CN100388001C

CN100388001C - Detecting chip with multiple detecting units

Info

Publication number: CN100388001C
Application number: CNB2004100383607A
Authority: CN
Inventors: 张铭元
Original assignee: MINWAY TECH Ltd
Current assignee: MINWAY TECH Ltd
Priority date: 2004-05-24
Filing date: 2004-05-24
Publication date: 2008-05-14
Anticipated expiration: 2024-05-24
Also published as: CN1702469A

Abstract

The present invention relates to the design of a detecting chip with a plurality of detecting untis, which is mainly composed of a plurality of conductive joints in a chip, and an integrated circuit which distributes wires among all of the conductive joints, wherein decoder circuits and circuit switches are arranged in the integrated circuit so as to enable each conductive joint to match with a decoder circuit and a circuit switch to form a detection unit together. As a result, a detecting contact face of the detecting chip can be formed by connecting all of the detecting units in series by the integrated circuit. Moreover, the signal transmission among all of the detecting units and objects to be detected on the contact face can be controlled and detected by an analysis mode of encoding and decoding by the decoder circuits by the minority of position lines. Consequently, the circuits can be detected.

Description

Detection chip with a plurality of detecting units

Technical field

The invention relates to a kind of detection chip design, refer to a kind of detection interface design that detects as various determinand with chip especially with high-density test contact with a plurality of detecting units.

Technical background

General detection mode for interior circuit, mostly be to utilize mechanical structure to form to detect, it is to connect with trickle probe 10 ends to establish Communication signal wire 20 (as shown in Figure 5), and according to the connecting point position of determinand correspondence is configured to a spring dials seat 10A, make Communication signal wire 20 distributions by winding displacement 301, connect to IC on-off circuit 30, extremely count on the logic card 40 by transmission line 401 serial connections again, make logic card 40 and computer equipment 50 connect (as shown in Figure 6) again, if this, when utilization two corresponding dials seat 10A folders are surveyed determinand, can be by the formula control of computer equipment 50, transmit detection signal to two dials seat 10A with Communication signal wire 20 and go up specific probe 10, by this to reach the effect that detects interior circuit.

Utilize the detection platform (such as special-purpose dials and general-purpose dials) of above-mentioned employing probe 10 as the touch-control contact, because of each detecting point spacing distance to each other, be subject to the size impact of probe 10 and be difficult to give precise treatment, so for the determinand that the PCB with high-density circuit structure, LCD, semiconductor or other have circuit, be to be not enough to corresponding the detection.Again, the detection platform of forming with probe 10 is when making, must be in the mode of manual work, probe 10 is implanted the detection pedestal one by one, and the derivation that must be pulled one by one of the Communication signal wire 20 of each probe 10 tail end is docked with IC on-off circuit 30 in order by winding displacement 301, is connected in series with logic card 40 again, distribution in succession so one by one, real show take a lot of work, time-consuming and the utmost point is not inconsistent economic benefit.

In addition, this kind employing probe 10 detection platform as the touch-control contact, signal transmission path because of 50 of its probe 10 and computer equipments, be that framework is formed with numerous elements, as Communication signal wire 20, winding displacement 301, IC on-off circuit 30 and logic card 40 etc., when signal transmitted by this transmission path, it was to have that noise produces and bad phenomenon such as signal is weak, and severe patient is the possibility that erroneous judgement is arranged.

Summary of the invention

Fundamental purpose of the present invention, be to be to provide a kind of detection chip design with a plurality of detecting units, mainly be in a chip, to be packaged with decoder circuit and contactor, and make its lead be able to the mode that high density row establishes to be laid in chip surface, make the lead top form conductive junction point, so, can be set as a detection surface of contact with the detecting unit cloth that conductive junction point, decoder circuit and contactor were constituted by a plurality of, make chip generally carry out electric circuit inspection with determinand with high-density test contact.

Secondary objective of the present invention, be to be to provide a kind of detection chip design with a plurality of detecting units, that to be the analysis mode of gathering and editing, decoding carry out the test core loop by software programming to this decoder circuit is interconnected, makes detection chip be able to the signal transmission that the minority address lines is come each conductive junction point on the control detection surface of contact.

A kind of detection chip with a plurality of detecting units of the present invention mainly is to make having included a plurality of conductive junction points in the chip, and the integrated circuit that is routed between each conductive junction point constitutes, wherein:

Conductive junction point, it is that the row of mining height density establishes that mode is selected to be packaged on the substrate of chip, make the conductive layer on its top concordant with chip surface, and the bottom is to be communicated with integrated circuit formation to connect shape;

Integrated circuit, it is made of decoder circuit and contactor, the analysis mode that this decoder circuit is gathered and edited, decoded is carried out the interconnected of test core loop by the software programming, makes itself and contactor act on controlling signal and conductive junction point transmission UNICOM each other;

So constitute, can constitute a detecting unit with conductive junction point, decoder circuit and contactor by a plurality of, make chip be able to a plurality of detecting units and be configured to a highdensity detection surface of contact, the determinand that makes chip can generally and various have test contacts carries out electric circuit inspection.

Described detection chip with a plurality of detecting units is that selected the arrangement is laid in detection platform and the structure group is one to detect face.

Adopt the mode of Chip Packaging because of the present invention, with objects such as conventional probe, Communication signal wire and IC on-off circuits, come framework to replace with a packaged chip, thereby, originally for detecting problems such as signal attenuation, noise control, assembly precision, all can improve in the lump, also significantly improve the precision of detected value simultaneously.

