explain this hair
It is bright, and the scope of protection of the present invention is not limited.
Embodiment 1
A kind of mixed pressure processing method of high-frequency high-speed motherboard, which comprises the following steps: sawing sheet → internal layer →
Internal layer AOI → pressing → drilling → remove glue → whole plate plating → outer graphics transfer → graphic plating → middle inspection → welding resistance → text
→ change gold → molding.
Further, the high-frequency high-speed motherboard carries out sawing sheet using PP plate, when PP plate is cut, need to first clean table top,
Avoid PP cross contamination；The PP plate has to be sealed before and after use, < 8 hours under unlimited environment, temperature and humidity
Control condition :≤23 DEG C ,≤50%；
Further, it before the process for pressing, needs internal layer process treated that core plate carries out oxidation processes, pass through brownification mode
It is aoxidized, is toasted 2 hours at 110 DEG C DEG C after brownification；It also needs to toast 4 hours at 130 DEG C DEG C before brownification.
Further, after core plate brownification to start pressing plate time control in 12 hours, folded plate into press when
Between control in 2 hours.It when padded coaming is there are when moisture absorption risk, needs to carry out drying and processing to it, due to material property, hold
Easy static electrification when lamination, need to give special heed to adsorption of foreign matter on PP.
Further, in the sheeting process, vaccum pressing plate equipment is just used, heating rate is controlled in 3 DEG C/s, by temperature liter
To 100 DEG C DEG C, the temperature for turning high pressure spot is 90 DEG C, and the pressure of high pressure is 420PSI, and temperature control is at 180 DEG C when solidification, solidification
Time is 120min；The duration control vacuumized is in 30min, 130 DEG C of hot pressing material temperature < out.
Further, in the process for pressing, the control of brownification microetch amount uses+4 rivets of hot melt, row in 55u ", walkthrough
Copper foil uses normal copper foil when version, and copper foil is inverted, i.e., smooth surface places 20 completely new ox-hides close to core plate, artificial lid copper foil up and down
Stacked paper sheet, it is ensured that better plate thickness uniformity, middle layer add buffering paper.
Further, in the bore process, including laser drilling and through-hole drilling；The laser drilling technique is using straight
The mode of drilling is connect, to 8um hereinafter, compared to FR4 material, energy and rifle number increase outer layer copper thickness microetch.
Further, in the through-hole bore process, cover board uses LE aluminium flake, for≤1.0mm brill nozzle, selects completely new bore
Nozzle, drilling parameter selection reduce feed speed and withdrawing speed, and 11 folded, insert rack baking sheet 190 DEG C × 3 hours after drilling.
Further, described except in adhesive process, using+1 potassium permanganate of 1 plasma except glue, stinging erosion rate except glue is
0.3mg/cm2；In the immersion process, toasted 6 hours for 150 DEG C before change gold；In the interior layer process, the control of pre-treatment microetch amount
In 17u ", exposure selects the operation on fully automatic exposure machine, confirms film harmomegathus and very poor, every production 20PNL plate before upper machine
A film, glass platform must be all cleaned, the replacement frequency of dust sticky paper is that every 20PNL is changed once, and line width is inclined by intermediate value after etching
Upper control.
In the present invention, motherboard after the process for pressing, at 185 DEG C of Tg (DSC)/210 DEG C (TMA), through overheating
288 DEG C of tin furnaces are soaked in shock-testing, and 10 seconds/time, 6 times without white point without plate bursting, pulling force >=3.5Lb/in.
Further, in bore process, drilling parameter: thick copper sheet parameter, bores nozzle using completely new, bores the nozzle service life by 1/folded
Baking sheet is first cleaned again 180 DEG C/2 hours in 500 holes after drilling, it is desirable that and hole is thick≤1000u ", ailhead≤2 times.
Further, in the outer graphics shifting process, emphasis control contraposition precision is needed；The graphic plating technique
In, by 700u " copper facing, line width control is on the upper side in intermediate value after etching；In the welding resistance technique, it can not move back and wash；The immersion process
In, it microetch 80 seconds, activates 160 seconds, rear pickling 160 seconds, nickel slot MTO control produces within 2.0；In the moulding process, make
With high TG parameter, 2/folded.
