CN101486264A - Strippable ultrathin transfer carrier metal foil and method of manufacturing the same - Google Patents
Strippable ultrathin transfer carrier metal foil and method of manufacturing the same Download PDFInfo
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- CN101486264A CN101486264A CNA2009100372126A CN200910037212A CN101486264A CN 101486264 A CN101486264 A CN 101486264A CN A2009100372126 A CNA2009100372126 A CN A2009100372126A CN 200910037212 A CN200910037212 A CN 200910037212A CN 101486264 A CN101486264 A CN 101486264A
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Abstract
The invention relates to a strippable ultra-thin transfer vector metal foil, which comprises an ultra-thin metal foil with a thickness of between 0.1 and 9 microns and a strippable transfer adhesive film, wherein the transfer adhesive film is provided with a low-viscosity adhesive layer; the ultra-thin metal foil can be attached to the strippable transfer adhesive film through the low-viscosity adhesive layer; and the other surface of the ultra-thin metal foil is covered with a protective film. A method for manufacturing the strippable ultra-thin transfer vector metal foil comprises the following steps: (1) forming a bright matrix carrier band; (2) electrodepositing a metal on the bright matrix carrier band so as to form a strippable metal foil; and (3) jointing the transfer adhesive film on the metal foil, and taking off the metal foil and transferring the metal foil to the transfer adhesive film. The strippable ultra-thin transfer vector metal foil achieves the large scale production and use of the ultra-thin metal foil with a thickness of less than 0.1 to 9 microns. Simultaneously, the strippable ultra-thin transfer vector metal foil has the advantages of simple process, high production efficiency, recyclable bright matrix carrier band, low production cost, and broad market prospect.
Description
Technical field
The present invention relates to be applied to the metal forming technical field that circuit is made, be specially a kind of strippable ultrathin transfer carrier metal foil of tool and manufacture method thereof.
Background technology
Copper Foil is as the basic raw material of copper clad foil substrate, printed circuit board, along with the develop rapidly of electronics industry in the world wide.Along with the development of microelectric technique, the manufacturing fineness of circuit exceedes height more.Traditional Copper Foil manufacturing process can not adapt to present development of electronic technology requirement.At present, the conventional method of making Copper Foil has following two kinds:
1, calendering annealing method.At first heat brass chain, then they are sent in a series of cylinder, make them be reduced to the Copper Foil of appointed thickness.Rotation has generated the grain structure in the Copper Foil, and these grain structures look like on the horizontal plane of overlap joint.Under the effect of pressure and temperature, interact between the copper particle that varies in size, this has just formed Copper Foil such as functions such as ductility and hardness, has also produced a smooth surface simultaneously.Compare with electrolytic copper foil, the Copper Foil that this production technology is produced can bear bigger alternating bending.Yet its shortcoming is that cost is higher, and the thickness of Copper Foil and the washability of width are less.
2, electrolysis.Electrolytic copper foil is one of China's information industry important electron material, particularly printed circuit board, copper clad foil substrate industry base material raw material.The manufacturing of electrolytic copper foil is that copper ion is electroplated onto on the cylindrical cathode, then Copper Foil is constantly stripped down from above.Electrolytic copper foil is a columnar grain structure, particle separation when Copper Foil is bent, and this just makes when Copper Foil is crooked that it is flexible and the resistance to fracture ability is littler than the calendering annealed copper foil.Concrete technological process is: it is that copper is decomposed from sulfuric acid solution that electrolytic process begins, and controls resolution ratio by temperature and stirring.The profile of Copper Foil and mechanical property may be crossed and use dissimilar additives to be controlled.Copper solution constantly is injected in the electrolytic cell, and under the effect of electric current between electrolytic cell anode and the negative electrode, copper ion precipitate into cathode surface from chemical bath.Negative electrode is the cylindrical drum of a rotation, and it half is immersed in the solution.When negative electrode entered in the solution, copper began to be deposited on the surface of magnetic drum, and continuous electroplating leaves solution up to magnetic drum.When negative electrode continued rotation, Copper Foil was from cathodic disbonding.The rotary speed of negative electrode magnetic drum has determined the thickness of Copper Foil, but electrolytic process is difficult to produce the Copper Foil of thickness below 9 microns.
