CN100361293C - 内含无源元件的外露式有源元件基座模块 - Google Patents
内含无源元件的外露式有源元件基座模块 Download PDFInfo
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Abstract
本发明揭示一种内含无源元件的外露式有源元件基座模块,包括:一有源元件基座;一有源元件,于上述有源元件基座上;一连接线,与上述有源元件基座以间隔方式设置于其周围,且与上述有源元件电连接;一连接垫,与上述连接线以间隔方式设置于其周围;一无源元件,电连接上述连接线与上述连接垫之间;一隔绝材料,包覆上述有源元件、上述连接线、与上述无源元件上,并暴露上述有源元件基座与至少部分上述连接垫。
Description
技术领域
本发明涉及一种封装结构,特别是涉及一种内含无源元件的外露式有源元件基座模块。
背景技术
现今数字信息产品发展以整合芯片、高频及高速为趋势,因此强调体积小、散热良好及电性特性佳的芯片模块封装结构,以因应信息产品市场的快速发展。因此对于许多整合电路产品而言,封装技术是非常关键的一环,而芯片的封装技术种类非常的多样化。其中,具有低接脚电感(pin inductance)效能的QFN(quad flat no-lead)封装技术是目前最受瞩目的封装技术之一,其主要是以导线架为基材的封装方法。
QFN的导线架具有一芯片承载座以及多个独立排列于上述芯片承载座四周的引脚,上述芯片承载座上粘着一芯片,上述芯片上各焊点以导线与相对应的引脚形成电连接,且于上述导线架上形成有一封装胶体包覆上述芯片,上述引脚的外端部与上述封装胶体平齐,且上述引脚底面暴露于上述封装胶体外,而构成一四方扁平无外伸引脚的半导体元件。
虽然QFN封装体的体积、电性能表现等特性已较其它传统以导线架为基材的封装型式佳,但是实际应用在电子产品的组装时,QFN封装体仍须与一些无源元件一起组装于印刷电路板上,上述印刷电路板仍须设计线路来连接上述QFN封装体与无源元件,这些线路的存在仍会占用上述印刷电路板乃至电子产品的体积,且上述印刷电路板上过密的线路会导致线路之间的串扰效应(crosstalk),而仍对电性能造成不良影响。因此,仅仅改善封装体的体积、电性能表现等特性对整体电子产品体积的缩小及效能的改善方面的贡献仍是相当有限。
发明内容
有鉴于此,本发明的主要目的是提供一种内含无源元件的外露式有源元件基座模块,减少印刷电路板所需求的线路,以提升使用本发明的内含无源元件的外露式有源元件基座模块的电子产品的电性能表现并缩小其体积。
为达成本发明的上述目的,本发明提供一种内含无源元件的外露式有源元件基座模块,包括:一有源元件基座;一有源元件,于上述有源元件基座上;一连接线,与上述有源元件基座以间隔方式设置于其周围,且与上述有源元件电连接;一连接垫,与上述连接线以间隔方式设置于其周围;一无源元件,电连接上述连接线与上述连接垫之间;一隔绝材料,包覆上述有源元件、上述连接线、与上述无源元件上,并暴露上述有源元件基座与至少部分上述连接垫。
本发明又提供一种内含无源元件的外露式有源元件基座模块,包括:一有源元件基座;一有源元件,于上述有源元件基座上;一连接线,其厚度小于上述有源元件基座,与上述有源元件基座以间隔方式设置于其周围;一导体,电连接上述有源元件与上述连接线;一连接垫,其厚度大体等于上述有源元件基座,与上述连接线以间隔方式设置于其周围;一表面粘着式的无源元件,位于上述连接线与上述连接垫之间,且电连接上述连接线与上述连接垫之间;一图形化的防焊层,于上述连接垫与上述连接线的间隔上、上述第一连接在线、与上述第一连接垫上;一第一隔绝材料,覆盖于上述有源元件、上述连接线、与上述无源元件上;以及一第二隔绝材料,覆盖于上述连接线与上述无源元件下,与上述第一隔绝材料相对,并暴露上述有源元件基座与至少部分上述连接垫。
本发明的特征,在于将无源元件整合至外露式有源元件基座模块。整个模块的体积不但可以比原先封装体加无源元件的体积小,且缩短了两者之间的联机长度,更有助于电性表现的改善;再加上将本发明的内含无源元件的外露式有源元件基座模块,组装于电子产品的印刷电路板时,上述印刷电路板的电路设计可以简化,更进一步缩小上述印刷电路板乃至电子产品的体积,并改善其电性表现。
