CN100418231C - Cmos图像传感器及其制造方法 - Google Patents

Cmos图像传感器及其制造方法 Download PDF

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CN100418231C
CN100418231C CNB2005100822365A CN200510082236A CN100418231C CN 100418231 C CN100418231 C CN 100418231C CN B2005100822365 A CNB2005100822365 A CN B2005100822365A CN 200510082236 A CN200510082236 A CN 200510082236A CN 100418231 C CN100418231 C CN 100418231C
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姜和映
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Abstract

一种图像传感器,包括:衬底,在该衬底上沉积有外延层;多个埋入外延层中的光电二极管;以及插入光电二极管之间以使光电二极管绝缘的多个场氧化膜。每个场氧化膜包括:在外延层上形成的沟道;沉积在沟道内侧上的第一氧化层;沉积在第一氧化膜上的反射层,用于朝向光电二极管一侧反射入射光;和在反射层上形成的第二氧化层。

Description

CMOS图像传感器及其制造方法
技术领域
本发明涉及图像传感,尤其涉及CMOS图像传感器及其制造方法。
背景技术
CMOS图像传感器是集成有多个光电二极管的半导体器件,每个光电二极管是将入射光转换成电信号以检测目标物的图像的传感器。CMOS图像传感器已被研发以便被安装到便携式手持个人紧凑型器件中,例如照相电话和数码相机,因此对其尺寸有限制。
在常用的图像传感器中,用于检测光的最小单元是像素。图像传感器包括多个像素。像素包括光电二极管、用于驱动有关的光电二极管的驱动装置和其它装置。像素一一对应于光电二极管,每个像素的光电二极管的光接收面积与图像传感器的表面面积的比例被称作“填充因子”。常用图像传感器的填充因子是大约20%。因此,填充因子是图像传感器的感光性的一个标准。
为了在有限的空间中提高图像传感器的感光性,有必要增加将被集成的像素的数量,并且需要扩大光电二极管的光接收面积,以最大程度地占据像素。
已提出的增加传感器填充因子的措施包括为每个像素在对应光接收面积的位置处放置微透镜,以将光收集到光电二极管上。
然而,没有通过微透镜被光电二极管接收的光会引起串扰。在不必要的光束之间的这种干扰模糊了图像传感器中的颜色。
发明内容
本发明就是要解决在现有技术中存在的上述问题,在一个方面,使图像传感器具有能够减小串扰的特征。
所述图像传感器包括:衬底,该衬底上生长着外延层;以及多个埋入外延层中的光电二极管。场氧化膜被插入光电二极管之间以使光电二极管绝缘。每个场氧化膜包括:在外延层上形成的沟道;沉积在沟道内侧上的第一氧化层;沉积在第一氧化层上的反射层,用于朝向光电二极管一侧反射入射光;和在反射层上形成的第二氧化层。
附图说明
通过以下参照附图进行的详细描述,本发明的上述和其它方面、特征和优点将变得更加明显。
然而,应当理解,附图只是为了示例而不是对本发明的限制,本发明由附加的权利要求书限定。还应当理解,附图不一定按比例绘制,除非另外指出,它们仅用于从概念上示出这里描述的结构和过程。
图1是根据本发明的一个优选实施例的图像传感器的侧视图;
图2是图1中的场氧化膜的侧视图;和
图3A至3E是逐步示出制造图1的场氧化膜的过程的视图。
具体实施方式
下文将参照附图描述本发明的实施例。为了清楚和简洁,以下的说明省略了对已知功能和构造的详细描述。
具体参照附图,其中在若干视图中相同的附图标记表示类似或相同的元件,首先参照图1,根据本发明的图像传感器包括:衬底110,其上沉积有外延层120;以及互相相邻地埋入外延层中的多个光电二极管140。衬底110掺杂有P型掺杂剂。叠加的外延层120同样掺杂有P型掺杂剂,但是浓度较低。多个场氧化膜130插入光电二极管140之间。图像传感器具有多个传输门150和门氧化膜160,每个门氧化膜160被设置在传输门之一和外延层120之间。在外延层120上沉积有第一绝缘层180。多个滤色器230设置在第一绝缘层180上,与对应的各个光电二极管140位置相对。第二绝缘层190沉积在第一绝缘层180上。多个透镜240形成在第二绝缘层190上,并分别位于与对应的滤色器230相对的位置处。
如图2所示,图1的场氧化膜130包括:在外延层120上形成的沟道131;沉积在沟道上的第一氧化层132;沉积在第一氧化膜上的用于将入射光朝向每个光电二极管140的侧面140a反射的反射层133;以及形成在反射层上的第二氧化层134。
第一氧化层132用液态氧化物通过旋涂沉积在沟道131的底表面和侧表面上,从而它相对于光电二极管140的侧面具有预定的倾斜度。反射层133沉积在第一氧化层132的与光电二极管140的侧面140a相反的部分上,从而入射光被反射到光电二极管的那一侧。反射层133通过金属镀层或溅射涂层形成。第二氧化层134沉积在形成有反射层133的第一氧化层132上。
场氧化膜130通过修平沉积的第二氧化层134而形成。场氧化膜130使光电二极管140光和电绝缘。特别是,反射层133将入射到光电二极管的光接收表面的光反射到各个光电二极管140的侧面140a,从而提高光电二极管的光接收能力。
传输门150形成在外延层120上,隔离物151a、151b设置在传输门150的两个壁上。栅氧化膜160被沉积以作为传输门150和外延层120之间的绝缘层。
第一绝缘层180沉积在包括传输门150的外延层120上,第二绝缘层190沉积在第一绝缘层上。
每个微透镜240与对应的滤色镜230对齐形成。微透镜240引导入射光使其在经过各个滤色镜230时会聚在光电二极管140的光接收表面上。
根据本发明,反射层被不对称地沉积在场氧化膜上,从而它的外表面朝向光电二极管的一侧以将入射光反射到那一侧。因此,光不会被反射而与入射到光电二极管的光接收表面上的其它光发生干涉。结果,可提高图像传感器的光接收能力,而不增加光电二极管的填充因子,并不产生与使用微透镜用关的缺点。简言之,本发明可提高图像传感器的感光性,而不增加光电二极管的光接收面积,也不存在与现有技术的使用微透镜有关的诸如串扰之类的颜色模糊或干扰等缺点。
尽管已参照优选实施例描述和展示了本发明,本领域的技术人员将会理解,在不偏离本发明权利要求书限定的精神和范围的条件下,可以在形式和细节上进行各种变化。

