CN100525601C - Method for producing electromagnetic wave shielding material - Google Patents
Method for producing electromagnetic wave shielding material Download PDFInfo
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- CN100525601C CN100525601C CNB200710015898XA CN200710015898A CN100525601C CN 100525601 C CN100525601 C CN 100525601C CN B200710015898X A CNB200710015898X A CN B200710015898XA CN 200710015898 A CN200710015898 A CN 200710015898A CN 100525601 C CN100525601 C CN 100525601C
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Abstract
A method for preparing shield-material of electromagnetic wave includes carrying out plasma treatment on one surface of polymer film to make dyne value be less than 30, forming metal layer on treated surface, sticking said metal layer on at least one surface of glass with high light transparency, removing off polymer film and carrying out etching at metal layer on glass for forming metal lattice with high light transparency.
Description
Technical field:
The present invention relates to be applied in the preparation method of the electromagnetic shielding material of display device on various e-machines and the communicator.
Background technology:
In recent years, be accompanied by the development rapidly of informationized society, develop rapidly and popularized gradually about the technology of associating information machine.Various e-machines, communicator for example, are used for the guiding demonstration usefulness that display unit such as cathode ray tube (CRT), liquid crystal, EL, PDP, FED are used for TV usefulness, PC usefulness, station and airport etc., provide other various information to use.From these e-machines, pachinko, Electronic Control game machine such as fruit machine automatically, it is troubling to the influence of these machines to carry electromagnetic wave or electromagnetic wave that communicator such as electronics launches.For example people considered the problem of the machine malfunction of this electromagnetic wave around making, to the harmful effect of human body and the light transmission problem of display unit etc., more and more higher for the requirement of electromagnetic shielding material.Adapt to such requirement and developed various conductive materials.
The preparation method of conductive material mainly contains three kinds at present, all is the high transparent grid that covers or form the electromagnetic radiation of one deck maskable in screen surface.A kind of method: utilize to solidify glue (for example being about 10 μ m) thickness is surpassed on the calendering copper film of 9 μ m or optical-grade transparent polyethylene terephthalate (PET) film that the electrolysis copper film sticks on light transmittance higher (more than 90%), do copper film net metal etching afterwards, to form metal net shaped layer at the PET film surface.Though this method is feasible, but because the rolled copper foil of suitability for industrialized production and electrolytic copper foil are very expensive, its thickness generally will reach 9-12 μ m or thicker, head and shoulders above the required metal layer thickness of electromagnetic wave shielding, increased the difficulty that is etched into the fine rule warp, wasted resource and increased cost.In addition, the curing glue that is bonded together used between metal forming and the PET film all can be discharged the organic volatile of contaminated environment because of heat raises in production process and in using later on, thereby health is produced adverse effect.
The grenadine that another kind of electromagnetic wave shielding grid adopts a kind of polymeric material to be woven into adopts " chemical plating " method to plate metallized shell on this grenadine, and with solidifying glue it is attached on the PET film of optical clear level with the formation electromagnetic shielding film." but chemical plating " is acknowledged as and can causes great harm to environment, and needs a large amount of hydropower resources and electric power.In addition, the grenadine that this method is produced need use the curing glue that contains organic volatile on the optics level PET film of high light transmittance, and resistor and organism fever in the time of also can using because of display screen and causing pasted the hostile environment that the curing glue that uses discharges and the organic volatile of human body.At last, the grenadine of polymer braiding is subjected to the restriction in line of material footpath, and the yarn shape of braiding body in pelletized form, even if therefore metallization still restricts and influenced the ELECTROMAGNETIC RADIATION SHIELDING effect and the light transmission of metal grill.
The third method; at (light transmittance〉88%) on the high light transmittance thin polymer film after wherein one side forms metal level; the another side of thin polymer film pressure-sensitive adhesive coating and adhere to release film (scratch resistance diaphragm) in thousand grades of dust free rooms; etching sheet metal becomes metal grill then; throw off release film, the metallized polymeric films that is stained with pressure sensitive adhesive is attached to the display panel of making on glass.This kind technology must be used the high light transmittance thin polymer film; and it is very high to polymer thin film-strength and release film thickness requirement; this technology pressure-sensitive adhesive coating and adhering protective film need to carry out at a dried level dust free room; and this pressure sensitive adhesive and diaphragm are not easy to obtain; increase production cost so undoubtedly, reduced production efficiency and rate of finished products.
