CN100421862C - 钎焊膏焊剂体系 - Google Patents

钎焊膏焊剂体系 Download PDF

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Publication number
CN100421862C
CN100421862C CNB038182203A CN03818220A CN100421862C CN 100421862 C CN100421862 C CN 100421862C CN B038182203 A CNB038182203 A CN B038182203A CN 03818220 A CN03818220 A CN 03818220A CN 100421862 C CN100421862 C CN 100421862C
Authority
CN
China
Prior art keywords
component
flux composition
rosin
solder
flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB038182203A
Other languages
English (en)
Chinese (zh)
Other versions
CN1671506A (zh
Inventor
B·阿扎多
A·D·普里塞
L·J·塞奎伊拉
L·霍泽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alpha Assembly Solutions Inc
Original Assignee
Frys Metals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Frys Metals Inc filed Critical Frys Metals Inc
Publication of CN1671506A publication Critical patent/CN1671506A/zh
Application granted granted Critical
Publication of CN100421862C publication Critical patent/CN100421862C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CNB038182203A 2002-05-30 2003-05-30 钎焊膏焊剂体系 Expired - Fee Related CN100421862C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/158,251 2002-05-30
US10/158,251 US20030221748A1 (en) 2002-05-30 2002-05-30 Solder paste flux system

Publications (2)

Publication Number Publication Date
CN1671506A CN1671506A (zh) 2005-09-21
CN100421862C true CN100421862C (zh) 2008-10-01

Family

ID=29582626

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038182203A Expired - Fee Related CN100421862C (zh) 2002-05-30 2003-05-30 钎焊膏焊剂体系

Country Status (6)

Country Link
US (1) US20030221748A1 (enExample)
EP (1) EP1509358A4 (enExample)
JP (1) JP4461009B2 (enExample)
CN (1) CN100421862C (enExample)
AU (1) AU2003232444A1 (enExample)
WO (1) WO2003101661A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109014656A (zh) * 2018-08-24 2018-12-18 云南科威液态金属谷研发有限公司 一种无卤助焊剂及其制备方法和应用

