CN100358115C - Oscillating shower transfer type substrate treatment device - Google Patents
Oscillating shower transfer type substrate treatment device Download PDFInfo
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- CN100358115C CN100358115C CNB2005100709146A CN200510070914A CN100358115C CN 100358115 C CN100358115 C CN 100358115C CN B2005100709146 A CNB2005100709146 A CN B2005100709146A CN 200510070914 A CN200510070914 A CN 200510070914A CN 100358115 C CN100358115 C CN 100358115C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
Abstract
This case is to provide a moving substrate processing device which can efficiently remove bubbles that are produced on a surface of processing liquid that is supplied to the surface and which can solve non-uniform processing rate in width direction which is key point of large substrate. The processing liquid is supplied, m horizontal direction, to a plurality of spray nozzle 34a of a substrate 100 entire surface so as to shake at both sides in a moving direction toward the substrate 100. A liquid flow from one side portion to another side portion and a liquid flow from one side portion to another side portion can form interactively.
Description
The application of this part is dividing an application of Chinese invention patent application 01804736.X number.
Technical field
The present invention relates to the middle transfer type substrate treating devices that use such as manufacturing of liquid crystal indicator with glass substrate.
Background technology
The glass substrate that uses in the liquid crystal indicator is by chemical treatment is made to implementing that burn into is peeled off repeatedly as the surface of the glass substrate of base material etc.This processing unit roughly is divided into dry type and wet type; Wet type is divided into batch type and vane type again; Vane type is divided into rotary again and based on the conveying type of roller transmission etc.
In these substrate board treatments, the device of conveying type has the basic structure of substrate being supplied with treatment fluid when horizontal direction transmits to the surface of this substrate, because the efficient height, so former corrosion treatment and the lift-off processing of being used to.
The transfer type substrate treating device that uses in the corrosion treatment is jet etching liquid from a plurality of injection nozzles of rectangular configuration above the substrate conveyer line, passes through in this corrosive liquid by making substrate, supplies with corrosive liquid to the whole surface of substrate.Handle by this spray, except that the part that has applied mask material, the surface of substrate is corroded selectively.Corrosion is carried out the clean based on follow-up spray after finishing.The device of lift-off processing also has substantially the same structure.
But with in the glass substrate, in the maximization of substrate, the height of circuit becomes more meticulous and is also going deep at liquid crystal indicator.As the wiring material that on this substrate, uses, used Cr in the past mostly, but, turning to and using little Al or the Al/Mo of resistivity value along with present height becomes more meticulous.Therefore, even the transfer type substrate treating device of corrosion usefulness is also brought into use the Al corrosive liquid, but, find following problem along with using this corrosive liquid.
As the Al corrosive liquid, use with the corrosive liquid of phosphoric acid as Main Ingredients and Appearance.If with the surface of this corrosive liquid supplying substrate, then seldom do not occur in the situation of the fine bubble that produces with the reaction of metal on the metal film.Even the physical action of the spray by corrosive liquid can not be removed this bubble, on the metal film that is trapped in substrate, thereby become the irregular reason of corrosion takes place.
In general, in handling, in the spray of corrosive liquid, pass through, rearward make corrosive liquid moving from direction of transfer the place ahead, carry out the liquid displacement in the upstream surface of substrate by making substrate based on the spray of corrosive liquid.No problem under the little situation of substrate, if but substrate maximize, then compare with the both sides of substrate, the tendency of being detained corrosive liquid is arranged at central portion.Its result, Width central portion and both sides produce difference on rate of corrosion, and this also becomes handles irregular reason.
The rate of corrosion of the Al of Al corrosive liquid can obtain high corrosion efficient thus than the Cr rate of corrosion height of Cr corrosive liquid, and but then, the edge surface of the Al layer after the corrosion becomes the shape of the lamination that is not suitable for down one deck.
Fig. 4 is the cutaway view of the shape of the Al layer after the expression corrosion.Form Al layer 2 and Mo layer 3 on as the glass substrate 1 of base material, the coverage mask material 4 thereon.By corrosion, be removed at mask material 4 unlapped part A l layers 2 and Mo layer 3, but the edge surface of residual Al layer 2 and Mo layer 3 becomes the rapid inclination of representing with solid line of rising steeply.Like this, at one deck under the mounting stably on Al layer 2 and the Mo layer 3.For one deck under the mounting stably, shown in chain-dotted line, need make the inclination of this edge surface mild.Under the situation that does not have Mo layer 3, also there is same tendency.
