CN100534262C - 膜孔形成装置及方法 - Google Patents
膜孔形成装置及方法 Download PDFInfo
- Publication number
- CN100534262C CN100534262C CNB2005100373633A CN200510037363A CN100534262C CN 100534262 C CN100534262 C CN 100534262C CN B2005100373633 A CNB2005100373633 A CN B2005100373633A CN 200510037363 A CN200510037363 A CN 200510037363A CN 100534262 C CN100534262 C CN 100534262C
- Authority
- CN
- China
- Prior art keywords
- fenestra
- etching
- flexible board
- chemical etching
- basement membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Abstract
Description
Claims (15)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100373633A CN100534262C (zh) | 2005-09-16 | 2005-09-16 | 膜孔形成装置及方法 |
US11/309,294 US7754623B2 (en) | 2005-09-16 | 2006-07-21 | Apparatus for forming film hole |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100373633A CN100534262C (zh) | 2005-09-16 | 2005-09-16 | 膜孔形成装置及方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1933698A CN1933698A (zh) | 2007-03-21 |
CN100534262C true CN100534262C (zh) | 2009-08-26 |
Family
ID=37879254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100373633A Expired - Fee Related CN100534262C (zh) | 2005-09-16 | 2005-09-16 | 膜孔形成装置及方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7754623B2 (zh) |
CN (1) | CN100534262C (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100574562C (zh) * | 2007-07-06 | 2009-12-23 | 富葵精密组件(深圳)有限公司 | 镂空印刷电路板的制作方法 |
CN110894606A (zh) * | 2019-10-21 | 2020-03-20 | 长沙锂安能电子科技有限公司 | 履带式双凹版同步蚀刻系统及蚀刻方法 |
CN112533390B (zh) * | 2021-02-03 | 2021-04-30 | 四川英创力电子科技股份有限公司 | 一种嵌铜pcb板铜板制作方法 |
CN116321765B (zh) * | 2023-05-15 | 2023-07-28 | 深圳市凌航达电子有限公司 | 一种覆铜线路板蚀刻加工方法及装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3679500A (en) * | 1970-08-07 | 1972-07-25 | Dainippon Screen Mfg | Method for forming perforations in metal sheets by etching |
US4069085A (en) * | 1973-07-16 | 1978-01-17 | U.S. Philips Corporation | Apparatus for forming apertures in a thin metal tape such as a shadow mask for a color television display tube |
JPS57147656A (en) * | 1981-03-09 | 1982-09-11 | Fuji Photo Film Co Ltd | Electrophotographic sensitive printing plate material |
GB8527578D0 (en) * | 1985-11-08 | 1985-12-11 | Finishing Services Ltd | Etching machines |
US5236746A (en) * | 1991-04-15 | 1993-08-17 | Ciba-Geigy Corporation | Curtain coating process for producing thin photoimageable coatings |
CA2313421A1 (en) * | 1999-08-26 | 2001-02-26 | The Goodyear Tire & Rubber Company | Power transmission belt |
US20020119716A1 (en) * | 2000-12-27 | 2002-08-29 | Santhosh Veliyil Velayudhan | Method of making a brush-type mat and the mat produced thereby |
US6732856B2 (en) * | 2001-02-27 | 2004-05-11 | Maryland Wire Belts, Inc. | Modular conveyor belt |
JP2003209366A (ja) * | 2002-01-15 | 2003-07-25 | Sony Corp | フレキシブル多層配線基板およびその製造方法 |
-
2005
- 2005-09-16 CN CNB2005100373633A patent/CN100534262C/zh not_active Expired - Fee Related
-
2006
- 2006-07-21 US US11/309,294 patent/US7754623B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20070075386A1 (en) | 2007-04-05 |
CN1933698A (zh) | 2007-03-21 |
US7754623B2 (en) | 2010-07-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107949164A (zh) | 一种具有较高速率的电路基板线圈线路蚀刻工艺 | |
CN100534262C (zh) | 膜孔形成装置及方法 | |
BG61362B1 (en) | Process for producing plated-through printed circuit boards | |
CN105916302A (zh) | 防止绿油塞孔的pcb制造方法 | |
JPH0455553B2 (zh) | ||
CN105163502A (zh) | 厚铜板细小线宽线距蚀刻控制方法 | |
KR100749444B1 (ko) | 에칭된 회로의 제조방법 | |
KR20220128919A (ko) | 필름 박리, 탈검 및 코퍼링을 위한 쓰리 인 원 방법 | |
JP2008053682A (ja) | ポリイミド配線板の製造方法 | |
JP2006502590A (ja) | プリント回路基板の製造方法 | |
JP3650514B2 (ja) | メッキした抵抗体をもつ印刷回路板の製造方法 | |
KR101023405B1 (ko) | 초발수 유연기판의 회로 배선 방법 | |
JPH04109510A (ja) | 異方導電膜の製造方法 | |
CN113973440A (zh) | 一种线路板绝缘层处理工艺 | |
JP2007214338A (ja) | 片面ポリイミド配線基板の製造方法 | |
KR100765489B1 (ko) | 연성인쇄회로기판의 편동도금방법 및 이에 의해 제조되는연성인쇄회로기판 | |
TWI281369B (en) | Apparatus and method for forming via holes | |
CN112739063B (zh) | 一种pcb板内层生产工艺 | |
GB2176942A (en) | Making printed circuit boards | |
JPS63182889A (ja) | プリント配線板の製造方法 | |
JPH02292893A (ja) | プリント基板の製造方法 | |
CN117715316A (zh) | 基于电场驱动微纳3d打印高密度柔性电路板制造方法 | |
CN116321770A (zh) | 一种印刷电路板电路的制作方式 | |
CN112752438A (zh) | 一种fpc镀孔方法 | |
CN117156679A (zh) | 一种封装基板铜面凸起的处理方法及封装基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: ZHENDING TECHNOLOGY HOLDING LIMITED Free format text: FORMER OWNER: FOXCONN ADVANCED TECHNOLOGY, INC. Effective date: 20120116 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120116 Address after: 518103, Shenzhen, Guangdong, Baoan District province Fuyong Town, Tong Industrial Zone, five floor of the first floor of the factory Co-patentee after: Zhending Technology Co., Ltd. Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518103, Shenzhen, Guangdong, Baoan District province Fuyong Town, Tong Industrial Zone, five floor of the first floor of the factory Co-patentee before: Honsentech Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090826 Termination date: 20130916 |