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JP3797990B2 (ja) * 2003-08-08 2006-07-19 株式会社東芝 熱硬化性フラックス及びはんだペースト
JP4576270B2 (ja) * 2005-03-29 2010-11-04 昭和電工株式会社 ハンダ回路基板の製造方法
WO2007007865A1 (en) * 2005-07-11 2007-01-18 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
WO2007029866A1 (en) * 2005-09-09 2007-03-15 Showa Denko K.K. Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board
DE102005053553A1 (de) * 2005-11-08 2007-05-16 Heraeus Gmbh W C Lotpasten mit harzfreien Flussmittel
US7767032B2 (en) * 2006-06-30 2010-08-03 W.C. Heraeus Holding GmbH No-clean low-residue solder paste for semiconductor device applications
CN100443245C (zh) * 2006-07-04 2008-12-17 广州有色金属研究院 一种自动钎焊用镍焊膏
JP2008062253A (ja) * 2006-09-05 2008-03-21 Denso Corp はんだ付け用フラックスおよびはんだペースト組成物
ES2614238T3 (es) * 2006-12-12 2017-05-30 Senju Metal Industry Co., Ltd. Fundente para soldadura exenta de plomo
WO2008149748A1 (ja) * 2007-05-30 2008-12-11 Hitachi Chemical Company, Ltd. 無機粒子含有組成物、無機物層の形成方法及びプラズマディスプレイパネル
KR101142815B1 (ko) * 2008-02-22 2012-05-08 하리마 카세이 가부시키가이샤 땜납 접합 구조 및 납땜용 플럭스
JP5423688B2 (ja) * 2009-01-27 2014-02-19 荒川化学工業株式会社 鉛フリーはんだ用フラックス組成物、鉛フリーはんだ組成物およびやに入りはんだ
KR100977163B1 (ko) * 2009-03-23 2010-08-20 덕산하이메탈(주) 솔더 접착제와 그 제조 방법 및 이를 포함하는 전자 장치
JP4920058B2 (ja) * 2009-06-03 2012-04-18 株式会社タムラ製作所 はんだ接合剤組成物
KR101061048B1 (ko) * 2010-02-17 2011-09-01 (주)덕산테코피아 솔더 잉크 및 이를 이용한 전자소자 패키지
CN101890595B (zh) * 2010-07-02 2012-07-04 厦门大学 一种用于无铅药芯焊丝的低松香免清洗助焊剂及其制备方法
WO2012118074A1 (ja) * 2011-03-02 2012-09-07 千住金属工業株式会社 フラックス
CN103000609A (zh) * 2011-09-15 2013-03-27 复旦大学 凸点制作材料及凸点制备方法
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JP5520973B2 (ja) * 2012-01-17 2014-06-11 株式会社デンソー やに入りはんだ用フラックス及びやに入りはんだ
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CN107009052A (zh) * 2012-06-11 2017-08-04 千住金属工业株式会社 助焊剂组合物、液体助焊剂、松脂芯软焊料及焊膏
KR102156373B1 (ko) * 2013-05-10 2020-09-16 엘지이노텍 주식회사 솔더 페이스트
TWI701098B (zh) * 2013-12-31 2020-08-11 美商阿爾發金屬化工公司 環氧焊接膏，使用該膏之方法，由該環氧焊接膏形成之焊接接頭及其形成方法，及包含此焊接接頭之總成
CN104646863A (zh) * 2014-06-14 2015-05-27 柳州市奥凯工程机械有限公司 助焊剂
JP6383587B2 (ja) * 2014-06-30 2018-08-29 株式会社タムラ製作所 フラックス組成物、はんだ組成物、および電子基板の製造方法
JP6130418B2 (ja) * 2015-03-10 2017-05-17 株式会社タムラ製作所 電子部品の接合方法、並びに、その方法に用いるはんだ組成物および前処理剤
JP5989928B1 (ja) 2016-02-10 2016-09-07 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP5972489B1 (ja) 2016-02-10 2016-08-17 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP5972490B1 (ja) 2016-02-10 2016-08-17 古河電気工業株式会社 導電性接着剤組成物ならびにこれを用いた導電性接着フィルムおよびダイシング・ダイボンディングフィルム
JP6005312B1 (ja) 2016-02-10 2016-10-12 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP6005313B1 (ja) * 2016-02-10 2016-10-12 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP7150232B2 (ja) * 2017-07-03 2022-10-11 株式会社弘輝 フラックス、やに入りはんだ及びソルダペースト
JP6635986B2 (ja) * 2017-07-12 2020-01-29 株式会社タムラ製作所 はんだ組成物および電子基板
EP3741498B1 (en) * 2018-01-16 2023-08-02 Senju Metal Industry Co., Ltd Flux and solder paste
JP7063630B2 (ja) * 2018-01-16 2022-05-09 千住金属工業株式会社 フラックス及びソルダペースト
JP6617793B2 (ja) * 2018-06-01 2019-12-11 千住金属工業株式会社 ソルダペースト用フラックス及びソルダペースト
JP2020116611A (ja) * 2019-01-24 2020-08-06 株式会社弘輝 フラックス及びソルダペースト
JP6845450B1 (ja) * 2020-02-18 2021-03-17 千住金属工業株式会社 フラックス及びソルダペースト
JPWO2022234690A1 (enExample) * 2021-05-06 2022-11-10
US20240266470A1 (en) * 2021-10-29 2024-08-08 BOE MLED Technology Co., Ltd. Light-emitting device, light-emitting module and preparation method thereof

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US4290824A (en) * 1979-12-10 1981-09-22 Cobar Resources, Inc. Water soluble rosin flux
CN1017324B (zh) * 1989-05-09 1992-07-08 化学工业部晨光化工研究院一分院 一种印制线路板软钎焊用钎剂
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4290824A (en) * 1979-12-10 1981-09-22 Cobar Resources, Inc. Water soluble rosin flux
CN1017324B (zh) * 1989-05-09 1992-07-08 化学工业部晨光化工研究院一分院 一种印制线路板软钎焊用钎剂
US5334260A (en) * 1993-02-05 1994-08-02 Litton Systems, Inc. No-clean, low-residue, volatile organic compound free soldering flux and method of use
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109014656A (zh) * 2018-08-24 2018-12-18 云南科威液态金属谷研发有限公司 一种无卤助焊剂及其制备方法和应用

Also Published As

Publication number Publication date
JP4461009B2 (ja) 2010-05-12
EP1509358A4 (en) 2006-03-01
EP1509358A1 (en) 2005-03-02
JP2005528224A (ja) 2005-09-22
CN1671506A (zh) 2005-09-21
WO2003101661A1 (en) 2003-12-11
US20030221748A1 (en) 2003-12-04
AU2003232444A1 (en) 2003-12-19

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