In addition, Al corrosive liquid and Cr corrosive liquid are in a ratio of high viscosity, and be poor to the wettability on the surface of glass substrate 4.In addition, as mentioned above, the rate of corrosion height.Therefore, when spray is handled beginning the part of the thin droplet impact of corrosive liquid become handle irregular, even handle and can not eliminate, residual after corrosion at spray thereafter.
Summary of the invention
The object of the present invention is to provide a kind of oscillating shower transfer type substrate treatment device, along with can removing the bubble that produces in its surface expeditiously, and can eliminate processing speed unequal of the Width that on large substrate, becomes problem to the supply of the treatment fluid of substrate surface.
Another object of the present invention is to provide a kind of oscillating shower transfer type substrate treatment device, be applicable to the Al corrosion, the edge surface of Al layer can be formed the mild inclined plane of the lamination of one deck under being fit to, it is irregular that the while can spray the processing that causes the elimination initial stage.
To achieve these goals, oscillating shower transfer type substrate treatment device of the present invention is to transmit substrate is supplied with treatment fluid simultaneously to the surface of this substrate transfer type substrate treating device with the level along continuous straight runs, this device comprises the spray unit, this spray unit is supplied with treatment fluid from the direct of travel of substrate and with this direct of travel a plurality of injection nozzles that direction arranges that meet at right angles to the whole surface of substrate, in this spray unit, the head motion that each injection nozzle is shaken to both sides synchronously towards the direct of travel of substrate is set.
Oscillating shower transfer type substrate treatment device of the present invention is in the downstream of described spray unit, can be arranged on the direct of travel part of substrate to spread all over the gap nozzle that whole width is supplied with treatment fluid membranaceously.In addition, the upstream side in the spray unit is arranged on the direct of travel part of substrate and spreads all over the gap nozzle that whole width is supplied with treatment fluid membranaceously.
By a plurality of injection nozzles that constitute the spray unit are shaken to both sides synchronously towards the direct of travel of substrate, the treatment fluid on the surface that supplies to substrate is alternately flowed on this surface to the direct of travel both sides.Promptly, in common injection, the lip-deep treatment fluid that supplies to substrate is except to the direction of transfer rear is discharged forcibly, also discharge naturally by overflowing to both sides, but, alternately form forcibly from the liquid flow of a side direction opposite side of substrate with from the liquid flow of another lateralization by injection nozzle is shaken synchronously to the direct of travel both sides of substrate.Its result can remove the bubble that produces in its surface along with to the supply of the treatment fluid of substrate surface expeditiously, can make the processing speed equalization of Width simultaneously.
Downstream in described spray unit, be arranged on the direct of travel part of substrate and spread all over the gap nozzle that whole width is supplied with treatment fluid membranaceously, handle by the pasting of carrying out the thin mounting of treatment fluid on the substrate surface after handling at spray, can realize carrying out hardly the state of liquid displacement.By this mild processing, the inclination of edge surface becomes mild in the Al corrosion.
Upstream side in described spray unit is arranged on the direct of travel part of substrate and spreads all over the gap nozzle that whole width is supplied with treatment fluid membranaceously, before spray is handled, passes through in this film by making substrate, drenches this surface equably.If in case drench equably, handle even then accept spray afterwards, it is irregular also not produce the processing that drop causes.
Oscillating shower transfer type substrate treatment device of the present invention is particularly suitable for the Al corrosion, but also effective for other corrosion treatment, just has some difference on the effect.
Have, the technology that a plurality of injection nozzles that make formation spray the unit shake to both sides is known (Japanese No. 74248/1999 patent of invention be communique openly) in the substrate board treatment of the inclination conveying type of side inclination and along continuous straight runs transmission making substrate again.But, in the inclination conveying type, not only can not carry out above-mentioned pasting and handle, and the phasic property that spray is handled is bad in itself.