Embodiment 2
A kind of mixed pressure processing method of high-frequency high-speed motherboard, which comprises the following steps: sawing sheet → internal layer →
Internal layer AOI → pressing → drilling → remove glue → whole plate plating → outer graphics transfer → graphic plating → middle inspection → welding resistance → text
→ change gold → molding.
Further, the high-frequency high-speed motherboard carries out sawing sheet using PP plate, when PP plate is cut, need to first clean table top,
Avoid PP cross contamination；The PP plate has to be sealed before and after use, < 8 hours under unlimited environment, temperature and humidity
Control condition :≤23 DEG C ,≤50%；
Further, it before the process for pressing, needs internal layer process treated that core plate carries out oxidation processes, pass through brownification mode
It is aoxidized, is toasted 1 hour at 120 DEG C after brownification；It also needs to toast 3 hours at 180 DEG C before brownification.
Further, after core plate brownification to start pressing plate time control in 12 hours, folded plate into press when
Between control in 2 hours.It when padded coaming is there are when moisture absorption risk, needs to carry out drying and processing to it, due to material property, hold
Easy static electrification when lamination, need to give special heed to adsorption of foreign matter on PP.
Further, in the sheeting process, vaccum pressing plate equipment is just used, heating rate is controlled in 3.5 DEG C/s, by temperature
170 DEG C are risen to, the temperature for turning high pressure spot is 110 DEG C, and the pressure of high pressure is 480PSI, and temperature control is at 250 DEG C when solidification, solidification
Time is 70min；The duration control vacuumized is in 30min, 130 DEG C of hot pressing material temperature < out.
Further, in the process for pressing, the control of brownification microetch amount uses+4 rivets of hot melt, row in 75u ", walkthrough
Copper foil uses normal copper foil when version, and copper foil is inverted, i.e., smooth surface places 20 completely new ox-hides close to core plate, artificial lid copper foil up and down
Stacked paper sheet, it is ensured that better plate thickness uniformity, middle layer add buffering paper.
Further, in the bore process, including laser drilling and through-hole drilling；The laser drilling technique is using straight
The mode of drilling is connect, to 8um hereinafter, compared to FR4 material, energy and rifle number increase outer layer copper thickness microetch.
Further, in the through-hole bore process, cover board uses LE aluminium flake, for≤1.0mm brill nozzle, selects completely new bore
Nozzle, drilling parameter selection reduce feed speed and withdrawing speed, and 11 folded, insert rack baking sheet 190 DEG C × 3 hours after drilling.
Further, described except in adhesive process, using+1 potassium permanganate of 1 plasma except glue, stinging erosion rate except glue is
0.6mg/cm2；In the immersion process, toasted 8 hours for 150 DEG C before change gold；In the interior layer process, the control of pre-treatment microetch amount
In 35u ", exposure selects the operation on fully automatic exposure machine, confirms film harmomegathus and very poor, every production 20PNL plate before upper machine
A film, glass platform must be all cleaned, the replacement frequency of dust sticky paper is that every 20PNL is changed once, and line width is inclined by intermediate value after etching
Upper control.
In the present invention, motherboard after the process for pressing, at 185 DEG C of Tg (DSC)/210 DEG C (TMA), through overheating
288 DEG C of tin furnaces are soaked in shock-testing, and 10 seconds/time, 6 times without white point without plate bursting, pulling force >=3.5Lb/in.
Further, in bore process, drilling parameter: thick copper sheet parameter, bores nozzle using completely new, bores the nozzle service life by 1/folded
Baking sheet is first cleaned again 180 DEG C/2 hours in 500 holes after drilling, it is desirable that and hole is thick≤1000u ", ailhead≤2 times.
Further, in the outer graphics shifting process, emphasis control contraposition precision is needed；The graphic plating technique
In, by 700u " copper facing, line width control is on the upper side in intermediate value after etching；In the welding resistance technique, it can not move back and wash；The immersion process
In, it microetch 100 seconds, activates 280 seconds, rear pickling 280 seconds, nickel slot MTO control produces within 2.0；In the moulding process, make
With high TG parameter, 2/folded.