For the extra thin copper foil of thickness at 0.1～9 micron, because it is too thin, can't carry out artificial and machine operation smoothly with above conventional method, so extra thin copper foil is difficult to produce on a large scale and use at present, can't satisfy the demand that present technology is produced.
Summary of the invention
The objective of the invention is in order to overcome the deficiency that above-mentioned extra thin copper foil exists, providing can large-scale production and a kind of strippable ultrathin transfer carrier metal foil of use.
Another object of the present invention provides the manufacture method of a kind of strippable ultrathin transfer carrier metal foil of making above-mentioned ultra-thin carrier metal paper tinsel.
A kind of strippable ultrathin transfer carrier metal foil comprises super thin metal paper tinsel and strippable transfer glued membrane, shifts glued membrane and is provided with the low viscosity glue-line, and super thin metal paper tinsel and strippable transfer glued membrane are fitted and connected by the low viscosity glue-line.
Another is coated with diaphragm described super thin metal paper tinsel.Promptly be that reverse side at super thin metal paper tinsel and the peelable glued membrane of fitting is coated with diaphragm.
The thickness of described super thin metal paper tinsel is 0.1～9 micron.
Described super thin metal paper tinsel can Copper Foil, and diaphragm can be a fractal film.
A kind of manufacture method of strippable ultrathin transfer carrier metal foil, manufacturing step is as follows:
(1), forms bright matrix carrier band;
(2), on bright matrix carrier band electrodeposit metals, form strippable metal forming;
(3), glued membrane is shifted in applying on metal forming, metal forming is taken off being transferred on the transfer glued membrane.
Described bright matrix carrier band is made up of base layer, vacuum-coating and surface metal bright layer, and the minimum side surface of base layer carries out vacuum sputtering and plates vacuum-coating, the vacuum-coating deposition surface metal polish layer that powers on.
Described vacuum-coating is the vacuum magnetic-control sputtering nickel dam.
Described surface metal bright layer can be electroless nickel layer, electrodeposited chromium layers or electronickelling chromium alloy layer, and reflecting rate is at 40-90%.
The preparation method of described bright matrix carrier band is as follows:
1., matrix is carried out surface treatment, making its surface tension is the 40-90 dyne;
2., carry out vacuum sputtering at the matrix single or double and plate vacuum-coating;
3., carry out the light processing on the surface of vacuum-coating, formation surface metal bright layer.
The present invention is by depositing ultrathin metal forming on bright matrix carrier band, extra thin copper foil particularly, and then be transferred in the transfer glued membrane with low viscosity glue-line by shifting to take off after glued membrane is fitted the super thin metal paper tinsel, realized the large-scale production and the use of 0.1～9 micron extra thin copper foil.Simultaneously technology is simple, and production efficiency height, bright matrix carrier band can single faces or two-sided recycling, and production cost is low, has vast market prospect.
Description of drawings
Fig. 1 is a kind of strippable ultrathin transfer carrier metal foil structural representation of the present invention;
Fig. 2 is bright matrix carrier band structural representation;
Fig. 3 is the structural representation behind the plated metal on the bright matrix carrier band;
Fig. 4 shifts the structural representation that glued membrane shifts the super thin metal paper tinsel for fitting.
The specific embodiment
The present invention will be described in detail below in conjunction with the drawings and specific embodiments.