Summary of the invention:
Purpose of the present invention is intended to overcome the deficiencies in the prior art, provides a kind of production technology simple, and the efficient height can significantly strengthen the shielding material light transmittance, and has the preparation method of the electromagnetic shielding material of the metal consumption that reduces electromagnetic wave shielding.
Purpose of the present invention can realize by following technical measures:
This method is carried out as follows:
A. plasma treatment is carried out at least one surface of thin polymer film, make surperficial dyne value less than 30;
B. the surface after will handling forms metal level by the method for conventional able to produce metal film;
C. this metal level is sticked at least one surface of high light transmittance glass, then thin polymer film is removed;
D. again metal level on glass is carried out etching, form the metal grill of high light transmittance.
Purpose of the present invention also can realize by following technical measures:
The method of described conventional able to produce metal film is meant that sputtering method, ion plating method, ion beam boost motor method or vacuum vapour deposition combine with the wet type rubbing method, and wherein the wet type rubbing method comprises galvanoplastic and electroless plating method;
The method of described conventional able to produce metal film is that magnetron sputtering method and galvanoplastic combine;
Described high light transmittance glass be meant light transmittance greater than 90% and thickness be the glass of polymethyl methacrylate, chemically reinforced glass or other kinds of 0.6mm～10mm;
Described stickup is adhesive or the glued membrane that adopts high light transmittance, and thickness is 5～30 μ m;
Described thin polymer film is meant polyester, polypropylene, polyethylene, polybutene, olefin copolymer, polyimides, Polyetherimide, Merlon, polyacrylonitrile or poly-how diacid second diester, and thickness is the single or multiple lift film of 25～125 μ m;
Described metal level is aluminium, chromium, magnesium, copper, nickel, iron, cobalt, zinc, tin, silver, gold, titanium, bismuth, silicon, arsenic, stainless steel, or contain the compound of above-mentioned metal or their composition, thickness is 0.005 μ m～60 μ m, wherein preferred thickness is 0.5 μ m～8 μ m, and best thickness is 0.5 μ m～2 μ m.
Described compound is nitride, oxide, fluoride or carbide;
Described metal level is copper, nickel metal layer;
Described depositing metal layers can replace by directly sticking on high light transmittance carrier metal paper tinsel on glass.
Concrete production stage of the present invention is:
(1) pre-treatment: at first at least one surperficial using plasma of general polymer film is carried out pre-treatment, make film surface dyne value be less than 30;
(2) metallization of general polymer film: this metallization is by finishing at film surface vacuum plating coating metal layer of handling and wet plating method plating thick-layer metal level, and this process both can be carried out at the single face of film, also can carry out the two-sided of film;
(3) it is on glass the metal level of plating to be sticked on high light transmittance: utilize adhesive bond at least one surface of high light transmittance glass above-mentioned metal level;
(4) throw off the general polymer film, stay the metal level of glass and smooth;
(5) etching technics: metal level on glass is directly carried out etching, metal level is etched into the electromagnetic shielding material of light transmittance greater than 88% all size.
As mentioned above, the invention provides a kind of process for preparing the high light transmittance electromagnetic shielding material, utilize adhesive directly to be pasted together in the metal level and the glass of metallized polymeric films, thin polymer film is thrown off, then metal level on glass is etched into the high light transmittance metal grill of all size.
Etching of the present invention is meant the various wet methods and the dry etch process that can be etched into the high light transmittance metal grill.
From top introduction, discovery advantage of the present invention and good effect that can be clearly:
(1) the present invention need not consider the high light transmittance energy of thin polymer film, can select any thermoplastic film.
(2) thin polymer film metal-clad face not among the present invention without pressure-sensitive adhesive coating with paste diaphragm, has been saved production process so greatly, has improved production efficiency.