Embodiment 3
A kind of mixed pressure processing method of high-frequency high-speed motherboard, which comprises the following steps: sawing sheet → internal layer →
Internal layer AOI → pressing → drilling → remove glue → whole plate plating → outer graphics transfer → graphic plating → middle inspection → welding resistance → text
→ change gold → molding.
Further, the high-frequency high-speed motherboard carries out sawing sheet using PP plate, when PP plate is cut, need to first clean table top,
Avoid PP cross contamination；The PP plate has to be sealed before and after use, < 8 hours under unlimited environment, temperature and humidity
Control condition :≤23 DEG C ,≤50%；
Further, it before the process for pressing, needs internal layer process treated that core plate carries out oxidation processes, pass through brownification mode
It is aoxidized, is toasted 1.5 hours at 115 DEG C after brownification；It also needs to toast 3.5 hours at 150 DEG C before brownification.
Further, after core plate brownification to start pressing plate time control in 12 hours, folded plate into press when
Between control in 2 hours.It when padded coaming is there are when moisture absorption risk, needs to carry out drying and processing to it, due to material property, hold
Easy static electrification when lamination, need to give special heed to adsorption of foreign matter on PP.
Further, in the sheeting process, vaccum pressing plate equipment is just used, heating rate is controlled in 3.2 DEG C/s, by temperature
140 DEG C are risen to, the temperature for turning high pressure spot is 100 DEG C, and the pressure of high pressure is 450PSI, and temperature control is at 200 DEG C when solidification, solidification
Time is 100min；The duration control vacuumized is in 40min, 130 DEG C of hot pressing material temperature < out.
Further, in the process for pressing, the control of brownification microetch amount uses+4 rivets of hot melt, row in 65u ", walkthrough
Copper foil uses normal copper foil when version, and copper foil is inverted, i.e., smooth surface places 20 completely new ox-hides close to core plate, artificial lid copper foil up and down
Stacked paper sheet, it is ensured that better plate thickness uniformity, middle layer add buffering paper.
Further, in the bore process, including laser drilling and through-hole drilling；The laser drilling technique is using straight
The mode of drilling is connect, to 8um hereinafter, compared to FR4 material, energy and rifle number increase outer layer copper thickness microetch.
Further, in the through-hole bore process, cover board uses LE aluminium flake, for≤1.0mm brill nozzle, selects completely new bore
Nozzle, drilling parameter selection reduce feed speed and withdrawing speed, and 11 folded, insert rack baking sheet 190 DEG C × 3 hours after drilling.
Further, described except in adhesive process, using+1 potassium permanganate of 1 plasma except glue, stinging erosion rate except glue is
0.5mg/cm2；In the immersion process, toasted 7 hours for 150 DEG C before change gold；In the interior layer process, the control of pre-treatment microetch amount
In 26u ", exposure selects the operation on fully automatic exposure machine, confirms film harmomegathus and very poor, every production 20PNL plate before upper machine
A film, glass platform must be all cleaned, the replacement frequency of dust sticky paper is that every 20PNL is changed once, and line width is inclined by intermediate value after etching
Upper control.
In the present invention, motherboard after the process for pressing, at 185 DEG C of Tg (DSC)/210 DEG C (TMA), through overheating
288 DEG C of tin furnaces are soaked in shock-testing, and 10 seconds/time, 6 times without white point without plate bursting, pulling force >=3.5Lb/in.
Further, in bore process, drilling parameter: thick copper sheet parameter, bores nozzle using completely new, bores the nozzle service life by 1/folded
Baking sheet is first cleaned again 180 DEG C/2 hours in 500 holes after drilling, it is desirable that and hole is thick≤1000u ", ailhead≤2 times.
Further, in the outer graphics shifting process, emphasis control contraposition precision is needed；The graphic plating technique
In, by 700u " copper facing, line width control is on the upper side in intermediate value after etching；In the welding resistance technique, it can not move back and wash；The immersion process
In, it microetch 90 seconds, activates 200 seconds, rear pickling 200 seconds, nickel slot MTO control produces within 2.0；In the moulding process, make
With high TG parameter, 2/folded.
