CN100414624C - 用于数据存储应用的改进的电子发射器件及其制造方法 - Google Patents

用于数据存储应用的改进的电子发射器件及其制造方法 Download PDF

Info

Publication number
CN100414624C
CN100414624C CNB031010792A CN03101079A CN100414624C CN 100414624 C CN100414624 C CN 100414624C CN B031010792 A CNB031010792 A CN B031010792A CN 03101079 A CN03101079 A CN 03101079A CN 100414624 C CN100414624 C CN 100414624C
Authority
CN
China
Prior art keywords
emitter
electrode
layer
field
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB031010792A
Other languages
English (en)
Chinese (zh)
Other versions
CN1433010A (zh
Inventor
H·比雷基
V·T·宾
S·-T·林
H·P·郭
S·L·纳伯惠斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of CN1433010A publication Critical patent/CN1433010A/zh
Application granted granted Critical
Publication of CN100414624C publication Critical patent/CN100414624C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B9/00Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
    • G11B9/12Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor
    • G11B9/14Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor using microscopic probe means, i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B9/00Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
    • G11B9/12Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor
    • G11B9/14Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor using microscopic probe means, i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information
    • G11B9/1409Heads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/02Main electrodes
    • H01J1/30Cold cathodes, e.g. field-emissive cathode
    • H01J1/308Semiconductor cathodes, e.g. cathodes with PN junction layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Cold Cathode And The Manufacture (AREA)
CNB031010792A 2002-01-09 2003-01-09 用于数据存储应用的改进的电子发射器件及其制造方法 Expired - Fee Related CN100414624C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/042927 2002-01-09
US10/042,927 US6806630B2 (en) 2002-01-09 2002-01-09 Electron emitter device for data storage applications and method of manufacture

Publications (2)

Publication Number Publication Date
CN1433010A CN1433010A (zh) 2003-07-30
CN100414624C true CN100414624C (zh) 2008-08-27

Family

ID=21924485

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB031010792A Expired - Fee Related CN100414624C (zh) 2002-01-09 2003-01-09 用于数据存储应用的改进的电子发射器件及其制造方法

Country Status (4)