(3) polymer thin film metallization of the present invention adopts the vacuum plating and the depositing process that wets to combine, and institute's metal cladding thickness is 0.005 μ m～60 μ m, and wherein preferred thickness is 0.5 μ m～8 μ m, and best thickness is 0.5 μ m～2 μ m.Have the metal consumption that reduces electromagnetic wave shielding like this and avoid between metal level and film substrate, using the advantage of solidifying glue, reduced being etched into the needed time of net-like pattern structure, therefore helped suppressing the trapezoidal phenomenon that metal etch produces because of the pickling overlong time.
Description of drawings:
Fig. 1 is a preparation process schematic diagram of the present invention;
Fig. 2 is the shielding properties test result schematic diagram that the present invention makes product.
Embodiment:
The invention will be further described below with reference to Fig. 1:
Plasma pre-treatment 2 is carried out at first that 25～250 μ m are thick thin polymer film 1 at least one surface, makes thin polymer film surface dyne value less than 30.
Carry out thick metal deposition then on sheet metal, plated metal 4 can be Cu, Ni, Cr, Zn, Cd, Sn, Pb, Au, Ag, Co, Tb, Bi, and sedimentary deposit can adopt chemical plating method or electro-plating method, preferably electro-plating method.
With the metal level 3,4 of thin polymer film utilize adhesive 5 stick on light transmittance greater than 90% and thickness be at least one surface of the high light transmittance glass 6 of 0.6mm～10mm, then thin polymer film 1 is thrown off, stay the metal level of smooth on the high light transmittance glass 6, then the metal level on the high light transmittance glass 6 is etched into light transmittance greater than 88%, screening effectiveness is the metal grill 7 of 40～60dB in 10MHZ～1.0GHZ scope.
The above-mentioned sputtering method of mentioning, radio frequency magnetron sputtering method are very desirable, and vacuum degree is 100Pa or still less, more desirable is approximately 10
-3～1Pa, continuous reeling formula plating speed is 0.4～8.0m/min.
The above-mentioned deposition of thick metal level method of mentioning, mainly contain continuous electroplating method and electroless plating method: galvanoplastic are in electroplating process, and film is done negative electrode in plating bath, comprise metal ion in this plating bath, anode and negative electrode are staggered relatively, between them by forming metal level behind the direct current; Chemical plating method mainly forms metal coating by displacement or oxidation-reduction method in plating bath.
The condition of metal plating is as follows:
Continuous reeling formula alkalescence pyrophosphate copper plating liquid is formed:
Cupric pyrophosphate: 40-100g/L; Potassium pyrophosphate: 260-420g/L; Ammonium citrate: 10-40g/L; Ammoniacal liquor: 2-3ml/L; PH value: 8.2-8.8; Temperature: 20-50 ℃; Current density: 0.5-10A/dm
2Negative electrode translational speed: 1-20m/h adopts air stirring, the normal filtration, voltage 6V or still less.
Continuous reeling formula acid electroplating nickel plating bath is formed:
Nickelous sulfate: 150-300g/L; Nickel chloride: 30-60g/L; Boric acid: 30-60g/L; PH value: 3-5; Temperature: 20-50 ℃; Current density: 0.5-15A/dm
2Negative electrode translational speed: 1-30m/h adopts air stirring, the normal filtration, voltage 7V or still less.
In order more to be expressly understood the present invention, will be as follows with instance interpretation, but scope is not limited in this.
Embodiment 1:
At long 200 meters, wide 1030mm, thickness is that surperficial pre-treatment is carried out with plasma in 75 microns polyester film (PET) surface, and surperficial dyne value is 20, and vacuum magnetic-control sputtering copper facing is carried out on the surface after processing then, and vacuum degree is 2.5 * 10
-2Pa, polyester film translational speed 1.5m/min, this moment, the sheet resistance of material was 100～150 Ω/sq.
Plating thick metal copper layer 5 μ m so just produce the copper-clad plate of PET film on vacuum magnetic-control sputtering coating.
