CN112746297A - Method for directly electroplating metal on surface of insulating base material - Google Patents
Method for directly electroplating metal on surface of insulating base material Download PDFInfo
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- CN112746297A CN112746297A CN202011520939.2A CN202011520939A CN112746297A CN 112746297 A CN112746297 A CN 112746297A CN 202011520939 A CN202011520939 A CN 202011520939A CN 112746297 A CN112746297 A CN 112746297A
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- electroplating
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention belongs to the technical field of electroplating, and discloses a method for directly electroplating metal on the surface of an insulating base material. The method comprises the following steps: s1: mixing metal nanowires, organic high-molecular polymer, solvent and surfactant according to a certain proportion to prepare conductive ink; s2: coating the conductive ink on the surface of an insulating substrate, and drying to form a conductive film; s3: the base material containing the conductive film in S2 is placed in a plating solution to be directly plated. The metal nanowires are used as the conductive medium layer, the obtained conductive film has lower surface resistance, so that the conductive film can be quickly plated, the production efficiency is greatly improved, and meanwhile, the conductive film has the advantages of simplicity in operation, no pollution, acid and alkali resistance, good bonding force with a base material and the like, so that the conductive film can be widely applied.
Description
Technical Field
The invention belongs to the technical field of electroplating, and particularly relates to a method for directly electroplating metal on the surface of an insulating base material.
Background
With the vigorous development of electronic information technology in the 21 st century, electronic products have entered a new era, and miniaturization, multi-functionalization and high-level integration have become mainstream development trends of electronic products, and meanwhile, the manufacturing of these high-technology electronic products is more challenging, and the electronic electroplating technology as the electronic electroplating technology for realizing the electrical interconnection of electronic products is one of the keys, for example, a printed circuit board needs to be electroplated to make circuits and realize hole metallization, so as to achieve the electrical interconnection of the whole circuit board; in the chip integration process, the wiring of the chip and the electrical conduction between the chip and the circuit board are also realized by electroplating; furthermore, for wearable electronics, it is required to form circuit structures on flexible substrates, such as PET, by electroplating. Since the insulating substrate has no conductivity, it cannot be directly plated, and the surface of the insulating substrate must have a certain conductivity through some treatments, such as chemical plating, physical/chemical vapor deposition, and direct plating of a conductive film.
Taking the circuit manufacturing of a printed circuit board as an example, the base material of the printed circuit board is generally non-conductive epoxy glass fiber cloth, the traditional process is to deposit a layer of thin copper on the base material in a chemical copper plating mode to be used as a bottom layer of electroplated copper, although the process is mature, the defects which are difficult to overcome exist, for example, the copper plating solution contains carcinogenic substance formaldehyde, which threatens the life health of production personnel, in addition, the copper plating solution process is complex, the plating solution is unstable, the control difficulty and the cost are increased, a large amount of complexing agents exist in the chemical copper plating solution, and the complexing agents cause serious environmental pollution, so the treatment difficulty and the treatment cost are increased, and on the basis, researchers carry out a large amount of process researches for replacing chemical plating.
The physical/chemical vapor deposition can effectively avoid the environmental problem caused by chemical copper plating, and can deposit a compact metal layer, which is a process with great potential to replace chemical copper plating, but the problems of high equipment cost and huge energy consumption are forbidden for PCB enterprises, and in addition, the non-selectivity of the deposition process can cause great waste to the target material. For example, Chinese patent "a semi-dry process plastic direct electroplating vacuum coating system" (published as CN109402597A) describes that the coating equipment uses a glow power supply voltage of 2500V, uses a sputtering power supply power of 60kW, and has large energy consumption and large additional cost, not only the equipment cost.