A kind of strippable ultrathin transfer carrier metal foil comprises super thin metal paper tinsel 4 and strippable transfer glued membrane 5, shifts glued membrane 5 and is provided with low viscosity glue-line 6, and super thin metal paper tinsel 4 is fitted and connected with strippable transfer glued membrane 6.Between super thin metal paper tinsel 4 and the transfer glued membrane 5 is one deck low viscosity glue-line 6, can peel off more easily between low viscosity glue-line 6 and the super thin metal paper tinsel 4, so that the transfer of super thin metal paper tinsel 4.The thickness of super thin metal paper tinsel is 0.1～9 micron.What super thin metal paper tinsel 4 was generally with the most use is extra thin copper foil, also can be nickel foil, silver foil or goldleaf etc.In order to protect the opposite side surface of super thin metal paper tinsel 4, be coated with diaphragm 7 in its surface.Diaphragm can be one deck fractal film.
A kind of manufacture method of strippable ultrathin transfer carrier metal foil, manufacturing step is as follows:
((1), the bright matrix carrier band of formation;
(2), on bright matrix carrier band electrodeposit metals, form strippable metal forming;
(3), glued membrane is shifted in applying on metal forming, metal forming is taken off being transferred on the transfer glued membrane.
Metal forming covers a leafing shape diaphragm in exposed metal foil surface after being transferred to and shifting glued membrane, with protection metal forming outer surface, avoids the surface phenomenon of oxidation to occur.Can carry out processing such as alligatoring, shearing, packing at last.
Light matrix carrier band is made up of base layer, vacuum-coating and surface metal bright layer, and the minimum side surface of base layer carries out vacuum sputtering and plates the vacuum nickel coating, the vacuum nickel coating deposition surface metal polish layer that powers on.The surface metal bright layer can be electroless nickel layer, electrodeposited chromium layers or electronickelling chromium alloy layer, and reflecting rate is at 40-90%.Base layer can be PETG (PET), PEI (PEI), PEN (PEN) or aluminium foil.
The preparation method of described bright matrix carrier band is as follows:
1., base layer is carried out surface treatment, making its surface tension is the 40-90 dyne;
2., carry out vacuum sputtering at the minimum side surface of base layer and plate vacuum-coating;
3., carry out the light processing on the surface of vacuum-coating, formation surface metal bright layer.
Embodiment 1
Base layer is selected PET for use, and the pet sheet face is carried out surface treatment, and making the surface tension after the processing is the 40-90 dyne.The surface-treated mode can be that corona, chemical treatment and/or ion gun are handled.Wherein, the process conditions handled of ion gun can be: in vacuum 3.0 * 10
-1～1.0 * 10
-3The vacuum state of pa, argon tolerance 10～1000SCCM, electron energy scope 100～1500ev, 1～30 minute processing time.At pet sheet face vacuum volume to volume splash-proofing sputtering metal nickel dam, process conditions are: vacuum (or absolute pressure value) 0.1～1Pa, voltage :-300V～-600V (DC), electric current: 50～200A, argon flow amount: 100～500sccm, base band speed: 0.1～1.5m/min, metallic nickel laminar surface conduction resistance is that 1 ohm～20 kilohms, adhesive force are the 0.4-0.9 kilogram.Carry out the light processing at the metallic nickel laminar surface, form the surface metal bright layer, make its surface bright as bright mirror, brightness can be peeled off smoothly to guarantee follow-up plated metal paper tinsel between 40%-90%.The lightization processing can realize by the electrodeposit metals layer.Can be at splash-proofing sputtering metal laminar surface electro-deposition nickel dam, chromium layer or nichrome layer etc.The process conditions of electro-deposition nickel dam are as follows: nickelous sulfate 200～300g/l, nickel chloride 40～60g/l, boric acid 30～60g/l, lauryl sodium sulfate 0.5～1ml/l, key light agent 0.5～1ml/l, PH3.8～5.0, current density 0.1～10A/dm
2, 40～55 ℃ of temperature.Wherein, the key light agent can be selected a kind of or two kinds of sums among Ce (SO4) 2, Te (SO4) 2, AgNO3, the CdSO4 for use.Above processing step has formed bright matrix carrier band, and bright matrix carrier band can use by single face, also two-sided use can be set.At bright matrix carrier band electro-deposition extra thin copper foil, the technology of electro-deposition extra thin copper foil: copper sulphate 11g～13g/l, sulfur acid 105～220g/l electrolyte, be heated to 20～25 ℃, apply current density 2～5A/dm for bright matrix carrier band
2DC current, tape running speed are 1～20m/h, and through at least 1 grade of washing, washing is after 50～80 ℃ of hot-air seasonings promptly form strippable extra thin copper foil 4 on bright matrix carrier band surface.On extra thin copper foil 4, fit to shift glued membrane 5, after smoothing extra thin copper foil 4 taken off to be transferred to and shift on the glued membrane 5, then at extra thin copper foil 4 surface coverage upper protective films 7.Cut out at last, processing such as clot packing.