Alkalescence pyrophosphate method of electro-plating copper bar spare is as follows: plating bath contains cupric pyrophosphate: 50g/L; Potassium pyrophosphate: 300g/L; Ammonium citrate: 20g/L; Ammoniacal liquor: 3ml/L; PH value: 8.3; Temperature: 45 ℃; Current density: 1.0A/dm
2Negative electrode translational speed: 5.0m/h adopts air stirring, the normal filtration, and voltage 4V, this moment, the sheet resistance of material was 0.006 Ω/sq.
It is on 93% the polymethyl methacrylate that above-mentioned metal copper layer is attached to the thick light transmittance of 0.6mm with high light transmittance acrylic compounds pressure-sensitive adhesive, then polyester film is thrown off.
Carry out etching technics formation metal grill with overlaying on metal copper layer on glass, this moment, metal grid lines directly was 35 μ m, and spacing is 300 μ m between the metal wire, and metal grill side hinders 0.08 Ω/sq, and screening effectiveness is 60dB, and light transmittance is 88%.
Embodiment 2:
At long 200 meters, wide 1030mm, thickness is that pre-treatment is carried out with plasma in 50 microns polyimide film (PI) surface, and surperficial dyne value is 20, carries out vacuum magnetic-control sputtering nickel plating then, and vacuum degree is 2.1 * 10
-2Pa, polyimide film translational speed 1.2m/min, this moment, the sheet resistance of material was 70～100 Ω/sq.
Plating thick metal nickel dam 10 μ m on vacuum magnetic-control sputtering coating so just produce metallization PI film.
Acid electroplating nickel condition: nickelous sulfate: 200g/L; Nickel chloride: 40g/L; Boric acid: 30g/L; PH value: 4.0; Temperature: 40 ℃; Current density: 5A/dm
2Negative electrode translational speed: 8.0m/h adopts air stirring, normal filtration, voltage 4V.This moment material sheet resistance 0.010 Ω/sq.
Above-mentioned metal nickel dam is sticked with glue agent stick on the polymethyl methacrylate of the thick light transmittance of 5mm 91%, then polyimide film is thrown off.
To overlay on metal nickel dam etching on glass and form metal grill, this moment, metal grid lines directly was 32 μ m, and spacing is 300 μ m between the metal wire, and metal grill side hinders 0.12 Ω/sq, and screening effectiveness is 57dB, and light transmittance is 89%.
Embodiment 3:
At long 200 meters, wide 1030mm, thickness is that pre-treatment is carried out with plasma in 125 microns polyethylene film surface, and surperficial dyne value is 22, carries out the vacuum magnetic-control sputtering nickel plated copper then, and vacuum degree is 2.2 * 10
-2Pa, polyethylene film translational speed 2.0m/min, this moment, the sheet resistance of material was 150～200 Ω/sq.
First copper electroplating layer 1.5 μ m on vacuum magnetic-control sputtering coating, and then plated metal nickel 0.1 μ m (protection copper layer) so just produce the copper facing of polyethylene film and add nickel.
Alkalescence pyrophosphate method of electro-plating copper bar spare is as follows: plating bath contains cupric pyrophosphate: 50g/L; Potassium pyrophosphate: 300g/L; Ammonium citrate: 20g/L; Ammoniacal liquor: 3ml/L; PH value: 8.3; Temperature: 45 ℃; Current density: 1.0A/dm
2Negative electrode translational speed: 10.0m/h adopts air stirring, the normal filtration, and voltage 3V then carries out acid electroplating nickel condition: nickelous sulfate: 200g/L; Nickel chloride: 40g/L; Boric acid: 30g/L; PH value: 4.0; Temperature: 40 ℃; Current density: 5A/dm
2Negative electrode translational speed: 20.0m/h adopts air stirring, normal filtration, voltage 5V.This moment material sheet resistance 0.020 Ω/sq.
Above-mentioned metallic copper nickel dam with glue-film stickup on glass at the thick light transmittance 92% of 10mm, is thrown off the polyethylene film then.
