CN100431122C - 连接构件的制造方法 - Google Patents

连接构件的制造方法 Download PDF

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CN100431122C
CN100431122C CNB031079520A CN03107952A CN100431122C CN 100431122 C CN100431122 C CN 100431122C CN B031079520 A CNB031079520 A CN B031079520A CN 03107952 A CN03107952 A CN 03107952A CN 100431122 C CN100431122 C CN 100431122C
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anisotropic conductive
splicing ear
bonding agent
heating
connecting elements
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筱崎润二
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Dexerials Corp
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Abstract

在制造将相对的连接端子通过各向异性导电性粘接剂电气连接的连接构件中，使气泡的卷入减少，另外使连接端子间确实捕集到各向异性导电性粘接剂的导电性粒子。在第1连接端子(电路基板的连接端子(3))上面，将第2连接端子(半导体元件的连接端子(6))通过介入热固型各向异性导电性粘接剂(各向异性导电性膜(4))对置，通过边加热硬化热固型各向异性导电性粘接剂边推压第2连接端子而得到第1连接端子和第2连接端子电气连接的连接构件，在该连接构件的制造方法中，第2连接端子的推压速度为5-50mm/分，且在通过加热硬化热固型各向异性导电性粘接剂的粘度达到107Pa·s之前，使第1连接端子和第2连接端子通过介入热固型各向异性导电性粘接剂中的导电粒子接触。