为了让本发明的上述和其它目的、特征、和优点能更明显易懂,下文特举二优选实施例,并配合附图作详细说明。
附图说明
图1为一剖面图,显示本发明第一实施例的内含无源元件的外露式有源元件基座模块的结构。
图2为一剖面图,显示本发明第二实施例的内含无源元件的外露式有源元件基座模块的结构。
图3A~3F为一系列的剖面图,显示制造本发明第一实施例的内含无源元件的外露式有源元件基座模块的流程。
图4A~4B为一系列的剖面图,显示制造本发明第二实施例的内含无源元件的外露式有源元件基座模块的流程。
简单符号说明
100~基板 101~有源元件基座
105~粘着层 110、180~有源元件
115~导线 120~连接线
130~连接垫 131~本体部
132~延伸部 140~连接垫
141~本体部 142~延伸部
150~无源元件 151、152~接点
160~防焊层 161、162、163~开口
161’、162’~开口 170~隔绝材料
171~第一隔绝材料 172~第二隔绝材料
185~导电凸块
具体实施方式
第一实施例
请参考图1,为一剖面图,显示本发明第一实施例的内含无源元件的外露式有源元件基座模块。
本发明的内含无源元件的外露式有源元件基座模块,顾名思义,具有一外露的有源元件基座101,其上装设有一有源元件110例如为半导体芯片、光电元件、或是其它元件(在本实施例中为半导体芯片)。一连接线120则以与有源元件基座101以间隔方式设置于其周围,且与有源元件110电连接。
在图1中使用一导线115例如为金线或铝线做为导体,连接有源元件110上的焊垫(未绘示)与连接线120,此时有源元件110与有源元件基座101之间最好为具有一粘着层105例如为热固性的环氧树脂,将有源元件110固定在有源元件基座101上。
一连接垫130,则与该连接线以间隔方式设置于其周围,其可以还包括一本体部131与延伸部132,其中延伸部132自本体部131延伸至连接线120的周围。一无源元件150,最好为具有接点151与152分别与连接线120与连接垫130电连接,而使无源元件150电连接于连接线120与连接垫130之间,并使有源元件110经由导线115、连接线120、无源元件150而至连接垫130构成一导通的线路。而当连接垫130具有本体部131与延伸部132时,接点152则电连接至延伸部132,而电连接于连接线120与延伸部132之间。无源元件150最好为表面粘着式的无源元件,可藉由软焊料155作为粘着层,将其置于连接线120与连接垫130之间,而构成其与连接线120及连接垫130的电连接。而为了制造工艺上的方便,连接线120及连接垫130上最好为具有一图形化的防焊层160,暴露两者与无源元件150的接点以及连接线120与导线,在连接无源元件150与连接线120及连接垫130,可以防止软焊料155扩散到上述接点以外的部分。
另外,有源元件基座101、连接线120、与连接垫130三者的材料通常为铜,其上也可以具有具防蚀及/或助焊功能的镀层(未绘示)例如镍/金层。
最后,包覆有源元件110、连接线120、与无源元件150的是隔绝材料170,其材料通常为热固性环氧树脂与二氧化硅填充材的混合物,而当有源元件110为光电元件或包括光电元件时,有时隔绝材料170会选用透明玻璃及/或透明的热固性树脂。因此连接线120的厚度最好为小于有源元件基座101的厚度,以方便隔绝材料170将其包覆。另外,隔绝材料170并暴露有源元件基座101与至少部分连接垫130;当连接垫130具有本体部131与延伸部132时,暴露的部分最好是其本体部131,而延伸部132的厚度最好为小于本体部131,延伸部132并完全包覆于隔绝材料170中。暴露的有源元件基座101可帮助本发明的内含无源元件的外露式有源元件基座模块的散热,而暴露的连接垫130则用作本发明的内含无源元件的外露式有源元件基座模块与一外部元件例如印刷电路板电连接的接点。
