CN100356259C - 薄膜晶体管液晶显示装置的制造方法 - Google Patents
薄膜晶体管液晶显示装置的制造方法 Download PDFInfo
- Publication number
- CN100356259C CN100356259C CNB200310123510XA CN200310123510A CN100356259C CN 100356259 C CN100356259 C CN 100356259C CN B200310123510X A CNB200310123510X A CN B200310123510XA CN 200310123510 A CN200310123510 A CN 200310123510A CN 100356259 C CN100356259 C CN 100356259C
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- China
- Prior art keywords
- aforementioned
- evaporation condition
- evaporation
- film transistor
- continuously
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000004973 liquid crystal related substance Substances 0.000 title abstract description 4
- 239000010408 film Substances 0.000 claims abstract description 32
- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 239000010409 thin film Substances 0.000 claims abstract description 20
- 230000008020 evaporation Effects 0.000 claims description 68
- 238000001704 evaporation Methods 0.000 claims description 68
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims 2
- 230000008021 deposition Effects 0.000 abstract 3
- 230000001681 protective effect Effects 0.000 abstract 1
- 238000009413 insulation Methods 0.000 description 10
- 238000000576 coating method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66765—Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78603—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the insulating substrate or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Liquid Crystal (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
- Formation Of Insulating Films (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030019956A KR100683149B1 (ko) | 2003-03-31 | 2003-03-31 | 액정표시소자용 어레이기판의 스트레스 제거방법 |
KR19956/2003 | 2003-03-31 | ||
KR19956/03 | 2003-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1534361A CN1534361A (zh) | 2004-10-06 |
CN100356259C true CN100356259C (zh) | 2007-12-19 |
Family
ID=32985912
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200310123510XA Expired - Lifetime CN100356259C (zh) | 2003-03-31 | 2003-12-24 | 薄膜晶体管液晶显示装置的制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6841428B2 (zh) |
JP (1) | JP4314105B2 (zh) |
KR (1) | KR100683149B1 (zh) |
CN (1) | CN100356259C (zh) |
TW (1) | TWI255045B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI249251B (en) * | 2004-11-22 | 2006-02-11 | Au Optronics Corp | Fabrication method of thin film transistor |
KR100671824B1 (ko) * | 2005-12-14 | 2007-01-19 | 진 장 | 역 스태거드 박막 트랜지스터 제조 방법 |
CN100466266C (zh) * | 2006-04-21 | 2009-03-04 | 北京京东方光电科技有限公司 | 一种tft lcd阵列基板及制造方法 |
TWI585498B (zh) | 2006-05-16 | 2017-06-01 | 半導體能源研究所股份有限公司 | 液晶顯示裝置和半導體裝置 |
JP2009099636A (ja) * | 2007-10-15 | 2009-05-07 | Hitachi Displays Ltd | 表示装置および表示装置の製造方法 |
CN102007597B (zh) * | 2008-04-17 | 2014-02-19 | 应用材料公司 | 低温薄膜晶体管工艺、装置特性和装置稳定性改进 |
TWI500159B (zh) | 2008-07-31 | 2015-09-11 | Semiconductor Energy Lab | 半導體裝置和其製造方法 |
CN104795449B (zh) * | 2015-04-16 | 2016-04-27 | 京东方科技集团股份有限公司 | 薄膜晶体管及制作方法、阵列基板、显示装置 |
CN107146792B (zh) * | 2017-05-11 | 2019-07-30 | 京东方科技集团股份有限公司 | 一种静电防护装置及其制作方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010007358A1 (en) * | 1997-10-21 | 2001-07-12 | Kabushiki Kaisha Advanced Display | Liquid crystal display and manufacturing process of thin film transistor used therein |
US20020168803A1 (en) * | 2001-05-09 | 2002-11-14 | Lg. Philips Lcd Co., Ltd. | Method for re-forming semiconductor layer in TFT-LCD |
US20020182783A1 (en) * | 2001-06-01 | 2002-12-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor film, semiconductor device and method for manufacturing same |
-
2003
- 2003-03-31 KR KR1020030019956A patent/KR100683149B1/ko active IP Right Grant
- 2003-11-25 US US10/722,275 patent/US6841428B2/en not_active Expired - Lifetime
- 2003-11-26 TW TW092133149A patent/TWI255045B/zh not_active IP Right Cessation
- 2003-12-02 JP JP2003403812A patent/JP4314105B2/ja not_active Expired - Lifetime
- 2003-12-24 CN CNB200310123510XA patent/CN100356259C/zh not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010007358A1 (en) * | 1997-10-21 | 2001-07-12 | Kabushiki Kaisha Advanced Display | Liquid crystal display and manufacturing process of thin film transistor used therein |
US20020168803A1 (en) * | 2001-05-09 | 2002-11-14 | Lg. Philips Lcd Co., Ltd. | Method for re-forming semiconductor layer in TFT-LCD |
US20020182783A1 (en) * | 2001-06-01 | 2002-12-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor film, semiconductor device and method for manufacturing same |
Also Published As
Publication number | Publication date |
---|---|
KR100683149B1 (ko) | 2007-02-15 |
JP2004304156A (ja) | 2004-10-28 |
TWI255045B (en) | 2006-05-11 |
JP4314105B2 (ja) | 2009-08-12 |
US6841428B2 (en) | 2005-01-11 |
CN1534361A (zh) | 2004-10-06 |
KR20040085313A (ko) | 2004-10-08 |
TW200421623A (en) | 2004-10-16 |
US20040191969A1 (en) | 2004-09-30 |
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Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: HYDIS TECHNOLOGIES CO., LTD. Free format text: FORMER NAME: GYONG TONG BANG DISPLAY SCIENCE + TECHNOLOGY CO. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Gyeonggi Do, South Korea Patentee after: Hydis Technologies Co.,Ltd. Address before: Gyeonggi Do, South Korea Patentee before: BOE Display Technology Co. |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20041006 Assignee: BOE TECHNOLOGY GROUP Co.,Ltd. Assignor: Hydis Technologies Co.,Ltd. Contract record no.: 2014990000768 Denomination of invention: Manufacturing method of film transistor liquid crystal display device Granted publication date: 20071219 License type: Common License Record date: 20140924 |
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LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
CX01 | Expiry of patent term |
Granted publication date: 20071219 |
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CX01 | Expiry of patent term |