CN100383276C - 具有带永磁配置结构的阴极的溅射装置 - Google Patents
具有带永磁配置结构的阴极的溅射装置 Download PDFInfo
- Publication number
- CN100383276C CN100383276C CNB991197895A CN99119789A CN100383276C CN 100383276 C CN100383276 C CN 100383276C CN B991197895 A CNB991197895 A CN B991197895A CN 99119789 A CN99119789 A CN 99119789A CN 100383276 C CN100383276 C CN 100383276C
- Authority
- CN
- China
- Prior art keywords
- negative electrode
- permanent magnet
- central
- face
- row
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005291 magnetic effect Effects 0.000 claims abstract description 20
- 239000003302 ferromagnetic material Substances 0.000 claims abstract description 8
- 238000004544 sputter deposition Methods 0.000 claims abstract description 5
- 230000005389 magnetism Effects 0.000 claims description 11
- 230000005684 electric field Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 239000002826 coolant Substances 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Microwave Tubes (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19836125.4 | 1998-08-10 | ||
DE19836125A DE19836125C2 (de) | 1998-08-10 | 1998-08-10 | Zerstäubungsvorrichtung mit einer Kathode mit Permanentmagnetanordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1248640A CN1248640A (zh) | 2000-03-29 |
CN100383276C true CN100383276C (zh) | 2008-04-23 |
Family
ID=7877040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB991197895A Expired - Lifetime CN100383276C (zh) | 1998-08-10 | 1999-08-10 | 具有带永磁配置结构的阴极的溅射装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US6207028B1 (zh) |
EP (1) | EP0980090B1 (zh) |
JP (1) | JP4243388B2 (zh) |
KR (1) | KR100604649B1 (zh) |
CN (1) | CN100383276C (zh) |
AT (1) | ATE361548T1 (zh) |
DE (2) | DE19836125C2 (zh) |
TW (1) | TW442823B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1258616C (zh) * | 2001-02-07 | 2006-06-07 | 旭硝子株式会社 | 溅射装置及溅射成膜方法 |
CA2483260C (en) * | 2002-05-06 | 2008-12-09 | Guardian Industries Corp. | Sputter coating apparatus including ion beam source(s), and corresponding method |
DE102004007813A1 (de) * | 2004-02-18 | 2005-09-08 | Applied Films Gmbh & Co. Kg | Sputtervorrichtung mit einem Magnetron und einem Target |
US7485210B2 (en) * | 2004-10-07 | 2009-02-03 | International Business Machines Corporation | Sputtering target fixture |
JP5461264B2 (ja) * | 2010-03-25 | 2014-04-02 | キヤノンアネルバ株式会社 | マグネトロンスパッタリング装置、及び、スパッタリング方法 |
CN103474314B (zh) * | 2013-09-27 | 2016-01-20 | 西南交通大学 | 径向无箔二极管引导磁场系统 |
CN111022275B (zh) * | 2019-12-23 | 2020-12-29 | 北京航空航天大学 | 一种磁等离子体推力器的阳极结构及磁等离子体推力器 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0337012A2 (de) * | 1988-04-14 | 1989-10-18 | Leybold Aktiengesellschaft | Zerstäubungskathode nach dem Magnetron-Prinzip |
EP0704878A1 (en) * | 1994-09-27 | 1996-04-03 | Applied Materials, Inc. | Uniform film thickness deposition of sputtered materials |
CN1133350A (zh) * | 1994-12-26 | 1996-10-16 | 松下电器产业株式会社 | 磁性管溅射装置 |
CN2241698Y (zh) * | 1996-03-08 | 1996-12-04 | 甘国工 | 平面磁控溅射源 |
CN1153832A (zh) * | 1996-01-05 | 1997-07-09 | 日本真空技术株式会社 | 离子溅射泵 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2028377B (en) | 1978-08-21 | 1982-12-08 | Vac Tec Syst | Magnetically-enhanced sputtering device |
US4265729A (en) * | 1978-09-27 | 1981-05-05 | Vac-Tec Systems, Inc. | Magnetically enhanced sputtering device |
US4461688A (en) * | 1980-06-23 | 1984-07-24 | Vac-Tec Systems, Inc. | Magnetically enhanced sputtering device having a plurality of magnetic field sources including improved plasma trapping device and method |
JPS59200763A (ja) * | 1983-04-30 | 1984-11-14 | Fujitsu Ltd | スパツタリング装置 |
CH672319A5 (en) * | 1987-12-20 | 1989-11-15 | Bogdan Zega | Sputtering target cooling system - has metal membrane sepg. cooling liq. circuit from sputtering chamber |
DE3912381A1 (de) * | 1988-04-15 | 1989-10-26 | Sharp Kk | Auffaengereinheit |
JPH0774439B2 (ja) * | 1989-01-30 | 1995-08-09 | 三菱化学株式会社 | マグネトロンスパッタ装置 |
DE3937558C2 (de) * | 1989-11-11 | 1997-02-13 | Leybold Ag | Katodenzerstäubungsvorrichtung |
DE4201551C2 (de) * | 1992-01-22 | 1996-04-25 | Leybold Ag | Zerstäubungskathode |
US5328585A (en) * | 1992-12-11 | 1994-07-12 | Photran Corporation | Linear planar-magnetron sputtering apparatus with reciprocating magnet-array |