Claims (20)

1. 一种图像传感器,包括:
衬底,该衬底上生长着外延层;
多个埋入外延层中的光电二极管;和
多个场氧化膜,它们被插入光电二极管之间以使光电二极管绝缘,
多个场氧化膜中的每个场氧化膜包括:在外延层上形成的沟道;沉积在沟道内侧上的第一氧化层;沉积在第一氧化层上的反射层,用于朝向多个光电二极管中的各个光电二极管的一侧反射入射光;和在反射层上形成的第二氧化层。
2. 根据权利要求1所述的图像传感器,其特征在于,所述衬底掺杂有P型掺杂剂。
3. 根据权利要求1所述的图像传感器,其特征在于,外延层和衬底分别都掺杂有至少一种P型掺杂剂,在外延层中的至少一种P型掺杂剂的浓度低于衬底中的至少一种P型掺杂剂的浓度。
4. 根据权利要求1所述的图像传感器,其特征在于,还包括:
多个传输门,每个具有两个壁,所述传输门形成在外延层上,其中设置隔离物,所述隔离物被布置在多个传输门的所述两个壁上;
沉积在传输门和外延层之间的栅氧化膜;
沉积在包括传输门的外延层上的第一绝缘层;
多个滤色器,与所述多个光电二极管中的相应的光电二极管相对设置;
沉积在第一绝缘层上的第二绝缘层;和
多个微透镜,与多个滤色器中的相应的滤色器相对地形成。
5. 根据权利要求4所述的图像传感器,其特征在于,多个滤色器与所述多个光电二极管的所述相应的光电二极管对齐设置。
6. 根据权利要求5所述的图像传感器,其特征在于,多个微透镜与多个滤色器中的相应的滤色器对齐形成。
7. 根据权利要求4所述的图像传感器,其特征在于,多个微透镜与多个滤色器中的相应的滤色器对齐形成。
8. 根据权利要求1所述的图像传感器,其特征在于,第一氧化层用旋涂沉积的方式设置在沟道的内侧。
9. 根据权利要求1所述的图像传感器,其特征在于,第一氧化层具有外表面,反射层沉积在所述外表面的一部分上用于所述反射。
10. 根据权利要求1所述的图像传感器,其特征在于,所述多个场氧化膜中的每一个包括所述沟道、所述第一氧化层、与多个光电二极管中的各个光电二极管相关的所述反射层,以及所述第二氧化层。
11. 一种制造图像传感器的方法,所述图像传感器包括:沉积在衬底上的外延层;多个埋入外延层中的光电二极管;和多个场氧化膜,它们被插入光电二极管之间以使光电二极管绝缘,所述方法包括通过以下步骤形成多个场氧化膜中的每个场氧化膜:
通过在一对光电二极管之间蚀刻外延层而形成沟道;
通过旋涂在沟道的内侧上生长第一氧化层;
在第一氧化层的一部分上涂敷反射层,所述反射层与相应的光电二极管的一个侧面相对;和
在包括反射层的第一氧化层上生长第二氧化层,然后修平第二氧化层。
12. 根据权利要求11所述的方法,其特征在于,所述衬底掺杂有P型掺杂剂。
13. 根据权利要求11所述的方法,其特征在于,外延层和衬底分别都掺杂有至少一种P型掺杂剂,在外延层中的至少一种P型掺杂剂的浓度低于衬底中的至少一种P型掺杂剂的浓度。
14. 根据权利要求11所述的方法,其特征在于,所述步骤还包括:
在外延层上形成多个传输门,每个具有两个壁;
设置外延层隔离物,所述隔离物被布置在多个传输门的所述两个壁上;
在传输门和外延层之间沉积栅氧化膜;
在包括传输门的外延层上沉积第一绝缘层;
设置多个滤色器,所述多个滤色器与所述多个光电二极管中的相应的光电二极管相对设置;
在第一绝缘层上沉积第二绝缘层;和
形成多个微透镜,所述多个微透镜与多个滤色器中的相应的滤色器相对地形成。
15. 根据权利要求14所述的方法,其特征在于,多个滤色器与所述多个光电二极管的所述相应的光电二极管对齐设置。
16. 根据权利要求15所述的方法,其特征在于,多个微透镜与多个滤色器中的相应的滤色器对齐形成。
17. 根据权利要求14所述的方法,其特征在于,多个微透镜与多个滤色器中的相应的滤色器对齐形成。
18. 根据权利要求11所述的方法,其特征在于,所述步骤还包括通过旋涂在沟道的内侧上沉积以形成所述第一氧化层。
19. 根据权利要求11所述的方法,其特征在于,第一氧化层具有外表面,反射层涂敷在所述外表面的一部分上,用于向多个光电二极管中的相应的光电二极管的一个侧面进行反射。
20. 根据权利要求11所述的方法,其特征在于,所述多个场氧化膜中的每一个包括所述沟道、所述第一氧化层、所述反射层,以及所述第二氧化层。
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