To overlay on metallic copper nickel dam on glass and carry out etching formation metal grill, this moment, metal grid lines directly was 30 μ m, and spacing is 300 μ m between the metal wire, and metal grill side hinders 0.30 Ω/sq, and screening effectiveness is 45dB, and light transmittance is 90%.
Embodiment 4:
At long 200 meters, wide 1030mm, thickness is that surperficial pre-treatment is carried out with plasma in 75 microns polypropylene film surface, and surperficial dyne value is 20, and vacuum magnetic-control sputtering copper facing is carried out on the surface after processing then, and vacuum degree is 2.5 * 10
-2Pa, polypropylene film translational speed 1.5m/min, this moment, the sheet resistance of material was 100～150 Ω/sq.
Plating thick metallic iron layer 1.2 μ m so just produce polypropylene film and cover iron plate on vacuum magnetic-control sputtering coating.
Acid chloride iron plating condition is as follows: plating bath contains FeCl
24H
2O:400g/L; Ascorbic acid: 3.2g/L; Glycine: 2g/L; Hydrochloric acid adjust pH: 1.3; Temperature: 35 ℃; Current density: 3.0A/dm
2Negative electrode translational speed: 8.0m/h adopts air stirring, the normal filtration, and voltage 4V, this moment, the sheet resistance of material was 0.05 Ω/sq.
It is on 93% the polymethyl methacrylate that above-mentioned metallic iron layer is attached to the thick light transmittance of 0.6mm with high light transmittance acrylic compounds pressure-sensitive adhesive, then polypropylene film is thrown off.
Carry out etching technics formation metal grill with overlaying on metallic iron layer on glass, this moment, metal grid lines directly was 32 μ m, and spacing is 300 μ m between the metal wire, and metal grill side hinders 0.48 Ω/sq, and screening effectiveness is 40dB, and light transmittance is 90%.
Embodiment 5:
Long 200 meters, wide 1030mm, thickness be 50 microns poly-how pre-treatment is carried out with plasma in diacid second diester film surface, surperficial dyne value is 20, carries out vacuum magnetic-control sputtering nickel plating then, vacuum degree is 2.1 * 10
-2Pa, poly-how diacid second diester film translational speed 1.2m/min, this moment, the sheet resistance of material was 70～100 Ω/sq.
Plating thick metal nickel dam 4 μ m on vacuum magnetic-control sputtering coating so just produce how diacid second diester film of metallized polyimide.
Acid electroplating nickel condition: nickelous sulfate: 200g/L; Nickel chloride: 40g/L; Boric acid: 30g/L; PH value: 4.0; Temperature: 40 ℃; Current density: 5A/dm
2Negative electrode translational speed: 8.0m/h adopts air stirring, normal filtration, voltage 4V.This moment material sheet resistance 0.020 Ω/sq.
Above-mentioned metal nickel dam is sticked with glue agent stick on the polymethyl methacrylate of the thick light transmittance of 5mm 91%, will gather then how diacid second diester film is thrown off.
To overlay on metal nickel dam etching on glass and form metal grill, this moment, metal grid lines directly was 32 μ m, and spacing is 300 μ m between the metal wire, and metal grill side hinders 0.30 Ω/sq, and screening effectiveness is 45dB, and light transmittance is 89%.
Embodiment 6:
At long 200 meters, wide 1030mm, thickness is that pre-treatment is carried out with plasma in 125 microns polyetherimde films surface, and surperficial dyne value is 22, carries out the vacuum magnetic-control sputtering nickel plated copper then, and vacuum degree is 2.2 * 10
-2Pa, polyetherimde films translational speed 2.0m/min, this moment, the sheet resistance of material was 150～200 Ω/sq.
First plating thick metal iron layer 3 μ m on vacuum magnetic-control sputtering coating, and then plated metal nickel 0.1 μ m (protection iron layer) so just produce the polyetherimde films plating iron and add nickel.