The conductive film process is a direct electroplating process which is researched more at present and is used for replacing chemical copper plating, conductive substances are attached to an insulating base material through surface treatment to form a uniform film, common substances for forming the conductive film comprise carbon black, graphene and an organic conductive high polymer, the carbon black and the graphene have strong hydrophobicity due to non-polar substances, and meanwhile, the carbon black and the graphene are easy to agglomerate due to small particle size, so that a large amount of dispersing agent needs to be added to ensure that the carbon black and the graphene can be uniformly dispersed in water, but the conductivity and the stability of a plating solution are inevitably reduced. Chinese patents 'a method for directly electroplating a circuit board based on graphene film formation' (publication No. CN110351956A) and 'a direct electroplating conductive liquid and a preparation method thereof' (publication No. CN103103950A) all describe that ultrasonic treatment needs to be carried out on the solution and a certain amount of dispersing agent needs to be added, and the treatment not only increases the working procedures but also has the defect of low electroplating efficiency. The general process of using organic conductive polymer as conductive film is to treat the insulating base material with inorganic oxide to make it charged, and to adsorb the conductive polymer to make it film-formed, and this process generally requires that one end of the insulating base material has metal layer (copper foil), and in the course of electroplating must ensure that the copper foil is contacted with plating solution to make metal grow from copper foil, otherwise, no matter how much voltage is applied, it can not deposit metal, in addition, because the resistance of organic conductive polymer is all greater, the plating speed of metal is slower, and the production efficiency is greatly limited. For example, chinese patents "method for electroplating metal on surface of insulating substrate" (publication No. CN108977862A) and "method for directly electroplating on insulating substrate" (publication No. CN107723764A) both adopt a method for directly electroplating on insulating substrate by activating organic conductive polymer film with metal ions, and have the main disadvantages of complicated process, need of adjustment, neutralization and activation, low copper-loading rate, and need of using copper foil for induced deposition.
Disclosure of Invention
The invention aims to solve the defects existing in the background technology, particularly the problems that when an organic conducting polymer is adopted as a conducting film, the plating rate is low, a copper foil is required to be used for induction deposition and the like, and provides a novel metal nanowire-organic polymer conducting film which is used for forming the conducting film on the surface of an insulating base material, the formed conducting film is uniformly distributed on the insulating base material, and the sheet resistance is between 5 omega/sq and 30 omega/sq, so that other metals are not required to be used as an induction layer, and meanwhile, the metal can be rapidly deposited, and the good bonding force with the insulating base material is kept.
In order to realize the technical problem, the technical scheme of the invention is as follows:
a method for directly electroplating metal on the surface of an insulating substrate is characterized by comprising the following steps:
s1: preparation of conductive ink
Uniformly mixing the metal nanowire, the organic high-molecular polymer, a solvent and a surfactant according to a certain proportion to prepare the metal nanowire-organic high-molecular polymer conductive ink;
s2: coating the metal nanowire-organic high molecular polymer conductive ink in the S1 on the clean surface of an insulating base material, drying, and forming a uniform conductive film on the surface of the insulating base material, wherein the metal nanowire in the conductive film is used as an active site for subsequent electroplating;
s3: the insulating substrate covered with the conductive film obtained in S2 is placed in a plating solution to be directly plated.
In the technical scheme of the invention, in the step S1, the conductive ink comprises the following components in percentage by mass: metal nanowires: 0.01% -10%, organic high molecular polymer: 0.1% -20%, solvent: 70% -99.8%, surfactant: 0 to 5 percent. The surfactant may be added or not added according to the insulating substrate coated in the conductive ink. The metal nanowires are used as a conductive medium, and the organic high molecular polymer is used as a film forming agent, a solvent and a surfactant to uniformly disperse the solution.
In the technical scheme of the invention, in the step S1, the metal nanowires include one or more of silver nanowires, copper nanowires, gold nanowires, and aluminum nanowires; preferably silver nanowires.
In the technical scheme of the present invention, in step S1, the organic high molecular polymer includes one or more of poly 3, 4-ethylenedioxythiophene/polystyrene sulfonate, polydimethylsiloxane, polyvinyl alcohol, cellulose, chitosan, polyvinylidene fluoride, polytetrafluoroethylene, polyethylene, polypropylene, polyvinyl chloride, polystyrene, ABS resin, polyester, polycarbonate, polyurethane, polyamide, polyimide, acrylic resin, epoxy resin, phenolic resin, UV resin, acrylic resin, polyamides, and polysulfone; preferably 3, 4-ethylenedioxythiophene/polystyrene sulfonate.
