CN100449770C - 写入集成磁阻半导体存储阵列的磁阻存储单元的方法 - Google Patents
写入集成磁阻半导体存储阵列的磁阻存储单元的方法 Download PDFInfo
- Publication number
- CN100449770C CN100449770C CNB02808151XA CN02808151A CN100449770C CN 100449770 C CN100449770 C CN 100449770C CN B02808151X A CNB02808151X A CN B02808151XA CN 02808151 A CN02808151 A CN 02808151A CN 100449770 C CN100449770 C CN 100449770C
- Authority
- CN
- China
- Prior art keywords
- selection wire
- reads
- line plane
- memory units
- write
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 claims description 14
- 238000009413 insulation Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000002955 isolation Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002650 habitual effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
- G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1675—Writing or programming circuits or methods
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Hall/Mr Elements (AREA)
Abstract
Description
Claims (2)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10118197.3 | 2001-04-11 | ||
DE10118197A DE10118197C2 (de) | 2001-04-11 | 2001-04-11 | Integrierte magnetoresistive Halbleiterspeicheranordnung und Verfahren zum Beschreiben derselben |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1502136A CN1502136A (zh) | 2004-06-02 |
CN100449770C true CN100449770C (zh) | 2009-01-07 |
Family
ID=7681297
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB02808151XA Expired - Fee Related CN100449770C (zh) | 2001-04-11 | 2002-04-05 | 写入集成磁阻半导体存储阵列的磁阻存储单元的方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6897101B2 (zh) |
JP (1) | JP2005501396A (zh) |
KR (1) | KR100570197B1 (zh) |
CN (1) | CN100449770C (zh) |
DE (1) | DE10118197C2 (zh) |
WO (1) | WO2002084706A2 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6735111B2 (en) * | 2002-01-16 | 2004-05-11 | Micron Technology, Inc. | Magnetoresistive memory devices and assemblies |
US6498747B1 (en) * | 2002-02-08 | 2002-12-24 | Infineon Technologies Ag | Magnetoresistive random access memory (MRAM) cross-point array with reduced parasitic effects |
JP2006501587A (ja) * | 2002-05-22 | 2006-01-12 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 磁気抵抗メモリセルアレイとこのアレイを含むmramメモリ |
US7376004B2 (en) * | 2003-09-11 | 2008-05-20 | Samsung Electronics Co., Ltd. | Increased magnetic memory array sizes and operating margins |
US7366009B2 (en) | 2004-01-10 | 2008-04-29 | Honeywell International Inc. | Separate write and read access architecture for a magnetic tunnel junction |
EP1630882B1 (en) * | 2004-08-31 | 2012-05-02 | STMicroelectronics S.r.l. | Nanometric structure and corresponding manufacturing method |
EP1630881B1 (en) * | 2004-08-31 | 2011-11-16 | STMicroelectronics Srl | Hosting structure of nanometric elements and corresponding manufacturing method |
JP2006120824A (ja) * | 2004-10-21 | 2006-05-11 | Renesas Technology Corp | 磁気記憶装置 |
US7257019B2 (en) * | 2005-11-17 | 2007-08-14 | Macronix International Co., Ltd. | Systems and methods for a magnetic memory device that includes a single word line transistor |
KR102641744B1 (ko) | 2017-01-20 | 2024-03-04 | 삼성전자주식회사 | 가변 저항 메모리 소자 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1061592A2 (en) * | 1999-06-17 | 2000-12-20 | Matsushita Electric Industrial Co., Ltd. | Magneto-resistance effect element, and its use as memory element |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5587943A (en) * | 1995-02-13 | 1996-12-24 | Integrated Microtransducer Electronics Corporation | Nonvolatile magnetoresistive memory with fully closed flux operation |