That is, in tilt transmitting, produce flowing of the liquid that tilts to cause.This is flowing on the whole surface of substrate and can not carries out equably, and the tendency that concentrating on the fast part that flows when flowing beginning is arranged.Therefore, generation is flowed irregular.In addition, few because of being tilted in the liquid that is detained on the substrate, so the impact of being sprayed easily, from this respect, it is irregular also to take place to flow.Even in tilting to transmit, injection nozzle is shaken, can not fully eliminate these and flow irregular.To this, transmitting under the situation of substrate, liquid level to a certain degree can be arranged on the substrate with the level along continuous straight runs, can relax the jet impact that spray causes by this liquid level, can carry out liquid equably to the whole surface of substrate simultaneously and supply with.Under this state, by injection nozzle is shaken in both sides, alternately form forcibly from a sidepiece of substrate to the liquid flow of the other side and from the other side to the liquid flow of a sidepiece, the bubble that produces in its surface along with to the supply of the treatment fluid of substrate surface can be removed expeditiously, processing speed unequal of the Width that on large substrate, becomes problem can be eliminated simultaneously.
Transmit the combination of technology with the technology that injection nozzle is shaken of substrate with the level along continuous straight runs, can not sacrifice the advantage that transmits the technology of substrate with the level along continuous straight runs, and eliminate its shortcoming effectively.
Description of drawings
Fig. 1 is the vertical view of the transfer type substrate treating device of expression one embodiment of the invention;
Fig. 2 is the end view of the major part of this substrate board treatment;
Fig. 3 is the front view of the major part of this substrate board treatment;
Fig. 4 is the cutaway view of the shape of the Al layer after the expression corrosion.
Embodiment
Below, embodiments of the invention are described with reference to the accompanying drawings.
The oscillating shower transfer type substrate treatment device of present embodiment is to carry out the device of liquid crystal indicator with the Al corrosion treatment of glass substrate 100 (being designated hereinafter simply as substrate 100).As shown in Figure 1, this substrate board treatment the 2nd conveyer line B, right angle of adopting the 1st conveyer line A, right angle with linearity to be connected to the 1st conveyer line A is connected to the 2nd conveyer line B and the layout of the U rotary type that combines with the 1st conveyer line A the 3rd conveyer line C arranged side by side.
The 1st conveyer line A linearity links acceptance division 10, blocking solution portion 20 and corrosion portion 30 and constitutes.The 2nd conveyer line B is a washing portion 40, is furnished with the spray unit 41 that disperses rinse water to the surface of substrate 100 from the top.The 3rd conveyer line C linearity ground links shifting apparatus 50, rotary dryer 60, shifting apparatus 70 and taking-up portion 80 and constitutes.
The 1st conveyer line A and the 2nd conveyer line B are furnished with a plurality of delivery rollers of arranging with predetermined distance along direction of transfer, so that transmit substrate 100 along the conveyer line length direction.Each delivery roller is and the rectangular horizontal roller of direction of transfer that horizontal support substrate 100 and along continuous straight runs transmit.Inlet portion in the 2nd conveyer line B, i.e. washing portion 40 is provided with the steering mechanism 42 that the direct of travel that makes substrate 100 changes 90 degree.
The substrate 100 of accepting the Al corrosion treatment is sent to acceptance division 10 by conveyer 90.Transmit by roller, this substrate 100 enters corrosion portion 30 from blocking solution portion 20, by accepting corrosion treatment during it.Transmit by follow-up roller, the substrate 100 that has passed through corrosion portion 30 enters washing portion 40, with moving to washing portion 40 behind direct of travel change 90 degree, accepts washing and handle during this moves.
The substrate 100 that moves to the export department of washing portion 40 is sent to rotary dryer 60 by shifting apparatus 50 from washing portion 40.Be sent to taking-up portion 80 by shifting apparatus 70 from rotary dryer 60 with the be through with substrate 100 of dried of rotary dryer 60, be sent to the device outside by conveyer 90 once more.
The oscillating shower transfer type substrate treatment device of present embodiment has obvious characteristics in corrosion portion 30.As shown in Figure 2, this corrosion portion 30 comprises the delivery roller 31 that substrate 100 along continuous straight runs are transmitted, above the conveyer line of substrate 100, in order to supply with corrosive liquid, set gradually the 1st gap nozzle 33, spray unit 34 and the 2nd gap nozzle 35 along the direct of travel of substrate 100 to the surface of substrate 100.