In the technical scheme of the invention, in the step S1, the solvent comprises one or more of water, ethanol, isopropanol, diethyl ether, toluene, xylene, pentane, cyclohexane, acetone, butanone, ethyl acetate, butyl acetate, N-dimethylformamide and N-methylpyrrolidone; preferably water.
In the technical scheme of the invention, in the step S1, the surfactant includes polyethylene glycol, polyoxyethylene ether, fatty alcohol amine, polyethylene glycol, sodium dodecyl sulfate, polyoxyethylene ester, oleate, and a nonionic fluorine-containing surfactant.
In the technical scheme of the invention, in the step S2, the insulating base material is a planar base material or a special-shaped base material made of different materials;
preferably, the insulating substrate is selected from one of epoxy resin reinforced glass fiber cloth, non-woven fabric, glass fiber cloth, ceramic, silicon, wood substrate and organic polymer film.
Preferably, the organic polymer film comprises polyethylene, polypropylene, polyimide, polyurethane, polyester, polycarbonate, polytetrafluoroethylene.
In the technical scheme of the invention, in the step S2, the coating process comprises one or more of blade coating, spin coating, dip coating, spray coating, micro-gravure printing, slit extrusion and screen printing, and the drying temperature is 60-300 ℃;
preferably, in step S2, the conductive film has a thickness of 0.1 μm to 20 μm.
In the present invention, in step S3, the direct electroplating on the surface of the insulating substrate covered with the conductive film includes any one of copper electroplating, cobalt electroplating, nickel electroplating, silver electroplating, gold electroplating, tin electroplating, zinc electroplating, and aluminum electroplating or alloy electroplating. The parameters of the electroplating process and the type of the current are not limited, and can be regulated and controlled according to the thickness of specific electroplated metal.
The invention also provides a preparation method of the printed circuit board, which comprises the method for directly electroplating metal on the surface of the insulating base material.
The invention conception of the method for directly electroplating metal on the surface of the insulating base material is as follows:
the invention coats a conductive film comprising metal nano-wire and organic high molecular polymer on any insulating base material, wherein the organic high molecular polymer is used as film forming agent which can be effectively attached to the surface of the insulating base material, the organic high molecular polymer can make the metal nano-wire tightly attached to the surface of the insulating base material through the cross-linking action of the high molecular chain, a small amount of metal nano-wires can form an excellent conductive network through mutual lapping, and can be directly used as a conductive medium in the electroplating process, and the resistance of the conductive film is much lower than that of the organic conductive polymer which is singly used, so that the direct electroplating can make metal ions quickly deposited to form a metal coating.
Compared with the prior art, the invention has the beneficial effects that:
1. the metal nanowire-organic high molecular polymer conductive film provided by the invention directly takes the metal nanowire as a conductive medium, and a good conductive network can be formed only by a small amount of metal nanowires, so that the metal nanowire-organic high molecular polymer conductive film can be quickly plated without an additional metal as an inducing layer, the production efficiency is improved, and the metal plating layer has strong adhesive force with an insulating base material, good binding force with the base material and reliable plating quality.
2. The invention completely avoids the harmful substances used in chemical plating, and avoids the harm to human body and the pollution to environment; compared with vacuum coating, the cost is lower, and the energy consumption is lower; compared with the film forming of the organic conducting polymer, the process is simpler, the plating rate is higher, and the comprehensive comparison can be said to be the most effective direct electroplating mode at present.
3. Because the metal nanowires have high light transmittance, if the base material is also a transparent base material, such as PET, the metal conductive film with certain transparency can be prepared by controlling electroplating process parameters, and the metal conductive film can be applied to more fields, such as transparent wearable equipment and transparent electromagnetic shielding films.
4. The invention can select and use corresponding organic high molecular polymer and metal nano wire according to different electroplating environments, such as acid and alkali resistance, temperature resistance and the like, so the invention has wider operation range and stronger weather resistance and can realize wide application.
Drawings
FIG. 1 is a schematic diagram of the method for directly electroplating metal on the surface of an insulating substrate according to the present invention.
Fig. 2 is an SEM image of a silver nanowire-organic polymer conductive film.