Embodiment 4
A kind of mixed pressure processing method of high-frequency high-speed motherboard, which comprises the following steps: sawing sheet → internal layer →
Internal layer AOI → pressing → drilling → remove glue → whole plate plating → outer graphics transfer → graphic plating → middle inspection → welding resistance → text
→ change gold → molding.
Further, the high-frequency high-speed motherboard carries out sawing sheet using PP plate, when PP plate is cut, need to first clean table top,
Avoid PP cross contamination；The PP plate has to be sealed before and after use, < 8 hours under unlimited environment, temperature and humidity
Control condition :≤23 DEG C ,≤50%；
Further, it before the process for pressing, needs internal layer process treated that core plate carries out oxidation processes, pass through brownification mode
It is aoxidized, is toasted 1.8 hours at 118 DEG C after brownification；It also needs to toast 3.8 hours at 170 DEG C before brownification.
Further, after core plate brownification to start pressing plate time control in 12 hours, folded plate into press when
Between control in 2 hours.It when padded coaming is there are when moisture absorption risk, needs to carry out drying and processing to it, due to material property, hold
Easy static electrification when lamination, need to give special heed to adsorption of foreign matter on PP.
Further, in the sheeting process, vaccum pressing plate equipment is just used, heating rate is controlled in 3.3 DEG C/s, by temperature
120 DEG C are risen to, the temperature for turning high pressure spot is 105 DEG C, and the pressure of high pressure is 440PSI, and temperature control is at 210 DEG C when solidification, solidification
Time is 90min；The duration control vacuumized is in 45min, 130 DEG C of hot pressing material temperature < out.
Further, in the process for pressing, the control of brownification microetch amount uses+4 rivets of hot melt, row in 70u ", walkthrough
Copper foil uses normal copper foil when version, and copper foil is inverted, i.e., smooth surface places 20 completely new ox-hides close to core plate, artificial lid copper foil up and down
Stacked paper sheet, it is ensured that better plate thickness uniformity, middle layer add buffering paper.
Further, in the bore process, including laser drilling and through-hole drilling；The laser drilling technique is using straight
The mode of drilling is connect, to 8um hereinafter, compared to FR4 material, energy and rifle number increase outer layer copper thickness microetch.
Further, in the through-hole bore process, cover board uses LE aluminium flake, for≤1.0mm brill nozzle, selects completely new bore
Nozzle, drilling parameter selection reduce feed speed and withdrawing speed, and 11 folded, insert rack baking sheet 190 DEG C × 3 hours after drilling.
Further, described except in adhesive process, using+1 potassium permanganate of 1 plasma except glue, stinging erosion rate except glue is
0.45mg/cm2；In the immersion process, toasted 7.5 hours for 150 DEG C before change gold；In the interior layer process, pre-treatment microetch amount
In 30u ", exposure selects the operation on fully automatic exposure machine for control, confirms film harmomegathus and very poor, every production before upper machine
20PNL plate must all clean a film, glass platform, and the replacement frequency of dust sticky paper is that every 20PNL is changed once, and line width is pressed after etching
Intermediate value control on the upper side.
In the present invention, motherboard after the process for pressing, at 185 DEG C of Tg (DSC)/210 DEG C (TMA), through overheating
288 DEG C of tin furnaces are soaked in shock-testing, and 10 seconds/time, 6 times without white point without plate bursting, pulling force >=3.5Lb/in.
Further, in bore process, drilling parameter: thick copper sheet parameter, bores nozzle using completely new, bores the nozzle service life by 1/folded
Baking sheet is first cleaned again 180 DEG C/2 hours in 500 holes after drilling, it is desirable that and hole is thick≤1000u ", ailhead≤2 times.
Further, in the outer graphics shifting process, emphasis control contraposition precision is needed；The graphic plating technique
In, by 700u " copper facing, line width control is on the upper side in intermediate value after etching；In the welding resistance technique, it can not move back and wash；The immersion process
In, it microetch 85 seconds, activates 220 seconds, rear pickling 220 seconds, nickel slot MTO control produces within 2.0；In the moulding process, make
With high TG parameter, 2/folded.