The 1st gap nozzle 33 is and the rectangular horizontal nozzles of the direct of travel of substrate 100, flows down by making the Al corrosive liquid membranaceously, spreads all over linearity ground, whole width ground and supply with this corrosive liquid on the part of the direct of travel on the surface of substrate 100.
The rectangular direction of the direct of travel of a plurality of injection nozzle 34a and substrate 100 is arranged, and a plurality of push pipe 34b that prolong on the direct of travel of each comfortable substrate 100 are upward installed towards the below.Each injection nozzle 34a makes the Al corrosive liquid become thin drop and cone shape ground sprays, and between adjacent nozzles, the spray regime of each nozzle can be overlapping.The quantity delivered of the corrosive liquid is here replaced and is set can carry out sufficient liquid on the surface of substrate 100.
Synchronously symmetrically rotate driving a plurality of push pipe 34bs to two directions with predetermined angular by head motion 34c, so that each injection nozzle 34a is shaken with predetermined angular symmetrically synchronously to both sides.As shown in Figure 3, head motion 34c has the tooth bar 34d with the rectangular horizontal direction of direct of travel of substrate 100.The a plurality of push pipe 34b of tooth bar 34d cross-over connection and and its top configuration, be installed on the pinion 34e engagement between each push pipe 34b.This tooth bar 34d supports movably to length direction, is back and forth driven with the regulation stroke by the crank mechanism 34f in its base end side setting.
The reciprocating motion of tooth bar 34d by crank mechanism 34f, with predetermined angular rotation symmetrically around centre synchronously, thus, each injection nozzle 34a shakes with predetermined angular to both sides around the center of push pipe 34b a plurality of push pipe 34b synchronously symmetrically to two directions.
The 2nd gap nozzle 35 and the 1st gap nozzle 33 are same, are and the rectangular horizontal nozzles of the direct of travel of substrate 100, are spaced a plurality of on the direct of travel of substrate 100 in accordance with regulations.Each gap nozzle 35 is different with the 1st gap nozzle 33, by rectangular membranaceous the flowing down of the direction of transfer that makes a spot of Al corrosive liquid and substrate 100, on the direct of travel part on substrate 100 surfaces, spread all over whole width linearity and supply with this corrosive liquid, and make its delay.That is, the quantity delivered of the corrosive liquid here remains on its lip-deep degree with the corrosive liquid that supplies to substrate 100 surfaces by surface tension and sets.
The 36th, the air nozzle of the clearance type of the rear of Ji the 2nd gap nozzle 35 configuration in the end by spread all over the whole width linearity ground air of jetting on the direct of travel part on the surface of substrate 100, is removed corrosive liquid from substrate surface.
In the oscillating shower transfer type substrate treatment device of the present embodiment that constitutes like this, the film of the Al corrosive liquid that the substrate 100 that enters into corrosion portion 30 from blocking solution portion 20 forms below the 1st gap nozzle 33 with level is passed through, supply with corrosive liquid successively from leading section in its surface.Then, pass through in the spray of the liquid that the Al that forms below spray unit 34 uses, supply with Al corrosive liquid, the corrosion of stipulating to the whole surface of substrate 100.
If the surface to substrate 100 sprays the Al corrosive liquid suddenly, the part residual treatment that then is subjected to drop at first is irregular, but, supply with corrosive liquid in its surface equably, so can prevent that to handle the processing that produces irregular along with the spray of corrosive liquid by in the film of corrosive liquid, passing in advance.
Handle by the spray that uses the Al corrosive liquid, can corrode the Al layer or the Al/Mo layer that on the surface of substrate 100, form selectively.In this spray is handled, the situation that produces a plurality of fine bubbles on the metal film of substrate 100 is arranged, but a plurality of injection nozzle 34a that constitute spray unit 34 shake symmetrically synchronously with predetermined angular to both sides around the center of push pipe 34b.Shake by this, on the surface of substrate 100, alternately form forcibly from a sidepiece to the liquid flow of the other side and from the other side to the liquid flow of a sidepiece.Its result, bubble that produces on the surface of substrate 100 and corrosive liquid are rejected to the both sides of substrate 100 together expeditiously.Therefore, it is irregular to prevent that also bubble from causing.And, can make the processing speed equalization of the Width of substrate 100, put from this, also can eliminate handle irregular.