Description of drawings

Figure 1 shows that the plane enlarged diagram of chips of the present invention.

Figure 2 shows that stereoscopic synoptic diagram of the present invention.

Figure 3 shows that constituting the array that detects face with chip module among the present invention lays synoptic diagram.

Figure 4 shows that checkout equipment arrangement plan of the present invention.

Figure 5 shows that commonly sees implements the partial structurtes diagrammatic cross-section of detection with probe.

Figure 6 shows that the arrangement plan of the checkout equipment of commonly seeing.

Main figure number explanation:

10 probes

10A spring dials seat

20 Communication signal wires

30IC on-off circuit 301 winding displacements

40 logic cards

50 computer equipments

1 chip

11 substrates

1A detects face

2 conductive junction points

3 integrated circuit

31 decoder circuits, 32 contactors

4 computer equipments

Embodiment

For making the auditor understand purpose of the present invention, feature and effect, existing by following specific embodiment, and conjunction with figs., the present invention is described in detail, illustrate as the back:

As shown in Figures 1 and 2, the present invention has the detection chip design of a plurality of detecting units, mainly is to make having included a plurality of conductive junction points 2 in the chip 1, and the integrated circuit 3 that is routed at 2 of each conductive junction points constitutes, wherein:

Conductive junction point 2, it is that the row of mining height density establishes mode and selected being packaged on the substrate 11 of chip 1, make the conductive layer on its top concordant with chip 1 surface, and the bottom is to be communicated with integrated circuit 3 formation to connect shape;

Integrated circuit 3, it is made of decoder circuit 31 and contactor 32, the analysis mode that this decoder circuit 31 is gathered and edited, decoded is carried out the interconnected of test core loop by the software programming, makes itself and contactor 32 act on controlling signal and conductive junction point 2 transmission UNICOMs each other;

So constitute, can constitute a detecting unit with conductive junction point 2, decoder circuit 31 and contactor 32 by a plurality of, making chip 1 be able to a plurality of detecting units and be configured to a highdensity detection surface of contact, is to make chip 1 generally carry out electric circuit inspection with the determinand with high-density test contact.

Wherein, the decoder circuit of this chip conductive junction point is an existing mature technology, is substantially promptly reached the control of 2**N point by N address lines.

Application technology of the present invention, be to make chip 1 be configured to a detection surface of contact with super-high density test contacts with a plurality of detecting units, make the circuit junction density of conductive junction point 2 density of detection surface of contact greater than all measured objects, in making measured object and chip 1 touch mutually detecting during circuit, arbitrary circuit junction on the measured object all has the corresponding some conductive junction points 2 that touch with it, and this decoder circuit 31 has the minority of utilization address lines via volume, the analysis mode of decoding, come the signal transmission of each conductive junction point on the control detection surface of contact, by this to make the PCB of the present invention applicable to various high-density circuit structure, LCD, semiconductor or other determinand carry out interior electric circuit inspection.

Moreover, by with a plurality of chips 1 in selected mode of arranging, or after the array row mode of establishing is laid in a detection platform, be to make chip 1 be configured to a large-scale detection face 1A (as shown in Figure 3), make it can be widely and the measured object adaptation application of all size.

As shown in Figure 4, when the present invention uses in actual detected, be to get two detection face 1A to set up in the mode that the detection surface of contact with conductive junction point 2 is mutual correspondence, making the chip 1 that respectively detects face 1A get distribution connects to a computer equipment 4, after making tested object be folded in two detection face 1A, arbitrary circuit junction of this tested object is touched by one or more conductive junction point 2 correspondences all can, detects one by one to make computer equipment 4 fully carry out the signal conducting at each circuit junction.

This chip initial stage is mainly used in the detection of circuit substrate, and desire to reach this function and must synthesize test macro with a plurality of chipsets, and by the external software programming Control, to reach required function (asking for an interview shown in Figure 4).

In addition, adopt the mode of Chip Packaging because of the present invention, with objects such as conventional probe 10, Communication signal wire 20 and IC on-off circuits 30, all come framework to replace with a packaged chip, be with, originally for detecting problems such as signal attenuation, noise control, assembly precision, all can improve in the lump, also significantly improve the precision of detected value simultaneously.

In sum, the design with detection chip of a plurality of detecting units of the present invention provides the laying of this detection conductive junction point super-high density, and uses with the method for chip manufacturing conductive junction point, applies for patent of invention in view of the above in accordance with the law.

Claims

1. detection chip with a plurality of detecting units is characterized in that: mainly be to make having included a plurality of conductive junction points in the chip, and the integrated circuit that is routed between each conductive junction point constitute, wherein:

Conductive junction point, this conductive junction point adopt the highdensity row mode of establishing to select and are packaged on the substrate of chip, make the conductive layer on its top concordant with chip surface, and the bottom are to form to be communicated with integrated circuit to connect shape;

Integrated circuit, it is made of decoder circuit and contactor, this decoder circuit adopts the analysis mode of coding, decoding, carries out the interconnected of test core loop by the software programming, makes decoder circuit and contactor act on controlling signal and conductive junction point transmission UNICOM each other;

So constitute, can constitute a detecting unit with conductive junction point, decoder circuit and contactor by a plurality of, make chip be able to a plurality of detecting units and be configured to a highdensity detection surface of contact, make chip and various determinand carry out electric circuit inspection with test contacts.

2. the detection chip with a plurality of detecting units as claimed in claim 1 is characterized in that: this chip is that selected the arrangement is laid in detection platform and the structure group is one to detect face.