DE4301516C2 (de) * | 1993-01-21 | 2003-02-13 | Applied Films Gmbh & Co Kg | Targetkühlung mit Wanne |
DE19607803A1 (de) * | 1996-03-01 | 1997-09-04 | Leybold Ag | Vorrichtung zur Überwachung der Targetabnutzung von Sputterkathoden |
DE19614487A1 (de) * | 1996-04-12 | 1997-10-16 | Leybold Ag | Sputterkathode |
DE19819785A1 (de) * | 1998-05-04 | 1999-11-11 | Leybold Systems Gmbh | Zerstäubungskathode nach dem Magnetron-Prinzip |
-
1998
- 1998-08-10 DE DE19836125A patent/DE19836125C2/de not_active Expired - Lifetime
-
1999
- 1999-07-30 AT AT99114913T patent/ATE361548T1/de not_active IP Right Cessation
- 1999-07-30 DE DE59914321T patent/DE59914321D1/de not_active Expired - Lifetime
- 1999-07-30 EP EP99114913A patent/EP0980090B1/de not_active Expired - Lifetime
- 1999-08-02 TW TW088113172A patent/TW442823B/zh not_active IP Right Cessation
- 1999-08-06 JP JP22408899A patent/JP4243388B2/ja not_active Expired - Lifetime
- 1999-08-09 KR KR1019990032490A patent/KR100604649B1/ko not_active IP Right Cessation
- 1999-08-10 CN CNB991197895A patent/CN100383276C/zh not_active Expired - Lifetime
- 1999-08-10 US US09/371,605 patent/US6207028B1/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0337012A2 (de) * | 1988-04-14 | 1989-10-18 | Leybold Aktiengesellschaft | Zerstäubungskathode nach dem Magnetron-Prinzip |
EP0704878A1 (en) * | 1994-09-27 | 1996-04-03 | Applied Materials, Inc. | Uniform film thickness deposition of sputtered materials |
CN1133350A (zh) * | 1994-12-26 | 1996-10-16 | 松下电器产业株式会社 | 磁性管溅射装置 |
CN1153832A (zh) * | 1996-01-05 | 1997-07-09 | 日本真空技术株式会社 | 离子溅射泵 |
CN2241698Y (zh) * | 1996-03-08 | 1996-12-04 | 甘国工 | 平面磁控溅射源 |
Also Published As
Publication number | Publication date |
---|---|
DE19836125A1 (de) | 2000-02-24 |
DE19836125C2 (de) | 2001-12-06 |
KR100604649B1 (ko) | 2006-07-25 |
US6207028B1 (en) | 2001-03-27 |
KR20000017180A (ko) | 2000-03-25 |
EP0980090B1 (de) | 2007-05-02 |
EP0980090A2 (de) | 2000-02-16 |
CN1248640A (zh) | 2000-03-29 |
DE59914321D1 (de) | 2007-06-14 |
JP4243388B2 (ja) | 2009-03-25 |
TW442823B (en) | 2001-06-23 |
ATE361548T1 (de) | 2007-05-15 |
EP0980090A3 (de) | 2004-12-01 |
JP2000096225A (ja) | 2000-04-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: BALZERS UND LEYBOLD DEUTSCHLAND HOLDING AG Free format text: FORMER OWNER: LEYBOLD AG Effective date: 20020306 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20020306 Address after: Federal Republic of Germany, Kazakhstan Applicant after: Balzers Und Leybold Deutschland Holding AG Address before: Federal Republic of Germany, Kazakhstan Applicant before: Leybold Systems GmbH |
|
ASS | Succession or assignment of patent right |
Owner name: BAOERZESI PROCESS SYSTEMS CO.LTD. Free format text: FORMER OWNER: BALZERS UND LEYBOLD DEUTSCHLAND HOLDING AG Effective date: 20020320 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20020320 Address after: Federal Republic of Germany, Kazakhstan Applicant after: Bauer Ze J process systems, Limited by Share Ltd Address before: Federal Republic of Germany, Kazakhstan Applicant before: Balzers Und Leybold Deutschland Holding AG |
|
ASS | Succession or assignment of patent right |
Owner name: LEIPOLD PAINT LIMITED PARTNERSHIP Free format text: FORMER OWNER: BAOERZESI PROCESS SYSTEMS CO.LTD. Effective date: 20020724 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20020724 Address after: Federal Republic of Germany Applicant after: Laborde paint Co Ltd Address before: Federal Republic of Germany, Kazakhstan Applicant before: Bauer Ze J process systems, Limited by Share Ltd |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: APPLIED MATERIALS SHARES LIMITED PARTNERSHIP Free format text: FORMER NAME OR ADDRESS: APPLIED PHILIN GMBH + CO. KG |
|
CP03 | Change of name, title or address |
Address after: In Germany Patentee after: Applied Films GmbH & Co. KG Address before: Federal Republic of Germany Patentee before: Applied Films GmbH & Co. KG |
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CX01 | Expiry of patent term |
Granted publication date: 20080423 |
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CX01 | Expiry of patent term |