The residual Al layer or the edge surface of Al/Mo layer become the rapid inclined plane of the lamination that is not suitable for down one deck.But corrosion portion 30 then sprays processing, supplies with the membranaceous Al corrosive liquid that flows down from the 2nd gap nozzle 35 to the surface of substrate 100, keeps the pasting state on this surface.In the meantime, gently carry out corrosion treatment, shown in 1 chain-dotted line among Fig. 4, the residual Al layer or the edge surface of Al/Mo layer become the suitable mild inclined plane of the lamination of one deck down.
The pasting handling part that constitutes by a plurality of the 2nd gap nozzles 35, such as, be that the back level part of the spray handling part that will be made of spray unit 34 is replaced as the pasting handling part.The pasting processing time is entire process time 10～45% better of corrosive liquid, and 20～40% is better.If the pasting processing time is too short, then the inclination of edge surface fully relaxes, and the long reverse effect that then becomes exists treatment effeciency to descend and the problem of the consumption that liquid is useless.Substrate 100 is moved back and forth.
Utilize possibility on the industry
As described above, oscillating shower transfer type substrate treatment device of the present invention for Substrate so that the horizontal attitude along continuous straight runs transmits consists of the injection that sprays the unit by making Nozzle shakes to both sides synchronously towards the direct of travel of substrate, can remove expeditiously with Treatment fluid is supplied with and the bubble that produces in its surface in the surface of substrate. In addition, can Unequal with the processing speed of eliminating the width that becomes problem in the large substrate. By This can prevent from processing irregular effectively.
In addition, the downstream in the spray unit arranges to the width of substrate surface whole The gap nozzle for the treatment of fluid is supplied with in individual zone membranaceously, processes by carrying out pasting, can Make the rapid rising of the edge surface of the Al layer that in the Al corrosion, becomes problem change into suitable Close the mild inclination of the lamination of lower one deck.
In addition, the upstream side in the spray unit arranges to the width of substrate surface whole The gap nozzle for the treatment of fluid is supplied with in individual zone membranaceously, before spray is processed, by making base Plate passes through in this film, can more effectively prevent from processing irregular.
Claims (4)
1. oscillating shower transfer type substrate treatment device, treatment fluid is supplied with on surface to this substrate when substrate is transmitted with the level along continuous straight runs, it is characterized in that, this device comprises: the spray unit, and this spray unit is supplied with treatment fluid from the direct of travel of substrate and with a plurality of injection nozzles that the rectangular direction of this direct of travel is arranged to the whole surface of substrate; Gap nozzle, described gap nozzle is arranged on the upstream side of described spray unit, spreads all over whole width linearity ground and supply with treatment fluid on the direct of travel part of substrate; And, in this spray unit, the head motion that each injection nozzle face is shaken synchronously towards the both sides of substrate travel is set.
2. oscillating shower transfer type substrate treatment device as claimed in claim 1 is characterized in that, described gap nozzle makes under the treatment fluid vertical current in described spray unit injection treatment fluid.
3. oscillating shower transfer type substrate treatment device as claimed in claim 1 is characterized in that, described gap nozzle forms vertical liquid film on the surface of described substrate.