Embodiment 2
Base layer selects for use the process of surface treatment of PEI, PEN or aluminium foil identical with PET.The making of light matrix carrier band is identical with embodiment 1.Different is the technology of electro-deposition extra thin copper foil.The technology of electro-deposition extra thin copper foil is as follows: cupric pyrophosphate 50～80g/l, pyrophosphoric acid first 250～350g/l, ammonium citrate 20～30g/l electrolyte, pH=8.0～8.5.30～50 ℃ of operating temperatures apply current density 0.5～1.0A/dm for bright matrix carrier band
2DC current, tape running speed are 0.5～15m/h, and through at least 1 grade of washing, washing is after 50～80 ℃ of hot-air seasonings promptly form strippable extra thin copper foil 4 at bright matrix carrier band.
The present invention has realized the large-scale production and the use of 0.1～9 micron extra thin copper foil, has vast market prospect.
Claims (9)
1, a kind of strippable ultrathin transfer carrier metal foil is characterized in that: comprise super thin metal paper tinsel and strippable transfer glued membrane, shift glued membrane and be provided with the low viscosity glue-line that super thin metal paper tinsel and strippable transfer glued membrane are fitted and connected by the low viscosity glue-line.
2, a kind of strippable ultrathin transfer carrier metal foil as claimed in claim 1 is characterized in that: described another surface coverage of super thin metal paper tinsel has diaphragm.
3, a kind of strippable ultrathin transfer carrier metal foil as claimed in claim 1 is characterized in that: the thickness of described super thin metal paper tinsel is 0.1～9 micron.
4, a kind of strippable ultrathin transfer carrier metal foil as claimed in claim 1 is characterized in that: described super thin metal paper tinsel is a Copper Foil, and diaphragm is a fractal film.
5, a kind of manufacture method of strippable ultrathin transfer carrier metal foil, manufacturing step is as follows:
(1), forms bright matrix carrier band;
(2), on bright matrix carrier band electrodeposit metals, form strippable metal forming;
(3), glued membrane is shifted in applying on metal forming, metal forming is taken off being transferred on the transfer glued membrane.
6, the manufacture method of a kind of strippable ultrathin transfer carrier metal foil as claimed in claim 5, it is characterized in that: described bright matrix carrier band is made up of base layer, vacuum-coating and surface metal bright layer, the minimum side surface of base layer carries out vacuum sputtering and plates vacuum-coating, the vacuum-coating deposition surface metal polish layer that powers on.
7, the manufacture method of a kind of strippable ultrathin transfer carrier metal foil as claimed in claim 6 is characterized in that: described vacuum-coating is the vacuum magnetic-control sputtering nickel dam.
8, the manufacture method of a kind of strippable ultrathin transfer carrier metal foil as claimed in claim 6 is characterized in that: described surface metal bright layer is electroless nickel layer, electrodeposited chromium layers or electronickelling chromium alloy layer, and reflecting rate is at 40-90%.