US5640343A (en) * | 1996-03-18 | 1997-06-17 | International Business Machines Corporation | Magnetic memory array using magnetic tunnel junction devices in the memory cells |
TW411471B (en) * | 1997-09-17 | 2000-11-11 | Siemens Ag | Memory-cell device |
US6211559B1 (en) * | 1998-02-27 | 2001-04-03 | Motorola, Inc. | Symmetric magnetic tunnel device |
US6567287B2 (en) * | 2001-03-21 | 2003-05-20 | Matrix Semiconductor, Inc. | Memory device with row and column decoder circuits arranged in a checkerboard pattern under a plurality of memory arrays |
US6713378B2 (en) * | 2000-06-16 | 2004-03-30 | Micron Technology, Inc. | Interconnect line selectively isolated from an underlying contact plug |
US6515888B2 (en) * | 2000-08-14 | 2003-02-04 | Matrix Semiconductor, Inc. | Low cost three-dimensional memory array |
US6624011B1 (en) * | 2000-08-14 | 2003-09-23 | Matrix Semiconductor, Inc. | Thermal processing for three dimensional circuits |
US6627530B2 (en) * | 2000-12-22 | 2003-09-30 | Matrix Semiconductor, Inc. | Patterning three dimensional structures |
US6791868B2 (en) * | 2003-01-02 | 2004-09-14 | International Business Machines Corporation | Ferromagnetic resonance switching for magnetic random access memory |
US7190611B2 (en) * | 2003-01-07 | 2007-03-13 | Grandis, Inc. | Spin-transfer multilayer stack containing magnetic layers with resettable magnetization |
-
2001
- 2001-04-11 DE DE10118197A patent/DE10118197C2/de not_active Expired - Fee Related
-
2002
- 2002-04-05 WO PCT/DE2002/001256 patent/WO2002084706A2/de active Application Filing
- 2002-04-05 CN CNB02808151XA patent/CN100449770C/zh not_active Expired - Fee Related
- 2002-04-05 KR KR1020037013171A patent/KR100570197B1/ko not_active IP Right Cessation
- 2002-04-05 JP JP2002581558A patent/JP2005501396A/ja active Pending
-
2003
- 2003-10-14 US US10/685,064 patent/US6897101B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1061592A2 (en) * | 1999-06-17 | 2000-12-20 | Matsushita Electric Industrial Co., Ltd. | Magneto-resistance effect element, and its use as memory element |
Non-Patent Citations (2)
Title |
---|
Magneto-resistive IC memory limitations and architectureimplications. Scheuerlein, R.E.Nonvolatile Memory Technology Conference, 1998. 1998 Proceedings. Seventh Biennial IEEE ALBUQUERQUE, NM, USA. 1998 |
Magneto-resistive IC memory limitations and architectureimplications. Scheuerlein, R.E.Nonvolatile Memory Technology Conference, 1998. 1998 Proceedings. Seventh Biennial IEEE ALBUQUERQUE, NM, USA. 1998 * |
Also Published As
Publication number | Publication date |
---|---|
DE10118197C2 (de) | 2003-04-03 |
US6897101B2 (en) | 2005-05-24 |
KR20030088126A (ko) | 2003-11-17 |
WO2002084706A2 (de) | 2002-10-24 |
DE10118197A1 (de) | 2002-10-24 |
JP2005501396A (ja) | 2005-01-13 |
CN1502136A (zh) | 2004-06-02 |
US20040087134A1 (en) | 2004-05-06 |
WO2002084706A3 (de) | 2003-05-30 |
KR100570197B1 (ko) | 2006-04-11 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: Munich, Germany Patentee after: Infineon Technologies AG Address before: Munich, Germany Patentee before: INFINEON TECHNOLOGIES AG |
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TR01 | Transfer of patent right |
Effective date of registration: 20120928 Address after: Munich, Germany Patentee after: QIMONDA AG Address before: Munich, Germany Patentee before: Infineon Technologies AG |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20151223 Address after: German Berg, Laura Ibiza Patentee after: Infineon Technologies AG Address before: Munich, Germany Patentee before: QIMONDA AG |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090107 Termination date: 20160405 |