FIG. 3 is a graph of the apparent morphology of the copper layer plated on PET of example 1.
Figure 4 is an XRD pattern of copper layer plated on PET of example 1.
FIG. 5 is an SEM image of copper layer plating on PET of example 1.
FIG. 6 is an apparent topography of nickel layer plated on epoxy glass fiber board of example 2.
FIG. 7 is an apparent topography of the copper layer plated on PI of example 3.
Detailed Description
The present invention will be described in further detail with reference to examples, but the embodiments of the present invention are not limited thereto.
It should be noted that the following embodiments are provided for the purpose of teaching those skilled in the art the present invention and are not to be limited thereby, and all equivalent changes and modifications made in accordance with the spirit of the present invention are intended to be included therein.
In the following embodiments, the method for directly electroplating metal on the surface of the insulating substrate, as shown in fig. 1, specifically includes the following steps:
s1: preparation of conductive ink
Uniformly mixing the metal nanowire, the organic high-molecular polymer, a solvent and a surfactant according to a certain proportion to prepare the metal nanowire-organic high-molecular polymer conductive ink;
s2: coating the metal nanowire-organic high molecular polymer conductive ink in the S1 on the surface of an insulating base material, drying, and forming a uniform conductive film on the surface of the insulating base material, wherein the metal nanowire in the conductive film is used as an active site for subsequent electroplating;
s3: the insulating substrate covered with the conductive film obtained in S2 is placed in a plating solution to be directly plated.
The technical scheme of the invention is detailed below by combining the accompanying drawings and the embodiment.
Example 1:
s1: silver nanowires with the diameter of 45nm, poly 3, 4-ethylenedioxythiophene/polystyrene sulfonate and water are mixed according to the mass percentage of 0.53%: 13.6%: 85.87% of the components are mixed evenly to prepare 10g of conductive ink.
S2: and (3) coating the conductive ink in the S1 on a clean PET surface by using a No. 40 stainless steel wire rod, placing the PET surface in an oven at 120 ℃ for 10min, taking out the PET surface to obtain the silver nanowire-organic polymer conductive film, and measuring the surface sheet resistance by using a four-probe instrument.
S3: the treated PET in S2 was cut into a size of 10 cm. times.5 cm, and then directly placed in an electrolytic copper plating bath to be directly plated. The specific process is that PET is directly connected with a cathode of a direct current power supply, an anode is an insoluble titanium mesh and wraps filter paper, the total volume of electroplating solution is 1L, an electroplating bath body is a self-made polypropylene electroplating bath, and the formula of the electroplating solution is 200g/L CuSO4·5H2O+30g/L H2SO4The plating condition is room temperature and the plating parameter is 1A/dm2Electroplating for 10min, taking out the PET after the electroplating is finished, washing the PET with clear water, and then blowing the PET to dry to obtain a copper plating layer, and in addition, in order to test the adhesive force of the plating layer on the insulating base material, adopting a 3M adhesive tape to carry out a sticking experiment.
In the silver nanowire-organic polymer conductive film obtained in the scanning step S2 of the scanning electron microscope in example 1, as shown in fig. 2, the metal nanowires are tightly attached to the surface of the insulating substrate, a small number of metal nanowires are overlapped to form an excellent conductive network, and the sheet resistances at different positions on the conductive film in the testing step S2 of the four-probe instrument are 10 Ω/sq, 15 Ω/sq, 12 Ω/sq, and 13 Ω/sq in sequence, which indicates that the conductive film can be uniformly distributed on the surface of the insulating substrate, which is beneficial to the uniformity of the plating layer, and the lower sheet resistance can ensure rapid and continuous plating. FIG. 3 is an apparent topography of the copper layer plated on PET in step S3 of example 1. from the plating results of FIG. 3, it can be seen that the copper layer can uniformly cover the surface of the insulating substrate within 10min, which is sufficient to illustrate the fast plating rate of the present invention. Fig. 4 is an XRD pattern of the copper layer plated on PET of example 1, from which it is seen that the predominant crystal plane of the copper layer is the Cu (111) plane. FIG. 5 is an SEM image of the copper layer plated on PET of example 1, which shows that the copper layer is fine and flat, and fully illustrates the feasibility of the present invention. In addition, the result of the copper plating adhesion test is that the plating resists adhesion of 3M adhesive tapes 3 times, which indicates that the plating has a certain adhesion on PET.