4. oscillating shower transfer type substrate treatment device as claimed in claim 1 is characterized in that, described treatment fluid is the A1 corrosive liquid.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000376830 | 2000-12-12 | ||
| JP376830/2000 | 2000-12-12 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01804736 Division CN1224083C (en) | 2000-12-12 | 2001-12-07 | Oscillating shower transfer type substrate treatment device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1684235A CN1684235A (en) | 2005-10-19 |
| CN100358115C true CN100358115C (en) | 2007-12-26 |
Family
ID=18845639
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01804736 Expired - Fee Related CN1224083C (en) | 2000-12-12 | 2001-12-07 | Oscillating shower transfer type substrate treatment device |
| CNB2005100709146A Expired - Fee Related CN100358115C (en) | 2000-12-12 | 2001-12-07 | Oscillating shower transfer type substrate treatment device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01804736 Expired - Fee Related CN1224083C (en) | 2000-12-12 | 2001-12-07 | Oscillating shower transfer type substrate treatment device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2002049087A1 (en) |
| KR (1) | KR20020084122A (en) |
| CN (2) | CN1224083C (en) |
| TW (1) | TWI240946B (en) |
| WO (1) | WO2002049087A1 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4421956B2 (en) * | 2003-07-18 | 2010-02-24 | 芝浦メカトロニクス株式会社 | Substrate processing apparatus and processing method |
| JP4323252B2 (en) * | 2003-08-04 | 2009-09-02 | 住友精密工業株式会社 | Resist removal device |
| KR100652221B1 (en) * | 2004-12-15 | 2006-12-01 | 엘지.필립스 엘시디 주식회사 | Slit coater |
| JP2007117857A (en) * | 2005-10-27 | 2007-05-17 | Tokyo Ohka Kogyo Co Ltd | Apparatus for conveying/treating substrate |
| JP4976188B2 (en) * | 2007-04-16 | 2012-07-18 | 芝浦メカトロニクス株式会社 | Substrate processing equipment |
| JP5261077B2 (en) * | 2008-08-29 | 2013-08-14 | 大日本スクリーン製造株式会社 | Substrate cleaning method and substrate cleaning apparatus |
| CN101954358B (en) * | 2010-05-06 | 2012-07-04 | 东莞宏威数码机械有限公司 | Translation type substrate cleaning device |
| CN102107162A (en) * | 2010-12-01 | 2011-06-29 | 东莞宏威数码机械有限公司 | Spray device |
| JP5470282B2 (en) * | 2011-01-07 | 2014-04-16 | 株式会社ジャパンディスプレイ | Etching apparatus and etching method |
| CN102856238A (en) * | 2011-06-27 | 2013-01-02 | 均豪精密工业股份有限公司 | Surface treatment device and method |
| CN103316862B (en) * | 2013-07-12 | 2016-01-06 | 合肥京东方光电科技有限公司 | A kind of base plate cleaning device |
| JP6536830B2 (en) * | 2016-08-30 | 2019-07-03 | 株式会社Ｎｓｃ | Spray etching system |
| CN111618046B (en) * | 2020-07-03 | 2023-05-05 | 安徽理工大学 | Automatic optical cable character removing device and implementation method thereof |
| CN113225926B (en) * | 2021-03-30 | 2022-05-03 | 广东兴达鸿业电子有限公司 | PCB board production is with two etching equipment that sway |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09148297A (en) * | 1995-11-24 | 1997-06-06 | Hitachi Ltd | Method for drying substrate, drying device using the same and manufacture of semiconductor device using the same |
| JPH1079368A (en) * | 1996-09-04 | 1998-03-24 | Dainippon Screen Mfg Co Ltd | Substrate processor |
| JPH11145109A (en) * | 1997-11-07 | 1999-05-28 | Dainippon Screen Mfg Co Ltd | Substrate processing device |
| JP2000114221A (en) * | 1998-10-02 | 2000-04-21 | Dainippon Screen Mfg Co Ltd | Substrate-processing device |
-
2001
- 2001-12-07 CN CN 01804736 patent/CN1224083C/en not_active Expired - Fee Related
- 2001-12-07 KR KR1020027010304A patent/KR20020084122A/en not_active Application Discontinuation
- 2001-12-07 JP JP2002550302A patent/JPWO2002049087A1/en active Pending
- 2001-12-07 WO PCT/JP2001/010766 patent/WO2002049087A1/en active Application Filing
- 2001-12-07 CN CNB2005100709146A patent/CN100358115C/en not_active Expired - Fee Related
- 2001-12-12 TW TW90130752A patent/TWI240946B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09148297A (en) * | 1995-11-24 | 1997-06-06 | Hitachi Ltd | Method for drying substrate, drying device using the same and manufacture of semiconductor device using the same |
| JPH1079368A (en) * | 1996-09-04 | 1998-03-24 | Dainippon Screen Mfg Co Ltd | Substrate processor |
| JPH11145109A (en) * | 1997-11-07 | 1999-05-28 | Dainippon Screen Mfg Co Ltd | Substrate processing device |
| JP2000114221A (en) * | 1998-10-02 | 2000-04-21 | Dainippon Screen Mfg Co Ltd | Substrate-processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1684235A (en) | 2005-10-19 |
| KR20020084122A (en) | 2002-11-04 |
| CN1224083C (en) | 2005-10-19 |
| CN1398424A (en) | 2003-02-19 |
| TWI240946B (en) | 2005-10-01 |
| WO2002049087A1 (en) | 2002-06-20 |
| JPWO2002049087A1 (en) | 2004-04-15 |
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