CN100562664C - 用于供给药液的泵单元 - Google Patents

用于供给药液的泵单元 Download PDF

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Publication number
CN100562664C
CN100562664C CNB2005800289947A CN200580028994A CN100562664C CN 100562664 C CN100562664 C CN 100562664C CN B2005800289947 A CNB2005800289947 A CN B2005800289947A CN 200580028994 A CN200580028994 A CN 200580028994A CN 100562664 C CN100562664 C CN 100562664C
Authority
CN
China
Prior art keywords
pump
discharge
valve
switch valve
side switch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005800289947A
Other languages
English (en)
Chinese (zh)
Other versions
CN101023269A (zh
Inventor
奥村胜弥
荒川和弘
伊藤重伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ottke Co Ltd
Tokyo Electron Ltd
CKD Corp
Original Assignee
Ottke Co Ltd
Tokyo Electron Ltd
CKD Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ottke Co Ltd, Tokyo Electron Ltd, CKD Corp filed Critical Ottke Co Ltd
Publication of CN101023269A publication Critical patent/CN101023269A/zh
Application granted granted Critical
Publication of CN100562664C publication Critical patent/CN100562664C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
    • F04B53/06—Venting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • F04B43/06—Pumps having fluid drive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Reciprocating Pumps (AREA)
  • Details Of Reciprocating Pumps (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CNB2005800289947A 2004-09-10 2005-07-29 用于供给药液的泵单元 Expired - Fee Related CN100562664C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004264423A JP4723218B2 (ja) 2004-09-10 2004-09-10 薬液供給用ポンプユニット
JP264423/2004 2004-09-10

Publications (2)

Publication Number Publication Date
CN101023269A CN101023269A (zh) 2007-08-22
CN100562664C true CN100562664C (zh) 2009-11-25

Family

ID=36036202

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800289947A Expired - Fee Related CN100562664C (zh) 2004-09-10 2005-07-29 用于供给药液的泵单元

Country Status (5)

Country Link
US (1) US20070258837A1 (ja)
JP (1) JP4723218B2 (ja)
KR (1) KR101118239B1 (ja)
CN (1) CN100562664C (ja)
WO (1) WO2006027909A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4526350B2 (ja) * 2004-10-29 2010-08-18 シーケーディ株式会社 薬液供給用ポンプ
US7942647B2 (en) 2004-11-01 2011-05-17 Octec Inc. Pump for supplying chemical liquids
JP5352324B2 (ja) * 2009-04-08 2013-11-27 Ｃｋｄ株式会社 液体吐出用ポンプシステム
JP5439579B2 (ja) * 2012-02-27 2014-03-12 東京エレクトロン株式会社 液処理装置及び液処理方法
KR101444705B1 (ko) * 2014-01-29 2014-09-26 (주)유니테코 방사성 의약품 분배장치
US9605669B2 (en) * 2014-03-19 2017-03-28 Graco Fluid Handling (A) Inc. Multi-port metering pump assembly and related methods
KR101686565B1 (ko) * 2015-05-13 2016-12-28 세메스 주식회사 액 공급 유닛 및 이를 포함하는 기판 처리 장치
JP6576217B2 (ja) * 2015-11-10 2019-09-18 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置および処理液供給装置の制御方法
JP6920133B2 (ja) * 2017-08-23 2021-08-18 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置
WO2023112476A1 (ja) 2021-12-17 2023-06-22 Ckd株式会社 ダイアフラム、及び薬液制御装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2843050A (en) * 1954-02-15 1958-07-15 Lyndus E Harper Diaphragm sludge or chemical pump
US3302953A (en) * 1963-02-25 1967-02-07 Clarence O Glasgow Gasket ring and conduit coupling
JPS51107504A (ja) * 1975-03-18 1976-09-24 Ajinomoto Kk Ofukudohonpu
US5088515A (en) * 1989-05-01 1992-02-18 Kamen Dean L Valve system with removable fluid interface
DE3827489C1 (ja) * 1988-08-12 1989-10-12 Gruenbeck Wasseraufbereitung Gmbh, 8884 Hoechstaedt, De
US5154589A (en) * 1990-11-09 1992-10-13 National Instrument Company Metering pump
JP3380594B2 (ja) * 1992-10-14 2003-02-24 エーザイ株式会社 薬液の送液ポンプとこれを用いる薬液の充填用送液装置
JPH0663878U (ja) * 1993-02-10 1994-09-09 東京特殊電線株式会社 ダイヤフラムポンプ
US5378122A (en) * 1993-02-16 1995-01-03 Wilden Pump & Engineering Co. Air driven diaphragm pump
JPH07324680A (ja) * 1994-05-30 1995-12-12 Hitachi Ltd 流動体供給方法および装置
JPH08285125A (ja) * 1995-04-12 1996-11-01 Koganei Corp 弁装置および弁装置を有する薬液供給装置
US5566983A (en) * 1995-08-21 1996-10-22 Eaton Corporation Fluid interface
JPH09151854A (ja) * 1995-11-29 1997-06-10 Hitachi Ltd 薬液供給装置
KR100252224B1 (ko) * 1997-09-26 2000-06-01 윤종용 반도체장치 제조설비의 포토레지스트 셕크백장치
JP4166877B2 (ja) * 1998-10-22 2008-10-15 日東工器株式会社 パッキンとこれを組込んだ管継手

Also Published As

Publication number Publication date
JP4723218B2 (ja) 2011-07-13
CN101023269A (zh) 2007-08-22
KR101118239B1 (ko) 2012-03-16
US20070258837A1 (en) 2007-11-08
WO2006027909A1 (ja) 2006-03-16
KR20070114693A (ko) 2007-12-04
JP2006077712A (ja) 2006-03-23

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Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091125

Termination date: 20130729