Description

连接构件的制造方法
技术领域
本发明涉及将电路基板的连接端子与实装于其中的电子零件的连接端子那样的相对的连接端子通过各向异性导电性粘接剂电气连接的连接构件的制造方法。
背景技术
作为将半导体元件等电子零件连接到电路基板的方法之一，有通过介入使导电性粒子分散在热固型绝缘性粘接剂中而形成的各向异性导电性粘接剂，加热加压电子零件的连接端子和电路基板的连接端子的方法。
这种方法，通常如图1(a)所示那样，将电路基板2载置到台子1上，在电路基板2的连接端子3上重叠膜状成形的各向异性导电性粘接剂(各向异性导电性膜4)，或通过涂敷糊状的各向异性导电性粘接剂形成热固型各向异性导电性粘接剂层，并在其上配置半导体元件5并使该半导体元件的连接端子6面向电路基板2侧，将半导体元件5通过粘合器等加热加压装置7进行推压。这样，如图1(b)所示，进行将双方连接端子3、6电气连接的暂时压接。图中，符号8为热固型绝缘性粘接剂，符号9为导电性粒子。
接着，将其用同样的加热加压装置加热加压，进行正式压接，再用加热炉进行后硬化。
发明内容
但是，上述方法如图2所示那样，暂时压接的加热加压时，容易卷入气泡10，由于气泡10造成电路基板2和半导体元件5的粘合力下降，有时电路基板2或半导体元件5会产生剥离，产生连接不良。
另外，如果半导体元件5的连接端子6或电路基板2的连接端子3的图案微细化、双方的连接端子3、6的叠接面积变小，在这样的连接端子3、6之间夹入导电性粒子9会变难。因此，如图3所示那样，半导体元件5的连接端子6和电路基板2的连接端子3之间不能充分的夹入导电性粒子9而粘接半导体元件5和电路基板2，有时产生连接不良的问题。
相对于此，本发明的目的是，在制造将电路基板的连接端子和实装于此的半导体元件的连接端子那样的相对的连接端子通过各向异性导电性粘接剂电气连接的连接构件时，减少气泡的卷入、且在连接端子之间能确实捕集到各向异性导电性粘接剂的导电性粒子、提高导电可靠性。
本发明人发现，在通过介入热固型各向异性导电性粘接剂加热加压相对连接端子的制造方法中，通过将加热加压时的连接端子的推压速度控制在特定范围内，可减少气泡、提高连接端子间捕集到的导电性粒子的数量。
即，本发明提供一种连接构件的制造方法，在第1连接端子上面，通过介入热固型各向异性导电性粘接剂对置第2连接端子，通过一边加热硬化热固型各向异性导电性粘接剂一边推压第2连接端子而获得第1连接端子和第2连接端子电气连接的连接构件，这种连接构件制造方法的特征在于，第2连接端子的推压速度为5-50mm/分，且通过加热硬化，热固型各向异性导电性粘接剂的粘度达到107Pa·s之前，使第1连接端子和第2连接端子通过介入热固型各向异性导电性粘接剂而接触。
依据本发明，制造将相对的连接端子通过各向异性导电性粘接剂电气连接的连接构件时，由于能够减少气泡的卷入、且增加连接端子间所捕集到的各向异性导电性粘接剂的导电性粒子的数量，所以连接构件的粘合性、导通可靠性提高。
另外，由于连接端子间所捕集到的各向异性导电性粘接剂的导电性粒子的数量增加，因此即使减小各向异性导电性粘接剂中的导电性粒子的浓度，也能确保导通可靠性，所以能够降低连接构件的制造成本。
附图说明
图1为使用各向异性导电性粘接剂的连接构件的制造方法说明图。
图2为具有气泡的连接构件的截面图。
图3为相对的连接端子之间没有充分的捕集到导电性粒子的连接构件的截面图。
图4为在规定的温度下加热各向异性导电性膜时的时间与粘度的关系图。
具体实施方式
以下参照附图详细说明本发明。另外，各图中的同一符号表示同一或同等的构成元件。
在本发明的连接构件的制造方法中，例如，相互连接的第1连接端子是在电路基板上所形成的连接端子，在第2连接端子是IC等半导体元件的连接端子的情况下，与图1所示的众所周知的方法一样，首先在台子1上载置电路基板2，在电路基板2的连接端子3上重叠各向异性导电性膜4，或通过涂敷糊状的各向异性导电性粘接剂形成热固型各向异性导电性粘接剂层，在其上面配置半导体元件5并使该半导体元件的连接端子6面向电路基板2的一侧，用粘合器等的加压加热装置7推压半导体元件5。这时，可以仅靠推压半导体元件5的加热加压装置7加热各向异性导电性膜4，也可以根据需要在台子1上设置加热器加热。
根据本发明人的见解，各向异性导电性膜4，如图4所示那样，一般在加热前有108～109Pa·s的粘度，但如果加热到规定温度以上，伴随着温度的上升，粘度大约下降到104～105Pa·s(最低熔融粘度)，其后，随着硬化反应的进行，粘度大约上升到107～108Pa·s。另外，该粘度是用熔融粘度特性测定器(流变仪)通过测定旋转所形成的切变速度所得到的数值。
因此，边用加热加压装置7加热硬化各向异性导电性膜4边推压半导体元件5时，如果推压速度过快，由于在各向异性导电性膜4的粘度上升之前，连接端子3、6之间已经有推压力作用，因此，导电性粒子9同热固型绝缘性粘接剂8一起从连接端子3、6之间被排除，在连接端子3、6之间捕集不到导电性粒子9，产生连接不良。因此，本发明中半导体元件5的推压速度为50mm/分以下，优选为20mm/分以下，在连接端子3、6之间可以可靠捕集导电性粒子9。
相反，如果推压速度过慢，在连接端子3、6通过介入导电性粒子9接触前，各向异性导电性膜4的硬化反应已经进行，粘度大约上升到107～108Pa·s。因此，不能使连接端子3、6通过介入导电性粒子9而接触，产生连接不良。因此，本发明的要点是，在各向异性导电性膜4通过加热硬化、粘度达到107Pa·s前，使连接端子3、6通过介入导电性粒子9而接触。
在各向异性导电性膜4通过加热硬化、粘度达到107Pa·s前，使连接端子3、6通过介入导电性粒子9而接触的具体方法有，如，如果各向异性导电性膜4的粘度在规定的加热温度下，从最低熔融粘度通过硬化反应达到107Pa·s所要的时间为t分，通过介入各向异性导电性膜4对置电路基板2和半导体元件5时的、电路基板2的连接端子3与半导体元件5的连接端子6的距离为dmm，则推压速度为d/t以上。
