CN100532455C - 薄膜用聚酰胺树脂成形材料及其制造方法 - Google Patents
薄膜用聚酰胺树脂成形材料及其制造方法 Download PDFInfo
- Publication number
- CN100532455C CN100532455C CNB2005800330937A CN200580033093A CN100532455C CN 100532455 C CN100532455 C CN 100532455C CN B2005800330937 A CNB2005800330937 A CN B2005800330937A CN 200580033093 A CN200580033093 A CN 200580033093A CN 100532455 C CN100532455 C CN 100532455C
- Authority
- CN
- China
- Prior art keywords
- polyamide resin
- weight
- film
- inorganic particle
- bisamide compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
- C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2477/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP293153/2004 | 2004-10-06 | ||
JP2004293153 | 2004-10-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101031617A CN101031617A (zh) | 2007-09-05 |
CN100532455C true CN100532455C (zh) | 2009-08-26 |
Family
ID=36142584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005800330937A Active CN100532455C (zh) | 2004-10-06 | 2005-09-28 | 薄膜用聚酰胺树脂成形材料及其制造方法 |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN100532455C (zh) |
TW (1) | TW200628550A (zh) |
WO (1) | WO2006038507A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008053911A1 (fr) * | 2006-11-01 | 2008-05-08 | Mitsubishi Engineering-Plastics Corporation | Mélange de granules d'une composition de résine de polyamide, article moulé et procédé de production du mélange de granules |
JP5652300B2 (ja) * | 2010-05-18 | 2015-01-14 | 宇部興産株式会社 | ポリアミド樹脂組成物 |
CN103132172B (zh) * | 2011-11-29 | 2015-07-22 | 杜邦兴达(无锡)单丝有限公司 | 具有改善的刚度的磨料丝、包含其的工业用刷及该工业用刷的用途 |
CN107915987B (zh) * | 2016-10-11 | 2021-01-05 | 中国石油化工股份有限公司 | 一种用于制备聚酰胺薄膜的组合原料及其制备方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3310361B2 (ja) * | 1992-12-28 | 2002-08-05 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | ポリアミド樹脂組成物および成型品の製造方法 |
JP2000309702A (ja) * | 1999-04-27 | 2000-11-07 | Mitsubishi Chemicals Corp | ポリアミド系樹脂組成物及びそれからなる包装用フィルム |
JP4898017B2 (ja) * | 2001-05-28 | 2012-03-14 | ユニチカ株式会社 | 2軸延伸ポリアミドフィルム |
-
2005
- 2005-09-28 WO PCT/JP2005/017852 patent/WO2006038507A1/ja active Application Filing
- 2005-09-28 CN CNB2005800330937A patent/CN100532455C/zh active Active
- 2005-10-03 TW TW094134494A patent/TW200628550A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2006038507A1 (ja) | 2006-04-13 |
TW200628550A (en) | 2006-08-16 |
TWI370832B (zh) | 2012-08-21 |
CN101031617A (zh) | 2007-09-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: DSM IP ASSETS BV Free format text: FORMER OWNER: MITSUBISHI ENG PLASTIC CORP. Effective date: 20101018 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TOKYO TO, JAPAN TO: HEERLEN, HOLLAND |
|
TR01 | Transfer of patent right |
Effective date of registration: 20101018 Address after: Holland Heerlen Patentee after: DSM IP Property Company Limited Address before: Tokyo, Japan, Japan Patentee before: Mitsubishi Eng Plastic Corp. |