Acid chloride iron plating condition is as follows: plating bath contains FeCl
24H
2O:400g/L; Ascorbic acid: 3.2g/L; Glycine: 2g/L; Hydrochloric acid adjust pH: 1.3; Temperature: 35 ℃; Current density: 3.0A/dm
2Negative electrode translational speed: 5.0m/h adopts air stirring, the normal filtration, and voltage 4V, this moment, the sheet resistance of material was 0.020 Ω/sq.
It is on 93% the polymethyl methacrylate that above-mentioned metallic iron layer is attached to the thick light transmittance of 0.6mm with high light transmittance acrylic compounds pressure-sensitive adhesive, then polyetherimde films is thrown off.
Carry out etching technics formation metal grill with overlaying on metallic iron layer on glass, this moment, metal grid lines directly was 33 μ m, and spacing is 300 μ m between the metal wire, and metal grill side hinders 0.30 Ω/sq, and screening effectiveness is 45dB, and light transmittance is 90%.
Embodiment 7:
At long 200 meters, wide 1030mm, thickness is that pre-treatment is carried out with plasma in 50 microns polyacrylonitrile film surface, and surperficial dyne value is 20, carries out vacuum magnetic-control sputtering nickel plating then, and vacuum degree is 2.1 * 10
-2Pa, polyacrylonitrile film translational speed 1.2m/min, this moment, the sheet resistance of material was 70～100 Ω/sq.
Plating thick metallic zinc layer 8 μ m so just produce metallized polypropylene nitrile film on vacuum magnetic-control sputtering coating.
The zinc-plated condition of ammonium chloride: zinc chloride: 35g/L; Ammonium chloride: 240g/L; Hexamethylenetetramine: 15g/L; PH value: 6.5; Temperature: 35 ℃; Current density: 3A/dm
2Negative electrode translational speed: 3.0m/h adopts air stirring, normal filtration, voltage 4V.This moment material sheet resistance 0.012 Ω/sq.
Above-mentioned metallic zinc layer is sticked with glue agent stick on the polymethyl methacrylate of the thick light transmittance of 5mm 91%, then polyacrylonitrile film is thrown off.
To overlay on metallic zinc layer etching on glass and form metal grill, this moment, metal grid lines directly was 32 μ m, and spacing is 300 μ m between the metal wire, and metal grill side hinders 0.13 Ω/sq, and screening effectiveness is 57dB, and light transmittance is 89%.
Embodiment 8:
Plating thick metal nickel dam 8 μ m on vacuum magnetic-control sputtering coating so just produce metallization PI film.Other are with embodiment 2.
Embodiment 9:
First copper electroplating layer 1.5 μ m on vacuum magnetic-control sputtering coating, and then plated metal nickel 0.1 μ m (protection copper layer) so just produce the copper facing of polyethylene film and add nickel.Other are with embodiment 3.
Embodiment 10:
Plating thick metallic iron layer 2 μ m so just produce polypropylene film and cover iron plate on vacuum magnetic-control sputtering coating.Other are with embodiment 4.
Embodiment 11:
Plating thick metal nickel dam 1.2 μ m on vacuum magnetic-control sputtering coating so just produce how diacid second diester film of metallized polyimide.Other are with embodiment 5.
Embodiment 12:
First plating thick metal iron layer 0.5 μ m on vacuum magnetic-control sputtering coating, and then plated metal nickel 0.1 μ m (protection iron layer) so just produce the polyetherimde films plating iron and add nickel.Other are with embodiment 6.
Though a plurality of already preferred experimental programs have been described the present invention, those skilled in the art will know easily, can make various modifications, replacement and change under the premise without departing from the spirit of the present invention.Therefore the scope of the invention is not subjected to the restriction of above description scope, also comprises their equivalent.