Embodiment 5
A kind of mixed pressure processing method of high-frequency high-speed motherboard, which comprises the following steps: sawing sheet → internal layer →
Internal layer AOI → pressing → drilling → remove glue → whole plate plating → outer graphics transfer → graphic plating → middle inspection → welding resistance → text
→ change gold → molding.
Further, the high-frequency high-speed motherboard carries out sawing sheet using PP plate, when PP plate is cut, need to first clean table top,
Avoid PP cross contamination；The PP plate has to be sealed before and after use, < 8 hours under unlimited environment, temperature and humidity
Control condition :≤23 DEG C ,≤50%；
Further, it before the process for pressing, needs internal layer process treated that core plate carries out oxidation processes, pass through brownification mode
It is aoxidized, is toasted 1-2 hours at 110 DEG C -120 DEG C after brownification；It also needs to toast 3-4 at 130 DEG C -180 DEG C before brownification
Hour.
Further, after core plate brownification to start pressing plate time control in 12 hours, folded plate into press when
Between control in 2 hours.It when padded coaming is there are when moisture absorption risk, needs to carry out drying and processing to it, due to material property, hold
Easy static electrification when lamination, need to give special heed to adsorption of foreign matter on PP.
Further, in the sheeting process, vaccum pressing plate equipment is just used, heating rate is controlled in 3-3.5 DEG C/s, will be warm
Degree rises to 100 DEG C -170 DEG C, and the temperature for turning high pressure spot is 90-110 DEG C, and the pressure of high pressure is 420-480PSI, temperature when solidification
Control is at 180-250 DEG C, curing time 70-120min；The duration control vacuumized is in 30-50min, hot pressing material temperature < out
130℃。
Further, in the process for pressing, for the control of brownification microetch amount in 55-75u ", walkthrough uses+4 rivets of hot melt,
Copper foil uses normal copper foil when typesetting, and copper foil is inverted, i.e., smooth surface places 20 completely new oxen close to core plate, artificial lid copper foil up and down
Mulberry paper lamination, it is ensured that better plate thickness uniformity, middle layer add buffering paper.
Further, in the bore process, including laser drilling and through-hole drilling；The laser drilling technique is using straight
The mode of drilling is connect, to 8um hereinafter, compared to FR4 material, energy and rifle number increase outer layer copper thickness microetch.
Further, in the through-hole bore process, cover board uses LE aluminium flake, for≤1.0mm brill nozzle, selects completely new bore
Nozzle, drilling parameter selection reduce feed speed and withdrawing speed, and 11 folded, insert rack baking sheet 190 DEG C × 3 hours after drilling.
Further, described except in adhesive process, using+1 potassium permanganate of 1 plasma except glue, stinging erosion rate except glue is
0.3-0.6mg/cm2；In the immersion process, 150 DEG C baking 6-8 hours before change gold；In the interior layer process, pre-treatment microetch
In 17-35u ", exposure selects the operation on fully automatic exposure machine for amount control, confirms film harmomegathus and very poor, every life before upper machine
A film, glass platform must all be cleaned by producing 20PNL plate, and the replacement frequency of dust sticky paper is that every 20PNL is changed once, line width after etching
By intermediate value control on the upper side.
In the present invention, motherboard after the process for pressing, at 185 DEG C of Tg (DSC)/210 DEG C (TMA), through overheating
288 DEG C of tin furnaces are soaked in shock-testing, and 10 seconds/time, 6 times without white point without plate bursting, pulling force >=3.5Lb/in.
Further, in bore process, drilling parameter: thick copper sheet parameter, bores nozzle using completely new, bores the nozzle service life by 1/folded
Baking sheet is first cleaned again 180 DEG C/2 hours in 500 holes after drilling, it is desirable that and hole is thick≤1000u ", ailhead≤2 times.
Further, in the outer graphics shifting process, emphasis control contraposition precision is needed；The graphic plating technique
In, by 700u " copper facing, line width control is on the upper side in intermediate value after etching；In the welding resistance technique, it can not move back and wash；The immersion process
In, it microetch 80-100 seconds, activates 160-280 seconds, latter pickling 160-280 seconds, nickel slot MTO control produced within 2.0；It is described at
In type technique, using high TG parameter, 2/folded.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.It is noted that the technical characteristic being not described in detail in the present invention, can pass through this
Field any prior art is realized.