Country Link
US (3) US6806630B2 (https=)
EP (1) EP1328002A1 (https=)
JP (1) JP2003234061A (https=)
CN (1) CN100414624C (https=)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7260051B1 (en) 1998-12-18 2007-08-21 Nanochip, Inc. Molecular memory medium and molecular memory integrated circuit
US7554829B2 (en) 1999-07-30 2009-06-30 Micron Technology, Inc. Transmission lines for CMOS integrated circuits
US20020138301A1 (en) * 2001-03-22 2002-09-26 Thanos Karras Integration of a portal into an application service provider data archive and/or web based viewer
US7474002B2 (en) * 2001-10-30 2009-01-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having dielectric film having aperture portion
US20050132549A1 (en) * 2001-11-16 2005-06-23 Wong-Cheng Shih Method for making metal capacitors with low leakage currents for mixed-signal devices
US7101770B2 (en) 2002-01-30 2006-09-05 Micron Technology, Inc. Capacitive techniques to reduce noise in high speed interconnections
US7235457B2 (en) * 2002-03-13 2007-06-26 Micron Technology, Inc. High permeability layered films to reduce noise in high speed interconnects
US6835619B2 (en) * 2002-08-08 2004-12-28 Micron Technology, Inc. Method of forming a memory transistor comprising a Schottky contact
US7068582B2 (en) * 2002-09-30 2006-06-27 The Regents Of The University Of California Read head for ultra-high-density information storage media and method for making the same
US6822379B2 (en) * 2002-10-01 2004-11-23 Hewlett-Packard Development Company, L.P. Emission device and method for forming
US7233517B2 (en) * 2002-10-15 2007-06-19 Nanochip, Inc. Atomic probes and media for high density data storage
US7790226B2 (en) * 2003-10-27 2010-09-07 California Institute Of Technology Pyrolyzed thin film carbon
US20050243592A1 (en) * 2004-04-16 2005-11-03 Rust Thomas F High density data storage device having eraseable bit cells
US20050243660A1 (en) * 2004-04-16 2005-11-03 Rust Thomas F Methods for erasing bit cells in a high density data storage device
WO2006061686A2 (en) * 2004-12-10 2006-06-15 Johan Frans Prins A cathodic device
KR100575002B1 (ko) 2004-12-16 2006-05-02 삼성전자주식회사 공통 게이트를 구비하는 상보형 금속 산화물 반도체 박막트랜지스터, 이를 포함하는 논리소자 및 그 트랜지스터의제조 방법
TWI324024B (en) * 2005-01-14 2010-04-21 Hon Hai Prec Ind Co Ltd Field emission type light source
US7367119B2 (en) 2005-06-24 2008-05-06 Nanochip, Inc. Method for forming a reinforced tip for a probe storage device
US20070041237A1 (en) * 2005-07-08 2007-02-22 Nanochip, Inc. Media for writing highly resolved domains
US7463573B2 (en) 2005-06-24 2008-12-09 Nanochip, Inc. Patterned media for a high density data storage device
US20070008866A1 (en) * 2005-07-08 2007-01-11 Nanochip, Inc. Methods for writing and reading in a polarity-dependent memory switch media
US20070008867A1 (en) * 2005-07-08 2007-01-11 Nanochip, Inc. High density data storage devices with a lubricant layer comprised of a field of polymer chains
US20070008865A1 (en) * 2005-07-08 2007-01-11 Nanochip, Inc. High density data storage devices with polarity-dependent memory switching media
US7309630B2 (en) 2005-07-08 2007-12-18 Nanochip, Inc. Method for forming patterned media for a high density data storage device
CN1941263B (zh) * 2005-09-29 2011-12-14 清华大学 场发射显示器
JP2007266083A (ja) * 2006-03-27 2007-10-11 Renesas Technology Corp 半導体装置およびその製造方法
US20080001075A1 (en) * 2006-06-15 2008-01-03 Nanochip, Inc. Memory stage for a probe storage device
US7887668B2 (en) * 2006-08-30 2011-02-15 Dow Global Technologies Inc. Amine organoborane polymerizable compostion and uses therefor
US8101130B2 (en) * 2006-09-15 2012-01-24 Applied Nanotech Holdings, Inc. Gas ionization source
US20080175033A1 (en) * 2007-01-19 2008-07-24 Nanochip, Inc. Method and system for improving domain stability in a ferroelectric media
US20080174918A1 (en) * 2007-01-19 2008-07-24 Nanochip, Inc. Method and system for writing and reading a charge-trap media with a probe tip
US20080233672A1 (en) * 2007-03-20 2008-09-25 Nanochip, Inc. Method of integrating mems structures and cmos structures using oxide fusion bonding
JP2008282607A (ja) * 2007-05-09 2008-11-20 Canon Inc 電子放出素子、電子源、画像表示装置、および、電子放出素子の製造方法
JP5024885B2 (ja) * 2008-03-05 2012-09-12 国立大学法人東北大学 陰極体
US20090294028A1 (en) * 2008-06-03 2009-12-03 Nanochip, Inc. Process for fabricating high density storage device with high-temperature media
US8022609B2 (en) * 2008-06-24 2011-09-20 Hermes-Microvision, Inc. Thermal field emission cathode
US20100039919A1 (en) * 2008-08-15 2010-02-18 Nanochip, Inc. Cantilever Structure for Use in Seek-and-Scan Probe Storage
CN102157316B (zh) * 2011-03-09 2013-04-24 北京工业大学 具有增强电子发射性能的薄膜场发射阴极及其制备方法
WO2013187970A2 (en) * 2012-05-14 2013-12-19 The General Hospital Corporation Method for coded-source phase contrast x-ray imaging
US11454820B2 (en) 2019-10-17 2022-09-27 Taiwan Semiconductor Manufacturing Co., Ltd. Multifunctional collimator for contact image sensors
EP3940740A1 (en) * 2020-07-16 2022-01-19 ASML Netherlands B.V. Emitter for emitting charged particles
CN115424909B (zh) * 2022-08-02 2025-07-25 中国科学院苏州纳米技术与纳米仿生研究所 场发射器件及其制作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557596A (en) * 1995-03-20 1996-09-17 Gibson; Gary Ultra-high density storage device
WO2000070638A1 (fr) * 1999-05-12 2000-11-23 Universite Claude Bernard Lyon I Procede et dispositif pour extraire des electrons dans le vide et cathodes d'emission pour un tel dispositif

