CN100415068C - 电路形成方法、电路板、电路形成装置和油墨装置 - Google Patents

电路形成方法、电路板、电路形成装置和油墨装置 Download PDF

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Publication number
CN100415068C
CN100415068C CNB2004101016107A CN200410101610A CN100415068C CN 100415068 C CN100415068 C CN 100415068C CN B2004101016107 A CNB2004101016107 A CN B2004101016107A CN 200410101610 A CN200410101610 A CN 200410101610A CN 100415068 C CN100415068 C CN 100415068C
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China
Prior art keywords
aforementioned
pattern
liquid
composition
circuit
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB2004101016107A
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English (en)
Chinese (zh)
Other versions
CN1638605A (zh
Inventor
毛利孝志
岩田和夫
鹤冈裕二
西胁理
高山秀人
瓮英一
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Publication of CN1638605A publication Critical patent/CN1638605A/zh
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Publication of CN100415068C publication Critical patent/CN100415068C/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrodes Of Semiconductors (AREA)
CNB2004101016107A 2003-12-22 2004-12-21 电路形成方法、电路板、电路形成装置和油墨装置 Expired - Fee Related CN100415068C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003424988A JP4630542B2 (ja) 2003-12-22 2003-12-22 配線形成方法
JP2003424988 2003-12-22

Publications (2)

Publication Number Publication Date
CN1638605A CN1638605A (zh) 2005-07-13
CN100415068C true CN100415068C (zh) 2008-08-27

Family

ID=34675414

Family Applications (1)

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CNB2004101016107A Expired - Fee Related CN100415068C (zh) 2003-12-22 2004-12-21 电路形成方法、电路板、电路形成装置和油墨装置

Country Status (3)

Country Link
US (1) US20050133823A1 (enExample)
JP (1) JP4630542B2 (enExample)
CN (1) CN100415068C (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006076604A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Processes for planarizing substrates and encapsulating printable electronic features
JP2007027487A (ja) * 2005-07-19 2007-02-01 Dowa Holdings Co Ltd 導電膜または配線の形成法
US9615463B2 (en) * 2006-09-22 2017-04-04 Oscar Khaselev Method for producing a high-aspect ratio conductive pattern on a substrate
ES2612734T3 (es) * 2007-08-03 2017-05-18 Alpha Metals, Inc. Método de fabricación de placa de circuitos impresos
JP2009054706A (ja) * 2007-08-24 2009-03-12 Ulvac Japan Ltd 電子デバイスの製造方法
US8101231B2 (en) 2007-12-07 2012-01-24 Cabot Corporation Processes for forming photovoltaic conductive features from multiple inks
KR101148679B1 (ko) * 2010-12-21 2012-05-25 삼성전기주식회사 다층 인쇄회로기판 및 그의 제조방법
WO2013160454A2 (en) * 2012-04-27 2013-10-31 Dsm Ip Assets B.V. Electrically conductive polyamide substrate
US9345144B2 (en) * 2013-02-28 2016-05-17 Eastman Kodak Company Making multi-layer micro-wire structure
CN106206409B (zh) 2015-05-08 2019-05-07 华邦电子股份有限公司 堆叠电子装置及其制造方法
CN109453944B (zh) * 2018-11-06 2023-10-10 环晟光伏(江苏)有限公司 高效叠瓦组件点胶管路及高效叠瓦组件点胶方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03179794A (ja) * 1989-10-30 1991-08-05 Tokuyama Soda Co Ltd 導電性プリント基板の製造方法
CN1069387A (zh) * 1991-08-07 1993-02-24 科龙实业有限公司 电路基板穿孔电镀制造方法
CN1269695A (zh) * 1999-04-01 2000-10-11 日本胜利株式会社 印刷电路板及其制造方法
US20030091789A1 (en) * 2001-09-10 2003-05-15 Koskenmaki David C. Method for making conductive circuits using powdered metals

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Publication number Priority date Publication date Assignee Title
JPS52131722A (en) * 1975-07-28 1977-11-04 Japan Synthetic Rubber Co Ltd Method of manufacturing electrostatic recording medium
JPS63175667A (ja) * 1987-01-14 1988-07-20 Matsushita Electric Ind Co Ltd 多列同時塗布方法
US5716663A (en) * 1990-02-09 1998-02-10 Toranaga Technologies Multilayer printed circuit
US5181045A (en) * 1991-09-23 1993-01-19 Hewlett-Packard Company Bleed alleviation using pH-sensitive dyes
US5599046A (en) * 1994-06-22 1997-02-04 Scientific Games Inc. Lottery ticket structure with circuit elements
JP3404526B2 (ja) * 2000-05-10 2003-05-12 防衛庁技術研究本部長 方向探知受信装置
JP5008216B2 (ja) * 2000-10-13 2012-08-22 株式会社アルバック インクジェット用インクの製法
US6730149B2 (en) * 2001-01-22 2004-05-04 Ricoh Company Limited Ink composition and inkjet recording method and apparatus using the ink composition
US7442408B2 (en) * 2002-03-26 2008-10-28 Hewlett-Packard Development Company, L.P. Methods for ink-jet printing circuitry
JP2003317553A (ja) * 2002-04-22 2003-11-07 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、多層配線基板、半導体チップの実装構造、電気光学装置、電子機器、ならびに非接触型カード媒体
JP2004012902A (ja) * 2002-06-07 2004-01-15 Fuji Photo Film Co Ltd 描画装置及びこの描画装置を用いた描画方法
US7152957B2 (en) * 2002-12-18 2006-12-26 Canon Kabushiki Kaisha Recording device board having a plurality of bumps for connecting an electrode pad and an electrode lead, liquid ejection head, and manufacturing method for the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03179794A (ja) * 1989-10-30 1991-08-05 Tokuyama Soda Co Ltd 導電性プリント基板の製造方法
CN1069387A (zh) * 1991-08-07 1993-02-24 科龙实业有限公司 电路基板穿孔电镀制造方法
CN1269695A (zh) * 1999-04-01 2000-10-11 日本胜利株式会社 印刷电路板及其制造方法
US20030091789A1 (en) * 2001-09-10 2003-05-15 Koskenmaki David C. Method for making conductive circuits using powdered metals

Also Published As

Publication number Publication date
JP2005183803A (ja) 2005-07-07
US20050133823A1 (en) 2005-06-23
JP4630542B2 (ja) 2011-02-09
CN1638605A (zh) 2005-07-13

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