另外,隔绝材料170可能因制造工艺的因素区分为第一隔绝材料171与第二隔绝材料172。第一隔绝材料171位于本发明的内含无源元件的外露式有源元件基座模块的上侧,覆盖有源元件基座101、有源元件110、以及连接线120与无源元件150的上侧;第二隔绝材料172与第一隔绝材料171相对,位于本发明的内含无源元件的外露式有源元件基座模块的下侧,覆盖连接线120与无源元件150(以及延伸部132)的下侧,而将接线120与无源元件150(以及延伸部132)完全包覆。此外,第二隔绝材料172并暴露有源元件基座101与至少部分连接垫130。而第一隔绝材料171与第二隔绝材料172最好为同一材料,以提升本发明的内含无源元件的外露式有源元件基座模块的可靠度。
为了方便本发明的内含无源元件的外露式有源元件基座模块与上述外部元件的连接,暴露的有源元件基座101最好为与暴露的连接垫130共平面。而有源元件基座101的厚度则最好为大体等于连接垫130的厚度,以方便两者的共平面配置。而隔绝材料170最好为与暴露的有源元件基座101和暴露的连接垫130共平面,以尽量降低本发明的内含无源元件的外露式有源元件基座模块的总厚度。
如上所述,本发明的内含无源元件的外露式有源元件基座模块,已将无源元件150整合至其中。整个模块的体积不但可以比现有封装体加无源元件的体积小,且缩短了两者之间的联机长度,更有助于电性表现的改善;再加上将本发明的内含无源元件的外露式有源元件基座模块,组装于电子产品的印刷电路板时,上述印刷电路板的电路设计可以简化,更进一步缩小上述印刷电路板乃至电子产品的体积,并改善其电性表现,达成本发明的上述目的。
另外,本发明的内含无源元件的外露式有源元件基座模块,也可以具有未连接无源元件150的线路。如图1中的连接垫140,直接与有源元件基座101以间隔方式设置于其周围,且与有源元件110经由导线115而构成电连接。连接垫140也可还包括本体部141与延伸部142,其中延伸部142自本体部141延伸至有源元件基座101的周围;此时导线115最好电连接于延伸部142。连接垫140上最好也具有图形化的防焊层160,暴露出连接垫140上与导线115连接的接点。连接垫140并至少部分为隔绝材料170所暴露,暴露的连接垫140也是用以与上述外部元件电连接;且当连接垫140具有本体部141与延伸部142时,最好为延伸部142的厚度小于本体部141且延伸部142为隔绝材料170所包覆,而暴露本体部141。另外,也是为了方便将本发明的内含无源元件的外露式有源元件基座模块连接至上述外部元件,暴露的连接垫140最好为与暴露的有源元件基座101及连接垫130共平面。
第二实施例
请参考图2,为一剖面图,显示本发明第二实施例的内含无源元件的外露式有源元件基座模块。
本实施例与第一实施例的差别在于电连接有源元件180与连接线120的方式。
有源元件180例如为半导体芯片、光电元件、或是其它元件(在本实施例中为半导体芯片),其与连接线120的电连接,使用覆晶的方式,经由导电凸块185做为导体,建立连接线120与有源元件180的电连接。此时,有源元件180也同时藉由导电凸块185固定于连接线120,而有源元件180的位置也是位于有源元件基座101的上方。
除了连接垫140也是经由导电凸块185做为导体,建立其与有源元件180的电连接、并将有源元件180固定于其上之外,至于本实施例中其它各个元件及彼此的连接关系,则与第一实施例所述者相同,在此便予以省略。
第三实施例
请参考图3A~3F,为一系列的剖面图,显示本发明第一实施例的内含无源元件的外露式有源元件基座模块的一例。
首先,请参考图3A,提供一基板100,最好为一铜基板,更好为其上镀有具防蚀及/或助焊功能的镀层(未绘示)例如镍/金层。为了后续组装各元件时,能够准确的对准,基板100上最好具有一图形化的防焊层160,其具有开口161、162、163,分别暴露后续有源元件110的组装位置、有源元件110与基板100电连接的接点、与后续无源元件150与基板100电连接的接点,并限制后续组装有源元件110与无源元件150时所使用的粘着层的位置,不至于扩散到整个基板上。