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB853352A (en) * 1957-12-16 1960-11-02 Vickers Electrical Co Ltd Improvements relating to electron emitters
FR1204367A (fr) 1958-03-24 1960-01-26 Csf Cathode thermoélectronique froide à semi-conducteur
US3105166A (en) 1959-01-15 1963-09-24 Westinghouse Electric Corp Electron tube with a cold emissive cathode
NL283434A (https=) 1961-09-25
US3150282A (en) 1962-11-13 1964-09-22 Stanford Research Inst High efficiency cathode structure
US3789471A (en) * 1970-02-06 1974-02-05 Stanford Research Inst Field emission cathode structures, devices utilizing such structures, and methods of producing such structures
US3755704A (en) * 1970-02-06 1973-08-28 Stanford Research Inst Field emission cathode structures and devices utilizing such structures
US3916227A (en) 1972-01-24 1975-10-28 Braun Ag Piezoelectric igniter with a magnetic striking mechanism
US4498952A (en) * 1982-09-17 1985-02-12 Condesin, Inc. Batch fabrication procedure for manufacture of arrays of field emitted electron beams with integral self-aligned optical lense in microguns
US4663559A (en) * 1982-09-17 1987-05-05 Christensen Alton O Field emission device
JPH05342983A (ja) * 1992-06-08 1993-12-24 Saamobonitsuku:Kk 熱電変換素子
US5584739A (en) * 1993-02-10 1996-12-17 Futaba Denshi Kogyo K.K Field emission element and process for manufacturing same
JPH0778581A (ja) * 1993-09-07 1995-03-20 Hitachi Ltd 単色化電子線源およびその製造方法
JP3390255B2 (ja) * 1994-06-24 2003-03-24 富士通株式会社 電界放出陰極装置及びその製造方法
JP2964885B2 (ja) * 1994-10-28 1999-10-18 関西日本電気株式会社 電子放出素子
US5835119A (en) 1995-10-31 1998-11-10 Hewlett- Packard Company Face emitting electroluminescent exposure array
JP3580930B2 (ja) * 1996-01-18 2004-10-27 住友電気工業株式会社 電子放出装置
GB9616265D0 (en) 1996-08-02 1996-09-11 Philips Electronics Uk Ltd Electron devices
US6091190A (en) * 1997-07-28 2000-07-18 Motorola, Inc. Field emission device
JP3570864B2 (ja) 1997-08-08 2004-09-29 パイオニア株式会社 電子放出素子及びこれを用いた表示装置
US6011356A (en) 1998-04-30 2000-01-04 St. Clair Intellectual Property Consultants, Inc. Flat surface emitter for use in field emission display devices
EP0959485A1 (en) 1998-05-18 1999-11-24 Barco N.V. Cold cathode electron-emitting device
TW375755B (en) * 1998-06-10 1999-12-01 United Microelectronics Corp Process for emitter of field emission display
US6351254B2 (en) 1998-07-06 2002-02-26 The Regents Of The University Of California Junction-based field emission structure for field emission display
JP3546945B2 (ja) * 1999-10-14 2004-07-28 日本電気株式会社 冷陰極装置
FR2801135B1 (fr) * 1999-11-12 2002-02-08 Univ Claude Bernard Lyon Procede de realisation d'une cathode d'emission a l'aide de la technique sol-gel et cathode obtenue par un tel procede
JP3361083B2 (ja) * 1999-12-28 2003-01-07 株式会社東芝 電子放出デバイス
US6914374B2 (en) * 2002-01-09 2005-07-05 Hewlett-Packard Development Company, L.P. Planar electron emitter apparatus with improved emission area and method of manufacture

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557596A (en) * 1995-03-20 1996-09-17 Gibson; Gary Ultra-high density storage device
WO2000070638A1 (fr) * 1999-05-12 2000-11-23 Universite Claude Bernard Lyon I Procede et dispositif pour extraire des electrons dans le vide et cathodes d'emission pour un tel dispositif

Also Published As

Publication number Publication date
US6864624B2 (en) 2005-03-08
US20030128494A1 (en) 2003-07-10
US20040095868A1 (en) 2004-05-20
US6806630B2 (en) 2004-10-19
CN1433010A (zh) 2003-07-30
US7585687B2 (en) 2009-09-08
US20050029920A1 (en) 2005-02-10
EP1328002A1 (en) 2003-07-16
JP2003234061A (ja) 2003-08-22

Similar Documents

Publication Publication Date Title
CN100414624C (zh) 用于数据存储应用的改进的电子发射器件及其制造方法
US6914374B2 (en) Planar electron emitter apparatus with improved emission area and method of manufacture
US6933517B2 (en) Tunneling emitters
JP4217218B2 (ja) 抵抗性チップを備えた半導体探針の製造方法
US6815875B2 (en) Electron source having planar emission region and focusing structure
US6643248B2 (en) Data storage device
JP4369430B2 (ja) 抵抗性チップを備えた半導体プローブ及びその製造方法
JP2005502159A (ja) トンネル放出器
KR100499127B1 (ko) 고밀도 정보저장매체 및 그 제조방법 및 정보저장장치 및이를 이용한 정보 기록 및 재생 및 소거방법
US7419843B2 (en) Method of manufacturing semiconductor probe having resistive tip
JP2005515584A (ja) シリコンベースの誘電体トンネル放出器
HK1057417A (en) Improved electron emitter device for data storage applications and method of manufacture
HK1057640A (en) Planar electron emitter apparatus with improved emission area and method of manufacture
US6872964B2 (en) Data storage device
JP4405451B2 (ja) 情報記録装置
JP2004158054A (ja) 電荷蓄積型記録媒体およびその作製方法
JP2003203404A (ja) 記憶装置
JPH08250750A (ja) 半導体磁気センサ及びその製造方法
JP2006156504A (ja) トンネル磁気抵抗効果素子及びその製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1057417

Country of ref document: HK

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080827

Termination date: 20110109