JP4630542B2 - 配線形成方法 - Google Patents

配線形成方法 Download PDF

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Publication number
JP4630542B2
JP4630542B2 JP2003424988A JP2003424988A JP4630542B2 JP 4630542 B2 JP4630542 B2 JP 4630542B2 JP 2003424988 A JP2003424988 A JP 2003424988A JP 2003424988 A JP2003424988 A JP 2003424988A JP 4630542 B2 JP4630542 B2 JP 4630542B2
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JP
Japan
Prior art keywords
liquid
pattern
wiring
layer
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003424988A
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English (en)
Japanese (ja)
Other versions
JP2005183803A (ja
JP2005183803A5 (enExample
Inventor
孝志 毛利
和夫 岩田
裕二 鶴岡
理 西脇
秀人 高山
英一 甕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2003424988A priority Critical patent/JP4630542B2/ja
Priority to US11/000,012 priority patent/US20050133823A1/en
Priority to CNB2004101016107A priority patent/CN100415068C/zh
Publication of JP2005183803A publication Critical patent/JP2005183803A/ja
Publication of JP2005183803A5 publication Critical patent/JP2005183803A5/ja
Application granted granted Critical
Publication of JP4630542B2 publication Critical patent/JP4630542B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2003424988A 2003-12-22 2003-12-22 配線形成方法 Expired - Fee Related JP4630542B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003424988A JP4630542B2 (ja) 2003-12-22 2003-12-22 配線形成方法
US11/000,012 US20050133823A1 (en) 2003-12-22 2004-12-01 Method and apparatus for forming a wiring, wiring board, and ink set
CNB2004101016107A CN100415068C (zh) 2003-12-22 2004-12-21 电路形成方法、电路板、电路形成装置和油墨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003424988A JP4630542B2 (ja) 2003-12-22 2003-12-22 配線形成方法

Publications (3)

Publication Number Publication Date
JP2005183803A JP2005183803A (ja) 2005-07-07
JP2005183803A5 JP2005183803A5 (enExample) 2007-01-11
JP4630542B2 true JP4630542B2 (ja) 2011-02-09

Family

ID=34675414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003424988A Expired - Fee Related JP4630542B2 (ja) 2003-12-22 2003-12-22 配線形成方法

Country Status (3)

Country Link
US (1) US20050133823A1 (enExample)
JP (1) JP4630542B2 (enExample)
CN (1) CN100415068C (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150004354A (ko) * 2012-04-27 2015-01-12 디에스엠 아이피 어셋츠 비.브이. 전기전도성 폴리아미드 기재

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006076604A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Processes for planarizing substrates and encapsulating printable electronic features
JP2007027487A (ja) * 2005-07-19 2007-02-01 Dowa Holdings Co Ltd 導電膜または配線の形成法
US9615463B2 (en) * 2006-09-22 2017-04-04 Oscar Khaselev Method for producing a high-aspect ratio conductive pattern on a substrate
ES2612734T3 (es) * 2007-08-03 2017-05-18 Alpha Metals, Inc. Método de fabricación de placa de circuitos impresos
JP2009054706A (ja) * 2007-08-24 2009-03-12 Ulvac Japan Ltd 電子デバイスの製造方法
US8101231B2 (en) 2007-12-07 2012-01-24 Cabot Corporation Processes for forming photovoltaic conductive features from multiple inks
KR101148679B1 (ko) * 2010-12-21 2012-05-25 삼성전기주식회사 다층 인쇄회로기판 및 그의 제조방법
US9345144B2 (en) * 2013-02-28 2016-05-17 Eastman Kodak Company Making multi-layer micro-wire structure
CN106206409B (zh) 2015-05-08 2019-05-07 华邦电子股份有限公司 堆叠电子装置及其制造方法
CN109453944B (zh) * 2018-11-06 2023-10-10 环晟光伏(江苏)有限公司 高效叠瓦组件点胶管路及高效叠瓦组件点胶方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52131722A (en) * 1975-07-28 1977-11-04 Japan Synthetic Rubber Co Ltd Method of manufacturing electrostatic recording medium
JPS63175667A (ja) * 1987-01-14 1988-07-20 Matsushita Electric Ind Co Ltd 多列同時塗布方法
JPH03179794A (ja) * 1989-10-30 1991-08-05 Tokuyama Soda Co Ltd 導電性プリント基板の製造方法
US5716663A (en) * 1990-02-09 1998-02-10 Toranaga Technologies Multilayer printed circuit
CN1069387A (zh) * 1991-08-07 1993-02-24 科龙实业有限公司 电路基板穿孔电镀制造方法
US5181045A (en) * 1991-09-23 1993-01-19 Hewlett-Packard Company Bleed alleviation using pH-sensitive dyes
US5599046A (en) * 1994-06-22 1997-02-04 Scientific Games Inc. Lottery ticket structure with circuit elements
JP2000294921A (ja) * 1999-04-01 2000-10-20 Victor Co Of Japan Ltd プリンス基板及びその製造方法
JP3404526B2 (ja) * 2000-05-10 2003-05-12 防衛庁技術研究本部長 方向探知受信装置
JP5008216B2 (ja) * 2000-10-13 2012-08-22 株式会社アルバック インクジェット用インクの製法
US6730149B2 (en) * 2001-01-22 2004-05-04 Ricoh Company Limited Ink composition and inkjet recording method and apparatus using the ink composition
US6805940B2 (en) * 2001-09-10 2004-10-19 3M Innovative Properties Company Method for making conductive circuits using powdered metals
US7442408B2 (en) * 2002-03-26 2008-10-28 Hewlett-Packard Development Company, L.P. Methods for ink-jet printing circuitry
JP2003317553A (ja) * 2002-04-22 2003-11-07 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、多層配線基板、半導体チップの実装構造、電気光学装置、電子機器、ならびに非接触型カード媒体
JP2004012902A (ja) * 2002-06-07 2004-01-15 Fuji Photo Film Co Ltd 描画装置及びこの描画装置を用いた描画方法
US7152957B2 (en) * 2002-12-18 2006-12-26 Canon Kabushiki Kaisha Recording device board having a plurality of bumps for connecting an electrode pad and an electrode lead, liquid ejection head, and manufacturing method for the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150004354A (ko) * 2012-04-27 2015-01-12 디에스엠 아이피 어셋츠 비.브이. 전기전도성 폴리아미드 기재
KR102066304B1 (ko) * 2012-04-27 2020-01-14 디에스엠 아이피 어셋츠 비.브이. 전기전도성 폴리아미드 기재

Also Published As

Publication number Publication date
CN100415068C (zh) 2008-08-27
JP2005183803A (ja) 2005-07-07
US20050133823A1 (en) 2005-06-23
CN1638605A (zh) 2005-07-13

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