作为加热加压时的条件，除此以外优选的是使各向异性导电性膜4经由最低熔融粘度而硬化地加热各向异性导电性膜4。如果不经由最低熔融粘度而加热，硬化反应进行得不彻底。
为使各向异性导电性膜4经由最低熔融粘度而加热所必要的加热温度，虽然根据各向异性导电性膜4的种类、加热方法等的不同而有所不同，但如果如图1所示那样，用加热加压装置7通过半导体元件5加热各向异性导电性膜4时，通常加热加压装置7的优选加热温度是50～120℃、特别是60～90℃。
本发明中，作为各向异性导电性粘接剂，虽然只要是热固型并无特别限定，但是从相对的连接端子间能够确实捕集到导电性粒子角度出发，还是优选最低熔融粘度为104Pa·s以上、特别是105Pa·s以上。另外，作为各向异性导电性粘接剂，构成各向异性导电性粘接剂的热固型绝缘性粘接剂，优选的是由至少一种以上的环氧类树脂成分和含有碱性氮的硬化剂成分构成。作为构成各向异性导电性粘接剂的导电性粒子，可以使用软钎料粒子、镍粒子等金属料粒子、或用金属被覆树脂芯表面的金属被覆粒子等。
本发明中，用热固型各向异性导电性粘接剂相互连接的连接端子，不限于上述那样的电路基板的连接端子和半导体元件的连接端子。例如本发明也可适用于连接电路基板之间等。
实施例
试验例1～20
将IC芯片(外形6.3mm的四角形，突起大小为45μm的四角形，突起高度为20μm、突起节距为85μm)，在柔性印刷基板上(连接端子的图案宽30μm、图案节距85μm、图案高度13μm)，用各向异性导电性膜(ACF)从IC芯片一侧通过用粘合器加热加压暂时压接，之后在190℃下加热10秒钟进行正式压接，得到连接构件。
这时，如表1所示那样，改变各向异性导电性膜的种类、暂时压接时的粘合器的加热温度及利用粘合器的IC芯片的推压速度。
表1中也展示了各试验例中所用到的各向异性导电性膜的最低熔融粘度。
另外，调查了各试验例中所用到的各向异性导电性膜在各试验例中的加热温度下，通过硬化反应，从最低熔融粘度达到107Pa·s所要的时间t，另一方面，测定了介入各向异性导电性膜使柔性印刷基板与IC芯片对置时的、柔性印刷基板的连接端子的图案和IC芯片的粘合器之间的距离d，并算出d/t的值，示于表1中。
评价
(1)导电粒子的捕集数：通过显微镜观察在各试验例中所得到的连接构件，调查柔性印刷基板的连接端子的图案和IC芯片的突起之间所捕集到的导电性粒子的数量，求每个试验例中的每一个突起的捕集数的平均值。
(2)气泡：通过显微镜观察在各试验例中所得到的连接构件，调查气泡的有无，以以下的基准评价。
○：少
△：较少
×：多
(3)导通可靠性：将在各试验例中所得到的连接构件进行加压蒸煮试验(PCT)(加压蒸煮试验：105℃、100％RH、12小时)，测定其前后的导通电阻，求加压蒸煮试验所形成的导通电阻的变化量，导通可靠性以以下基准评价。
○：导通电阻的变化量未满50mΩ
△：导通电阻的变化量50mΩ以上未满100mΩ
×：导通电阻的变化量100mΩ以上
这些结果示于表1中。
表1
Figure C0310795200081
ACF树脂
·各向异性导电膜A：导电性粒子含有量10vol％、绝缘性粘接剂：苯氧基树脂16重量份、环氧树脂76重量份、咪唑8重量份
·各向异性导电膜B：导电性粒子含有量10vol％、绝缘性粘接剂：苯氧基树脂27重量份、环氧树脂65重量份、咪唑8重量份
·各向异性导电膜C：导电性粒子含有量10vol％、绝缘性粘接剂：苯氧基树脂35重量份、环氧树脂57重量份、咪唑8重量份
·各向异性导电膜D：导电性粒子含有量6vol％、绝缘性粘接剂：苯氧基树脂35重量份、环氧树脂57重量份、咪唑8重量份
·各向异性导电膜E：导电性粒子含有量4vol％、绝缘性粘接剂：苯氧基树脂35重量份、环氧树脂57重量份、咪唑8重量份
(*1)由于各向异性导电性膜的加热不充分，加热加压操作中，各向异性导电性膜没有到达其固有的103Pa·s的最低熔融粘度。
(*2)由于各向异性导电性膜的加热不充分，加热加压操作中，各向异性导电性膜没有到达其固有的104Pa·s的最低熔融粘度。
(*3)由于各向异性导电性膜的加热不充分，加热加压操作中，各向异性导电性膜没有到达其固有的105Pa·s的最低熔融粘度。
从表1的结果可知，推压速度为100mm/分快时(试验No.1～4)导电性粒子的捕集数少，导通可靠性低。
另外，推压速度为3mm/分慢时(试验No.20)，在IC芯片的突起和柔性印刷基板的连接端子的图案通过介入导电性粒子接触前，各向异性导电性膜的硬化已经进行，导通可靠性变低。
还有，推压速度为20mm/分时，使加热温度为50～100℃时，能获得良好的导通可靠性，但是加热温度为120℃时，反应速度提高，结果推压速度变得比d/t还慢，在IC芯片的突起和柔性印刷基板的连接端子的图案通过介入导电粒子接触之前，各向异性导电性膜的硬化已经进行，导通可靠性变低(试验No.12、14、16)。

Claims (4)

1.一种连接构件的制造方法，该连接构件的制造方法是，在第1连接端子上面，通过介入热固型各向异性导电性粘接剂对置第2连接端子，通过一边加热硬化热固型各向异性导电性粘接剂一边推压第2连接端子而得到第1连接端子和第2连接端子电气连接的连接构件，其特征在于，第2连接端子的推压速度为5-50mm/分，且通过加热硬化，在热固型各向异性导电性粘接剂的粘度经由最低熔融粘度达到107Pa·s之前，使第1连接端子和第2连接端子通过介入热固型各向异性导电性粘接剂中的导电性粒子而接触。
2.如权利要求1所述的连接构件的制造方法，其特征在于，推压速度为5-20mm/分。
3.如权利要求1或2所述的连接构件的制造方法，其特征在于，热固型各向异性导电性粘接剂的加热温度为50℃～100℃。
4.如权利要求1或2所述的连接构件的制造方法，其特征在于，粒子的捕集数为3，3.5，5，6，7，8或9个/(45μm)2。
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