接下来,请参考图3B,于开口163(标示于图3A)内形成一软焊料155,通常为锡基合金的粒子与助焊剂的混合物,业界通称为锡膏;再将无源元件150与开口163内的软焊料155对准,而将其组装于基板100上,无源元件150最好为表面粘着式的无源元件,具有接点151与152分别置于开口163内的软焊料155上;接下来执行一回焊的程序,使软焊料155中的锡基合金的粒子熔化、聚集并连接至基板100与无源元件150,而后冷却、固化后,将无源元件150固定于基板100上,并形成其与基板100的电连接。
接下来,请参考图3C,将粘着层105例如为含银或不含银的热固性环氧树脂形成于开口161(标示于图3A)内,再将有源元件110例如为半导体芯片置于粘着层105上,再藉由一烘烤的步骤使粘着层105硬化,而将有源元件110固定于基板100上。然后,再以一导线115例如为金线或铝线连接有源元件110上的焊垫(未绘示)与开口162(标示于图3A)所暴露的基板100,而构成有源元件110与基板100的电连接。
接下来,请参考图3D,藉由一第一封胶(molding)的步骤,形成一第一隔绝材料171于本发明的内含无源元件的外露式有源元件基座模块的上侧,覆盖有源元件基座101、有源元件110、以及连接线120与无源元件150的上侧。第一隔绝材料171通常为热固性树脂与二氧化硅填充材的混合物,而当有源元件110为一光电元件或包括光电元件时,第一隔绝材料171有时会选用透明玻璃及/或透明的热固性树脂。
接下来,请参考图3E,进行第一阶段的蚀刻,在基板100蚀刻出第一实施例的暴露的有源元件基座101、连接垫130(、与连接垫140)(请参考图1)的雏形。
接下来,请参考图3F,进行第二阶段的蚀刻,将基板100蚀刻并分离为有源元件基座101、连接线120、连接垫130(还包括本体部131与延伸部132)(、与连接垫140(还包括本体部141与延伸部142))。
最后,藉由一第二封胶的步骤,形成一第二隔绝材料172。就如图1所示的本发明第一实施例的内含无源元件的外露式有源元件基座模块。第二隔绝材料172与第一隔绝材料171相对,位于本发明的内含无源元件的外露式有源元件基座模块的下侧,覆盖连接线120与无源元件150(以及延伸部132、142)的下侧,而将接线120与无源元件150(以及延伸部132、142)完全包覆。此外,第二隔绝材料172并暴露有源元件基座101与至少部分连接垫130(与140)。而第一隔绝材料171与第二隔绝材料172最好为同一材料,以提升本发明的内含无源元件的外露式有源元件基座模块的可靠度。
第四实施例
请参考图3A~3B,为一系列的剖面图,显示本发明第二实施例的内含无源元件的外露式有源元件基座模块的一例。
首先,请参考图4A,提供一基板100,最好为一铜基板,更好为其上镀有具防蚀及/或助焊功能的镀层(未绘示)例如镍/金层。为了后续组装各元件时,能够准确的对准,基板100上最好具有一图形化的防焊层160,其具有开口161’、162’、163,分别暴露后续有源元件180的组装位置、有源元件180与基板100电连接的接点、与后续无源元件150与基板100电连接的接点,并限制后续组装有源元件180与无源元件150时所使用的粘着层的位置,不至于扩散到整个基板上。
接下来,请参考图4B,将有源元件180与无源元件150固定并电连接于基板100上。其中有源元件180藉由导电凸块185固定并电连接于基板100上,而导电凸块185可事先形成于有源元件180上或是在此步骤前先行形成于开口162’(标示于图4A)所暴露的基板100上,在藉由一粘着层(未绘示)的帮助,使有源元件180固定并电连接于基板100上。而将无源元件150固定并电连接于基板100上的说明,则与第三实施例相同,在此便予以省略。
接下来的步骤可参考第三实施例的图3C~3F的描述,以大体相同的步骤,最后得到如图2所示本发明第二实施例的内含无源元件的外露式有源元件基座模块。
虽然本发明以优选实施例揭露如上,然而其并非用以限定本发明,本领域的技术人员在不脱离本发明的精神和范围内,可作些许的更动与润饰,因此本发明的保护范围应当以后附的权利要求所界定者为准。
Claims (19)
1.一种内含无源元件的外露式有源元件基座模块,包括:
一有源元件基座;
一有源元件,位于该有源元件基座上;
一连接线,与该有源元件基座以间隔方式设置于其周围,且与该有源元件电连接,该连接线的厚度小于该有源元件基座的厚度;
一连接垫,与该连接线以间隔方式设置于其周围;