Claims (10)
1. a kind of mixed pressure processing method of high-frequency high-speed motherboard, which comprises the following steps: sawing sheet → internal layer
→ internal layer AOI → pressing → drilling → remove glue → whole plate plating → outer graphics transfer → graphic plating → middle inspection → welding resistance → text
Word → change gold → molding.
2. the mixed pressure processing method of high-frequency high-speed motherboard according to claim 1, which is characterized in that the pressing
Before technique, internal layer process is needed treated that core plate carries out oxidation processes, aoxidized by brownification mode, 110 after brownification
It is toasted 1-2 hours at DEG C -120 DEG C；It also needs to toast 3-4 hours at 130 DEG C -180 DEG C before brownification.
3. the mixed pressure processing method of high-frequency high-speed motherboard according to claim 2, which is characterized in that core plate brownification
Arrive afterwards start pressing plate time control in 12 hours, folded plate arrive into press time control in 2 hours.
4. the mixed pressure processing method of high-frequency high-speed motherboard according to claim 1, which is characterized in that the pressing plate
In technique, vaccum pressing plate equipment is just used, heating rate controls in 3-3.5 DEG C/s, temperature is risen to 100 DEG C -170 DEG C, turns high pressure
The temperature of point is 90-110 DEG C, and the pressure of high pressure is 420-480PSI, and temperature control is at 180-250 DEG C when solidification, curing time
For 70-120min；The duration control vacuumized is in 30-50min, 130 DEG C of hot pressing material temperature < out.
5. the mixed pressure processing method of high-frequency high-speed motherboard according to claim 2, which is characterized in that the pressing
In technique, brownification microetch amount controls the copper foil in 55-75u ", walkthrough use+4 rivets of hot melt, typesetting and uses normal copper foil, copper
Foil is inverted, i.e., smooth surface places 20 completely new ox-hide stacked paper sheets close to core plate, artificial lid copper foil up and down, and middle layer adds buffering paper.
6. the mixed pressure processing method of high-frequency high-speed motherboard according to claim 1, which is characterized in that the drilling
In technique, including laser drilling and through-hole drilling；In the laser drilling technique, by the way of directly drilling, outer layer copper is thick
Microetch is to 8um or less.
7. the mixed pressure processing method of high-frequency high-speed motherboard according to claim 6, which is characterized in that the through-hole
In bore process, cover board uses LE aluminium flake, for≤1.0mm brill nozzle, selects completely new brill nozzle, drilling parameter selection reduction feed speed
With withdrawing speed, 11 folded, insert rack baking sheet 190 DEG C × 3 hours after drilling.
8. the mixed pressure processing method of high-frequency high-speed motherboard according to claim 1, which is characterized in that described to remove glue
In technique, glue is removed using+1 potassium permanganate of 1 plasma, stinging erosion rate except glue is 0.3-0.6mg/cm2。
9. the mixed pressure processing method of high-frequency high-speed motherboard according to claim 1, which is characterized in that describedization gold
In technique, 150 DEG C baking 6-8 hours before change gold.
10. the mixed pressure processing method of high-frequency high-speed motherboard according to claim 9, which is characterized in that describedization
In gold process, microetch 80-100 seconds, activate 160-280 seconds, latter pickling 160-280 seconds, nickel slot MTO control produced within 2.0.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111642071A (en) * | 2020-05-14 | 2020-09-08 | 大连崇达电路有限公司 | Circuit board and method for improving board explosion and copper sheet foaming of circuit board |
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| CN105307425A (en) * | 2015-09-16 | 2016-02-03 | 成都航天通信设备有限责任公司 | Blind and buried via rigid-flex board production process |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111642071A (en) * | 2020-05-14 | 2020-09-08 | 大连崇达电路有限公司 | Circuit board and method for improving board explosion and copper sheet foaming of circuit board |
| CN111642071B (en) * | 2020-05-14 | 2023-03-31 | 大连崇达电路有限公司 | Circuit board and method for improving board explosion and copper sheet foaming of circuit board |
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