CN100562664C - 用于供给药液的泵单元 - Google Patents
用于供给药液的泵单元 Download PDFInfo
- Publication number
- CN100562664C CN100562664C CNB2005800289947A CN200580028994A CN100562664C CN 100562664 C CN100562664 C CN 100562664C CN B2005800289947 A CNB2005800289947 A CN B2005800289947A CN 200580028994 A CN200580028994 A CN 200580028994A CN 100562664 C CN100562664 C CN 100562664C
- Authority
- CN
- China
- Prior art keywords
- pump
- discharge
- valve
- switch valve
- side switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000126 substance Substances 0.000 title claims abstract description 35
- 235000014347 soups Nutrition 0.000 claims abstract description 45
- 230000004888 barrier function Effects 0.000 claims description 17
- 230000002093 peripheral effect Effects 0.000 claims description 17
- 238000011144 upstream manufacturing Methods 0.000 claims description 5
- 238000007599 discharging Methods 0.000 abstract description 21
- 239000007788 liquid Substances 0.000 abstract description 18
- 239000003814 drug Substances 0.000 abstract description 15
- 230000000903 blocking effect Effects 0.000 abstract description 9
- 239000003795 chemical substances by application Substances 0.000 description 48
- 239000007789 gas Substances 0.000 description 20
- 239000004065 semiconductor Substances 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 8
- 230000001154 acute effect Effects 0.000 description 3
- 230000000994 depressogenic effect Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 241000222120 Candida <Saccharomycetales> Species 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 235000019994 cava Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
- F04B53/06—Venting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/06—Pumps having fluid drive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Reciprocating Pumps (AREA)
- Details Of Reciprocating Pumps (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004264423A JP4723218B2 (ja) | 2004-09-10 | 2004-09-10 | 薬液供給用ポンプユニット |
JP264423/2004 | 2004-09-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101023269A CN101023269A (zh) | 2007-08-22 |
CN100562664C true CN100562664C (zh) | 2009-11-25 |
Family
ID=36036202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005800289947A Expired - Fee Related CN100562664C (zh) | 2004-09-10 | 2005-07-29 | 用于供给药液的泵单元 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070258837A1 (ja) |
JP (1) | JP4723218B2 (ja) |
KR (1) | KR101118239B1 (ja) |
CN (1) | CN100562664C (ja) |
WO (1) | WO2006027909A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4526350B2 (ja) * | 2004-10-29 | 2010-08-18 | シーケーディ株式会社 | 薬液供給用ポンプ |
US7942647B2 (en) | 2004-11-01 | 2011-05-17 | Octec Inc. | Pump for supplying chemical liquids |
JP5352324B2 (ja) * | 2009-04-08 | 2013-11-27 | Ckd株式会社 | 液体吐出用ポンプシステム |
JP5439579B2 (ja) * | 2012-02-27 | 2014-03-12 | 東京エレクトロン株式会社 | 液処理装置及び液処理方法 |
KR101444705B1 (ko) * | 2014-01-29 | 2014-09-26 | (주)유니테코 | 방사성 의약품 분배장치 |
US9605669B2 (en) * | 2014-03-19 | 2017-03-28 | Graco Fluid Handling (A) Inc. | Multi-port metering pump assembly and related methods |
KR101686565B1 (ko) * | 2015-05-13 | 2016-12-28 | 세메스 주식회사 | 액 공급 유닛 및 이를 포함하는 기판 처리 장치 |
JP6576217B2 (ja) * | 2015-11-10 | 2019-09-18 | 株式会社Screenホールディングス | 処理液供給装置および処理液供給装置の制御方法 |
JP6920133B2 (ja) * | 2017-08-23 | 2021-08-18 | 株式会社Screenホールディングス | 処理液供給装置 |
WO2023112476A1 (ja) | 2021-12-17 | 2023-06-22 | Ckd株式会社 | ダイアフラム、及び薬液制御装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2843050A (en) * | 1954-02-15 | 1958-07-15 | Lyndus E Harper | Diaphragm sludge or chemical pump |
US3302953A (en) * | 1963-02-25 | 1967-02-07 | Clarence O Glasgow | Gasket ring and conduit coupling |
JPS51107504A (ja) * | 1975-03-18 | 1976-09-24 | Ajinomoto Kk | Ofukudohonpu |
US5088515A (en) * | 1989-05-01 | 1992-02-18 | Kamen Dean L | Valve system with removable fluid interface |
DE3827489C1 (ja) * | 1988-08-12 | 1989-10-12 | Gruenbeck Wasseraufbereitung Gmbh, 8884 Hoechstaedt, De | |
US5154589A (en) * | 1990-11-09 | 1992-10-13 | National Instrument Company | Metering pump |
JP3380594B2 (ja) * | 1992-10-14 | 2003-02-24 | エーザイ株式会社 | 薬液の送液ポンプとこれを用いる薬液の充填用送液装置 |
JPH0663878U (ja) * | 1993-02-10 | 1994-09-09 | 東京特殊電線株式会社 | ダイヤフラムポンプ |
US5378122A (en) * | 1993-02-16 | 1995-01-03 | Wilden Pump & Engineering Co. | Air driven diaphragm pump |
JPH07324680A (ja) * | 1994-05-30 | 1995-12-12 | Hitachi Ltd | 流動体供給方法および装置 |
JPH08285125A (ja) * | 1995-04-12 | 1996-11-01 | Koganei Corp | 弁装置および弁装置を有する薬液供給装置 |
US5566983A (en) * | 1995-08-21 | 1996-10-22 | Eaton Corporation | Fluid interface |
JPH09151854A (ja) * | 1995-11-29 | 1997-06-10 | Hitachi Ltd | 薬液供給装置 |
KR100252224B1 (ko) * | 1997-09-26 | 2000-06-01 | 윤종용 | 반도체장치 제조설비의 포토레지스트 셕크백장치 |
JP4166877B2 (ja) * | 1998-10-22 | 2008-10-15 | 日東工器株式会社 | パッキンとこれを組込んだ管継手 |
-
2004
- 2004-09-10 JP JP2004264423A patent/JP4723218B2/ja not_active Expired - Lifetime
-
2005
- 2005-07-29 CN CNB2005800289947A patent/CN100562664C/zh not_active Expired - Fee Related
- 2005-07-29 US US11/662,019 patent/US20070258837A1/en not_active Abandoned
- 2005-07-29 KR KR1020077008115A patent/KR101118239B1/ko active IP Right Grant
- 2005-07-29 WO PCT/JP2005/013920 patent/WO2006027909A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP4723218B2 (ja) | 2011-07-13 |
CN101023269A (zh) | 2007-08-22 |
KR101118239B1 (ko) | 2012-03-16 |
US20070258837A1 (en) | 2007-11-08 |
WO2006027909A1 (ja) | 2006-03-16 |
KR20070114693A (ko) | 2007-12-04 |
JP2006077712A (ja) | 2006-03-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091125 Termination date: 20130729 |