CN100537829C - 由一种硅基合金制造一种溅射靶的方法 - Google Patents

由一种硅基合金制造一种溅射靶的方法 Download PDF

Info

Publication number
CN100537829C
CN100537829C CNB2003101141969A CN200310114196A CN100537829C CN 100537829 C CN100537829 C CN 100537829C CN B2003101141969 A CNB2003101141969 A CN B2003101141969A CN 200310114196 A CN200310114196 A CN 200310114196A CN 100537829 C CN100537829 C CN 100537829C
Authority
CN
China
Prior art keywords
casting
sputtering target
target
silicon
pipe fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2003101141969A
Other languages
English (en)
Chinese (zh)
Other versions
CN1500907A (zh
Inventor
M·魏格特
J·海因德尔
U·康尼茨卡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
Original Assignee
WC Heraus GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Publication of CN1500907A publication Critical patent/CN1500907A/zh
Application granted granted Critical
Publication of CN100537829C publication Critical patent/CN100537829C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D15/00—Casting using a mould or core of which a part significant to the process is of high thermal conductivity, e.g. chill casting; Moulds or accessories specially adapted therefor
    • B22D15/02—Casting using a mould or core of which a part significant to the process is of high thermal conductivity, e.g. chill casting; Moulds or accessories specially adapted therefor of cylinders, pistons, bearing shells or like thin-walled objects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
    • B22D27/15—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting by using vacuum

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
CNB2003101141969A 2002-11-14 2003-11-05 由一种硅基合金制造一种溅射靶的方法 Expired - Fee Related CN100537829C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10253319A DE10253319B3 (de) 2002-11-14 2002-11-14 Verfahren zum Herstellen eines Sputtertargets aus einer Si-Basislegierung, sowie die Verwendung des Sputtertargets
DE10253319.9 2002-11-14

Publications (2)

Publication Number Publication Date
CN1500907A CN1500907A (zh) 2004-06-02
CN100537829C true CN100537829C (zh) 2009-09-09

Family

ID=32185716

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2003101141969A Expired - Fee Related CN100537829C (zh) 2002-11-14 2003-11-05 由一种硅基合金制造一种溅射靶的方法

Country Status (7)

Country Link
US (2) US20040094283A1 (enExample)
EP (1) EP1447458B1 (enExample)
JP (1) JP2004162179A (enExample)
CN (1) CN100537829C (enExample)
AT (1) ATE329064T1 (enExample)
DE (2) DE10253319B3 (enExample)
PL (1) PL204234B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102352483A (zh) * 2011-11-15 2012-02-15 江苏美特林科特殊合金有限公司 一种真空溅射镀膜用硅铝合金中空旋转靶材的制备方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004058316A1 (de) * 2004-12-02 2006-06-08 W.C. Heraeus Gmbh Rohrförmiges Sputtertarget
DE102004060423B4 (de) * 2004-12-14 2016-10-27 Heraeus Deutschland GmbH & Co. KG Rohrtarget und dessen Verwendung
US7922066B2 (en) * 2005-09-21 2011-04-12 Soleras, LTd. Method of manufacturing a rotary sputtering target using a mold
US7247418B2 (en) * 2005-12-01 2007-07-24 Eastman Kodak Company Imageable members with improved chemical resistance
DE102006009749A1 (de) * 2006-03-02 2007-09-06 FNE Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH Targetanordnung
EP1933391A1 (de) * 2006-12-11 2008-06-18 Applied Materials, Inc. Verfahren zur Herstellung einer SiN:H-Schicht auf einem Substrat
DE102006060512A1 (de) * 2006-12-19 2008-06-26 W.C. Heraeus Gmbh Sputtertargetanordnung
RU2344019C1 (ru) * 2007-04-16 2009-01-20 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") Способ получения литых трубных изделий из сплавов на основе никеля и/или кобальта
RU2340426C1 (ru) * 2007-04-16 2008-12-10 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") Способ получения литого трубного катода из сплавов на основе алюминия для ионно-плазменного нанесения покрытий
EP2488677B1 (en) * 2009-10-12 2013-08-28 Gradel S.à.r.L. Method and apparatus for production of rotatable sputtering targets
JP5428741B2 (ja) * 2009-10-19 2014-02-26 東ソー株式会社 円筒形スパッタリングターゲットの製造方法
EP2702186A1 (en) * 2011-04-29 2014-03-05 Praxair S.T. Technology, Inc. Method of forming a cylindrical sputter target assembly
CN102430718A (zh) * 2011-12-26 2012-05-02 昆山全亚冠环保科技有限公司 用于制备铝及铝基合金旋转靶材的模具及制作方法
CN106180652B (zh) * 2016-09-09 2019-02-15 西京学院 一种钛合金薄壁壳体铸坯精加工模具及其加工方法
CN110218983A (zh) * 2019-06-25 2019-09-10 杨晔 磁控溅射旋转靶材的绑定方法
CN111118437A (zh) * 2019-12-31 2020-05-08 广州市尤特新材料有限公司 一种旋转硅磷合金靶材及其制备方法与应用
CN115354290B (zh) * 2022-09-01 2024-01-23 中核四0四有限公司 一种放射性靶件的制造方法及系统