一无源元件,位于该连接线与该连接垫之间,且电连接该连接线与该连接垫;以及
一隔绝材料,完全包覆该有源元件、该连接线与该无源元件,并暴露该有源元件基座与至少部分该连接垫。
2.如权利要求1所述的内含无源元件的外露式有源元件基座模块,其中该连接垫还包括:
一本体部;以及
一延伸部,自该本体部延伸至该连接线周围。
3.如权利要求2所述的内含无源元件的外露式有源元件基座模块,其中该无源元件位于该连接线与该延伸部之间,且电连接该连接线与该延伸部。
4.如权利要求2所述的内含无源元件的外露式有源元件基座模块,其中该延伸部还包覆于该隔绝材料内。
5.如权利要求1所述的内含无源元件的外露式有源元件基座模块,其中该有源元件基座、该连接线与该连接垫包括铜。
6.如权利要求1所述的内含无源元件的外露式有源元件基座模块,其中暴露的该有源元件基座与暴露的该连接垫为共平面。
7.如权利要求1所述的内含无源元件的外露式有源元件基座模块,还包括一图形化的防焊层于该连接线与该连接垫上。
8.如权利要求1所述的内含无源元件的外露式有源元件基座模块,其中该有源元件包括一半导体芯片。
9.如权利要求1所述的内含无源元件的外露式有源元件基座模块,还包括一导体电连接该有源元件与该连接线。
10.如权利要求9所述的内含无源元件的外露式有源元件基座模块,其中该导体为一金线、一铝线或一导电凸块。
11.如权利要求1所述的内含无源元件的外露式有源元件基座模块,其中该无源元件为表面安装式的无源元件。
12.一种内含无源元件的外露式有源元件基座模块,包括:
一有源元件基座;
一有源元件,位于该有源元件基座上;
一连接线,其厚度小于该有源元件基座,与该有源元件基座以间隔方式设置于其周围;
一导体,电连接该有源元件与该连接线;
一连接垫,其厚度等于该有源元件基座,与该连接线以间隔方式设置于其周围;
一表面粘着式的无源元件,位于该连接线与该连接垫之间,且电连接该连接线与该连接垫;
一图形化的防焊层,位于该连接垫与该连接线的间隔上、该连接线与该连接垫上;
一第一隔绝材料,覆盖于该有源元件、该连接线与该无源元件上;以及
一第二隔绝材料,覆盖于该连接线与该无源元件下,与该第一隔绝材料相对,并暴露该有源元件基座与至少部分该连接垫。
13.如权利要求12所述的内含无源元件的外露式有源元件基座模块,其中该连接垫还包括:
一本体部;以及
一延伸部,其厚度小于该本体部,自该本体部延伸至该连接线周围。
14.如权利要求13所述的内含无源元件的外露式有源元件基座模块,其中该无源元件位于该连接线与该延伸部之间,且电连接该连接线与该延伸部。
15.如权利要求13所述的内含无源元件的外露式有源元件基座模块,其中该第二隔绝材料还覆盖于该延伸部下。
16.如权利要求13所述的内含无源元件的外露式有源元件基座模块,其中该有源元件基座、该连接线与该连接垫包括铜。
17.如权利要求12所述的内含无源元件的外露式有源元件基座模块,其中暴露的该有源元件基座与暴露的该连接垫为共平面。
18.如权利要求12所述的内含无源元件的外露式有源元件基座模块,其中该有源元件包括一半导体芯片。
19.如权利要求12所述的内含无源元件的外露式有源元件基座模块,其中该导体为一金线、一铝线或一导电凸块。
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6451627B1 (en) * | 1999-09-07 | 2002-09-17 | Motorola, Inc. | Semiconductor device and process for manufacturing and packaging a semiconductor device |
CN1343086A (zh) * | 2000-01-31 | 2002-04-03 | 三洋电机株式会社 | 电路装置及其制造方法 |
US20020185713A1 (en) * | 2001-06-11 | 2002-12-12 | Rohm Co., Ltd. | Lead frame |
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