Claims (8)
1, a kind of preparation method of electromagnetic shielding material is characterized in that this method carries out as follows:
A. plasma treatment is carried out at least one surface of single or multiple lift thin polymer film that with thickness is 25～125 μ m, makes surperficial dyne value less than 30;
B. thick metal deposition is carried out by the method for conventional able to produce metal film in the surface after will handling, and forming thickness is 0.005 μ m～60 μ m metal levels;
C. this metal level to be adopted thickness be the adhesive of high light transmittance of 5～30 μ m or glue-film stickup light transmittance greater than 90% and thickness be at least one surface of high light transmittance glass of 0.6mm～10mm, then thin polymer film is removed;
D. again metal level on glass is carried out etching, the scope that makes light transmittance is 88%-90%, the screening effectiveness that forms high light transmittance is the metal grill of 40～60dB in 10MHZ～1.0GHZ scope, described metal grid lines directly is 32 μ m-35 μ m, spacing between the metal wire is 300 μ m, and the resistance of metal grill side is 0.08 Ω/sq-0.48 Ω/sq.
2, the preparation method of a kind of electromagnetic shielding material according to claim 1, the method that it is characterized in that described conventional able to produce metal film is meant that sputtering method, ion plating method, ion beam boost motor method or vacuum vapour deposition combine with the wet type rubbing method, and wherein the wet type rubbing method comprises galvanoplastic and electroless plating method.
3, the preparation method of a kind of electromagnetic shielding material according to claim 1, the method that it is characterized in that described conventional able to produce metal film are that magnetron sputtering method and galvanoplastic combine.
4, the preparation method of a kind of electromagnetic shielding material according to claim 1 is characterized in that described thin polymer film is meant polyester, polypropylene, polyethylene, polybutene, olefin copolymer, polyimides, Polyetherimide, Merlon, polyacrylonitrile or poly-how diacid second diester.
5, the preparation method of a kind of electromagnetic shielding material according to claim 1, it is characterized in that described metal level is aluminium, chromium, magnesium, copper, nickel, iron, cobalt, zinc, tin, silver, gold, titanium, bismuth, silicon, arsenic, stainless steel metal layer, or contain the compound of above-mentioned metal or their composition.
6, the preparation method of a kind of electromagnetic shielding material according to claim 5 is characterized in that described compound is nitride, oxide, fluoride or carbide.
7, the preparation method of a kind of electromagnetic shielding material according to claim 1 is characterized in that described metal level is copper, nickel metal layer.
8, the preparation method of a kind of electromagnetic shielding material according to claim 1 is characterized in that described metal level replaces by directly sticking on high light transmittance carrier metal paper tinsel on glass.
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| CN102392344B (en) * | 2011-07-08 | 2015-08-12 | 中国科学院理化技术研究所 | Magnetron sputtering technique is adopted to prepare the method for medical macromolecular materials |
| CN103121182B (en) * | 2013-01-30 | 2015-09-30 | 深圳科创新源工业材料有限公司 | A kind of core apparatus and technique preparing electromagnetic shield rubber |
| CN103121183B (en) * | 2013-01-31 | 2015-06-17 | 深圳科创新源工业材料有限公司 | Core device and technology for preparation of electromagnetic shielding tape |
| CN104499012B (en) * | 2015-01-14 | 2018-02-13 | 东北大学 | A kind of alkaline copper-based composite plating bath and electroplating technology |
| CN112423574B (en) * | 2020-11-18 | 2023-03-10 | 中国科学院宁波材料技术与工程研究所 | Ultrathin flexible transparent electromagnetic shielding film and preparation method thereof |
| CN113622008A (en) * | 2021-07-30 | 2021-11-09 | 浙江柔震科技有限公司 | Conductive film and preparation method thereof |
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| CN1787114A (en) * | 2005-12-06 | 2006-06-14 | 安泰科技股份有限公司 | Composite electromagnetic screen film material and mfg. method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1787114A (en) * | 2005-12-06 | 2006-06-14 | 安泰科技股份有限公司 | Composite electromagnetic screen film material and mfg. method thereof |
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Address after: Yuxing Road Flyover District of Ji'nan city in Shandong province 250119 New Material Industrial Park No. 517 Patentee after: Tiannuo Photoelectric Material Co., Ltd. Address before: Tianchen Avenue high tech Zone of Ji'nan City, Shandong province 250101 No. 1251 Building No. 3 room 103 Patentee before: Shandong Tiannuo Photovoltaic Material Co., Ltd. |