Example 2:
s1: silver nanowires with the diameter of 60nm, poly 3, 4-ethylenedioxythiophene/polystyrene sulfonate, water and polyethylene glycol are mixed according to the mass percentage of 0.6 percent: 0.36%: 99.02%: 10g of conductive ink was prepared at a ratio of 0.02%.
S2: and (3) coating the conductive ink in the S1 on the surface of a neat epoxy glass fiber board (PCB substrate) by using a No. 40 stainless steel wire rod, placing the neat epoxy glass fiber board in an oven at 80 ℃ for 3min, taking out the neat epoxy glass fiber board to obtain the metal nanowire-organic polymer conductive film, and measuring the surface sheet resistance by using a four-probe instrument.
S3: cutting the treated epoxy glass fiber board in S2 to 8cm × 5cmAnd (4) directly placing the obtained product in an electroplating copper plating solution for direct electroplating. The specific process is that the epoxy glass fiber board is directly connected with the cathode of a direct current power supply, the anode is an insoluble titanium net and wraps filter paper, the total volume of the electroplating solution is 1L, the electroplating bath body is a self-made polypropylene electroplating bath, and the formula of the electroplating solution is 100g/L NiSO4·7H2O +30g/L potassium sodium tartrate +12g/L boric acid, the electroplating condition is room temperature, and the electroplating parameter is 3A/dm2Electroplating for 3min, taking out the epoxy glass fiber board after the electroplating is finished, washing the epoxy glass fiber board with clean water, and drying the epoxy glass fiber board to obtain a nickel coating, as shown in fig. 6, and in addition, in order to test the adhesion of the coating on the insulating substrate, a 3M adhesive tape is adopted for a sticking experiment.
In example 2, the sheet resistances of different positions on the conductive film in S2 were measured to be 5 Ω/sq, 8 Ω/sq, 6 Ω/sq, and 8 Ω/sq in sequence using a four-probe apparatus, which indicates that the conductive film can be uniformly distributed on the surface of the insulating substrate, which is beneficial to the uniformity of the plating layer. FIG. 6 is an apparent morphology of the nickel layer plated on the epoxy glass fiber board in example 2, and it can be seen from FIG. 6 that the nickel plating layer obtained by electroplating completely covers the surface of the substrate, and the plating layer is uniform and flat. The nickel coating is adhered by the 3M adhesive tape for 10 times, which indicates that the nickel coating has strong adhesive force on the epoxy glass fiber board.
Example 3:
s1: silver nanowires with the diameter of 60nm, polyvinyl alcohol and water are mixed according to the mass percentage of 0.25%: 7.46%: 92.29% A10 g quantity of conductive ink was prepared.
S2: and (3) coating the conductive ink in the S1 on a clean PI surface by using a No. 40 stainless steel wire rod, placing the PI surface in an oven at 120 ℃ for 3min, taking out the PI surface to obtain the metal nanowire-organic polymer conductive film, and measuring the surface sheet resistance by using a four-probe instrument.
S3: the treated PET in S2 was cut into a size of 10 cm. times.5 cm, and then directly placed in an electrolytic copper plating bath to be directly plated. The specific process is that PET is directly connected with the cathode of a direct current power supply,the anode is insoluble titanium mesh and is wrapped by filter paper, the total volume of the electroplating solution is 1L, the electroplating bath body is a self-made polypropylene electroplating bath, and the formula of the electroplating solution is 200g/L CuSO4·5H2O+30g/L H2SO4The plating condition is room temperature and the plating parameter is 1A/dm2And (4) electroplating for 10min, taking out the PI after electroplating is finished, washing the PI with clear water, and then drying the PI by blowing to obtain a copper coating, wherein in order to test the adhesive force of the coating on the insulating base material, a 3M adhesive tape is adopted for carrying out a sticking experiment.