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
ES8402188A1 (es) * 1982-04-15 1984-01-16 Creusot Loire Procedimiento de fabricacion de un lingote hueco de acero.
JPS61124566A (ja) * 1984-11-19 1986-06-12 Mitsubishi Metal Corp スパツタリング用Ａｌ−Ｓｉ系合金タ−ゲツト板材の製造法
JPH04184732A (ja) * 1990-11-20 1992-07-01 Seiko Epson Corp スパッタリングターゲットおよび、そのスパッタリングターゲットを用いた保護膜
US5094288A (en) * 1990-11-21 1992-03-10 Silicon Casting, Inc. Method of making an essentially void-free, cast silicon and aluminum product
JPH0539566A (ja) * 1991-02-19 1993-02-19 Mitsubishi Materials Corp スパツタリング用ターゲツト及びその製造方法
JPH0551730A (ja) * 1991-03-19 1993-03-02 Mitsubishi Materials Corp 蒸着用素材またはスパツタリング用ターゲツト素材の製造方法
BE1007067A3 (nl) * 1992-07-15 1995-03-07 Emiel Vanderstraeten Besloten Sputterkathode en werkwijze voor het vervaardigen van deze kathode.
US5303762A (en) * 1992-07-17 1994-04-19 Hitchiner Manufacturing Co., Inc. Countergravity casting apparatus and method
DE4243757A1 (de) * 1992-12-23 1994-06-30 Leybold Materials Gmbh Target für eine Kathodenzerstäubungsanlage aus einer ferromagnetischen Legierung
JPH07228967A (ja) * 1994-02-17 1995-08-29 Mitsubishi Materials Corp 長尺円筒状スパッタリングターゲット
JP3618005B2 (ja) * 1994-08-23 2005-02-09 三井金属鉱業株式会社 回転カソード用スパッタリングターゲットの製造方法
DE19602554C1 (de) * 1996-01-25 1997-09-18 Ald Vacuum Techn Gmbh Verfahren und Vorrichtung zum gleichzeitigen Gießen und gerichteten Erstarren von mehreren Gußkörpern
US6581669B2 (en) * 1998-03-10 2003-06-24 W.C. Heraeus Gmbh & Co., Kg Sputtering target for depositing silicon layers in their nitride or oxide form and a process for its preparation
DE19810246A1 (de) * 1998-03-10 1999-09-16 Leybold Materials Gmbh Sputtertarget zum Abscheiden nitridischer oder oxidischer Siliziumschichten und Verfahren zu seiner Herstellung
ATE430636T1 (de) * 1998-12-28 2009-05-15 Ultraclad Corp Verfahren zur herstellung eines silizium/aluminiumsputtertargets
DE10043748B4 (de) * 2000-09-05 2004-01-15 W. C. Heraeus Gmbh & Co. Kg Zylinderförmiges Sputtertarget, Verfahren zu seiner Herstellung und Verwendung
DE10063383C1 (de) * 2000-12-19 2002-03-14 Heraeus Gmbh W C Verfahren zur Herstellung eines Rohrtargets und Verwendung
DE10140589A1 (de) * 2001-08-18 2003-02-27 Heraeus Gmbh W C Sputtertarget aus einer Siliziumlegierung und Verfahren zur Herstellung eines Sputtertargets

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102352483A (zh) * 2011-11-15 2012-02-15 江苏美特林科特殊合金有限公司 一种真空溅射镀膜用硅铝合金中空旋转靶材的制备方法

Also Published As

Publication number Publication date
JP2004162179A (ja) 2004-06-10
DE50303674D1 (de) 2006-07-20
PL204234B1 (pl) 2009-12-31
ATE329064T1 (de) 2006-06-15
DE10253319B3 (de) 2004-05-27
EP1447458B1 (de) 2006-06-07
US20040094283A1 (en) 2004-05-20
EP1447458A2 (de) 2004-08-18
EP1447458A3 (de) 2004-08-25
PL363401A1 (en) 2004-05-17
CN1500907A (zh) 2004-06-02
US20050092455A1 (en) 2005-05-05

Similar Documents

Publication Publication Date Title
CN100537829C (zh) 由一种硅基合金制造一种溅射靶的方法
TWI404813B (zh) 管靶材
JPH0539566A (ja) スパツタリング用ターゲツト及びその製造方法
KR20090031499A (ko) 냉간 압축 성형된 스퍼터 타겟
US8342229B1 (en) Method of making a CIG target by die casting
CN1363716A (zh) 管靶的制造方法
JP2008506852A (ja) 管状ターゲット
TWI577815B (zh) ＣｕＳｎ、ＣｕＺｎ及ＣｕＺｎＳｎ濺鍍靶
CN101921988A (zh) 一种硅基合金旋转靶材及其制备方法
CN104480437A (zh) 一体成型管靶的生产方法
US6793784B1 (en) Tube target
CN108796304A (zh) 一种γ-TiAl预合金气雾化制粉电极棒及其制备方法
JPH07228967A (ja) 長尺円筒状スパッタリングターゲット
CN111185573B (zh) 一种薄壁复杂结构钛合金铸件的熔炼浇注方法
US4541474A (en) Process for manufacturing a moulding plunger for hollow glass objects
CN104959575B (zh) 一种固‑液态连接异种大块非晶合金的方法
US20060207740A1 (en) Processes for producing a sputtering target from a silicon-based alloy, a sputtering target
CN215315603U (zh) 一种压铸模具复合涂层
CN121152895A (zh) 铜背陶瓷环段靶
JPH09295167A (ja) 銅合金と鋼のクラッド材の製造方法
JP2006061936A (ja) 複合材料
JPH0517305B2 (enExample)
JPS6380918A (ja) 管内面のライニング方法
JPH09296241A (ja) Ｍｇダイカストシリンダ用スリーブ及びその製造方法とＭｇダイカストシリンダ
RU2186653C1 (ru) Композитный слиток для получения сварочной проволоки

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090909

Termination date: 20101105