9, a kind of preparation method of bright matrix carrier band, its making step is as follows:
1., matrix is carried out surface treatment, making its surface tension is the 40-90 dyne;
2., carry out vacuum sputtering at the minimum side surface of matrix and plate vacuum-coating;
3., carry out the light processing on the surface of vacuum-coating, formation surface metal bright layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100372126A CN101486264A (en) | 2009-02-17 | 2009-02-17 | Strippable ultrathin transfer carrier metal foil and method of manufacturing the same |
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2009100372126A CN101486264A (en) | 2009-02-17 | 2009-02-17 | Strippable ultrathin transfer carrier metal foil and method of manufacturing the same |
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| CN101486264A true CN101486264A (en) | 2009-07-22 |
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| CNA2009100372126A Pending CN101486264A (en) | 2009-02-17 | 2009-02-17 | Strippable ultrathin transfer carrier metal foil and method of manufacturing the same |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711428A (en) * | 2012-06-21 | 2012-10-03 | 广州方邦电子有限公司 | Ultrathin shielding film with high shielding efficiency and production method thereof |
| CN104532195A (en) * | 2014-12-30 | 2015-04-22 | 深圳市联星服装辅料有限公司 | Nylon zipper with reflective colorful effect and manufacture method |
| CN107660108A (en) * | 2017-10-25 | 2018-02-02 | 广东欧珀移动通信有限公司 | The metal foil method for sticking and covering of metal foil members and mobile terminal |
| CN107946596A (en) * | 2016-10-12 | 2018-04-20 | Ls美创有限公司 | Easy-to-handle electrolytic copper foil including its electrode and secondary cell and its manufacture method |
| CN111251512A (en) * | 2018-12-03 | 2020-06-09 | 通用电气公司 | Method of forming a cured tool and method of forming a textured surface using a cured tool |
| CN113022048A (en) * | 2019-12-24 | 2021-06-25 | 广州方邦电子股份有限公司 | Composite metal foil, flexible foil-clad plate and preparation method of flexible foil-clad plate |
-
2009
- 2009-02-17 CN CNA2009100372126A patent/CN101486264A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711428A (en) * | 2012-06-21 | 2012-10-03 | 广州方邦电子有限公司 | Ultrathin shielding film with high shielding efficiency and production method thereof |
| WO2013188997A1 (en) * | 2012-06-21 | 2013-12-27 | 广州方邦电子有限公司 | Ultrathin shielding film of high shielding effectiveness and manufacturing method therefor |
| CN102711428B (en) * | 2012-06-21 | 2015-11-18 | 广州方邦电子有限公司 | Ultra-thin shielding film of a kind of high screening effectiveness and preparation method thereof |
| US9526195B2 (en) | 2012-06-21 | 2016-12-20 | Guangzhou Fang Bang Electronics Co., Ltd. | Ultrathin shielding film of high shielding effectiveness and manufacturing method thereof |
| CN104532195A (en) * | 2014-12-30 | 2015-04-22 | 深圳市联星服装辅料有限公司 | Nylon zipper with reflective colorful effect and manufacture method |
| CN107946596A (en) * | 2016-10-12 | 2018-04-20 | Ls美创有限公司 | Easy-to-handle electrolytic copper foil including its electrode and secondary cell and its manufacture method |
| CN107660108A (en) * | 2017-10-25 | 2018-02-02 | 广东欧珀移动通信有限公司 | The metal foil method for sticking and covering of metal foil members and mobile terminal |
| CN111251512A (en) * | 2018-12-03 | 2020-06-09 | 通用电气公司 | Method of forming a cured tool and method of forming a textured surface using a cured tool |
| CN111251512B (en) * | 2018-12-03 | 2022-03-25 | 通用电气公司 | Method of forming a cured tool and method of forming a textured surface using a cured tool |
| CN113022048A (en) * | 2019-12-24 | 2021-06-25 | 广州方邦电子股份有限公司 | Composite metal foil, flexible foil-clad plate and preparation method of flexible foil-clad plate |
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Application publication date: 20090722 |