In example 3, the sheet resistances of different positions on the conductive film in S2 were measured to be 15 Ω/sq, 20 Ω/sq, 23 Ω/sq and 18 Ω/sq in this order by using a four-probe apparatus, which indicates that the conductive film can be uniformly distributed on the surface of the insulating substrate, which is beneficial to the uniformity of the plating layer. Fig. 7 is an apparent morphology of the copper layer plated on PI in example 3, and it can be seen from fig. 7 that the copper layer is smooth and fine, and the copper layer remains intact after 3 times of 3M tape test, which indicates that the copper layer has a certain adhesion on PI.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the content of the present invention and implement the invention, and not to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the scope of the present invention.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (10)
1. A method for directly electroplating metal on the surface of an insulating substrate is characterized by comprising the following steps:
s1: preparation of conductive ink
Uniformly mixing the metal nanowire, the organic high-molecular polymer, a solvent and a surfactant according to a certain proportion to prepare the metal nanowire-organic high-molecular polymer conductive ink;
s2: coating the metal nanowire-organic high molecular polymer conductive ink in the S1 on the surface of an insulating base material, drying, and forming a uniform conductive film on the surface of the insulating base material, wherein the metal nanowire in the conductive film is used as an active site for subsequent electroplating;
s3: the insulating substrate covered with the conductive film obtained in S2 is placed in a plating solution to be directly plated.
2. The method of claim 1, wherein in step S1, the conductive ink comprises the following components by weight percent: metal nanowires: 0.01% -10%, organic high molecular polymer: 0.1% -20%, solvent: 70% -99.8%, surfactant: 0 to 5 percent.
3. The method for directly electroplating metal on the surface of the insulating substrate according to claim 2, wherein in step S1, the metal nanowires comprise one or more of silver nanowires, copper nanowires, gold nanowires and aluminum nanowires; preferably silver nanowires.
4. The method of claim 2, wherein in step S1, the organic polymer comprises one or more of poly (3, 4-ethylenedioxythiophene)/polystyrene sulfonate, polydimethylsiloxane, polyvinyl alcohol, cellulose, chitosan, polyvinylidene fluoride, polytetrafluoroethylene, polyethylene, polypropylene, polyvinyl chloride, polystyrene, ABS resin, polyester, polycarbonate, polyurethane, polyamide, polyimide, acrylic resin, epoxy resin, phenolic resin, UV resin, and polysulfone; preferably 3, 4-ethylenedioxythiophene/polystyrene sulfonate.
5. The method of claim 2, wherein in step S1, the solvent comprises one or more of water, ethanol, isopropanol, diethyl ether, toluene, xylene, pentane, cyclohexane, acetone, butanone, ethyl acetate, butyl acetate, N-dimethylformamide, and N-methylpyrrolidone; preferably water.
6. The method of claim 2, wherein in step S1, the surfactant comprises polyethylene glycol, polyoxyethylene ether, fatty alcohol amine, polyethylene glycol, sodium dodecyl sulfate, polyoxyethylene ester, oleate, and non-ionic fluorine-containing surfactant.
7. The method of claim 1, wherein in step S2, the insulating substrate is a planar substrate or a shaped substrate made of different materials;
preferably, the insulating substrate is selected from one of epoxy resin reinforced glass fiber cloth, non-woven fabric, glass fiber cloth, ceramic, silicon, wood substrate and organic polymer film;
preferably, the organic polymer film comprises polyethylene, polypropylene, polyimide, polyurethane, polyester, polycarbonate, polytetrafluoroethylene.
8. The method of claim 1, wherein in step S2, the coating process comprises one or more of blade coating, spin coating, dip coating, spray coating, micro-gravure printing, slit extrusion and screen printing, and the drying temperature is 60-300 ℃;
preferably, in step S2, the conductive film has a thickness of 0.1 μm to 20 μm.
9. The method of claim 1, wherein the step S3, the direct electroplating on the surface of the insulating substrate covered with the conductive film comprises any one of copper electroplating, cobalt electroplating, nickel electroplating, silver electroplating, gold electroplating, tin electroplating, zinc electroplating, aluminum electroplating or alloy electroplating.
10. A method for producing a printed wiring board, comprising the method for directly plating a metal on the surface of an insulating substrate according to any one of claims 1 to 9.
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