CN100352046C - 发热电子元件的分体集成热管散热器 - Google Patents
发热电子元件的分体集成热管散热器 Download PDFInfo
- Publication number
- CN100352046C CN100352046C CNB2004100429263A CN200410042926A CN100352046C CN 100352046 C CN100352046 C CN 100352046C CN B2004100429263 A CNB2004100429263 A CN B2004100429263A CN 200410042926 A CN200410042926 A CN 200410042926A CN 100352046 C CN100352046 C CN 100352046C
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- CN
- China
- Prior art keywords
- heat
- electronic elements
- generating electronic
- heat pipe
- outside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims (32)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100429263A CN100352046C (zh) | 2004-05-27 | 2004-05-27 | 发热电子元件的分体集成热管散热器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100429263A CN100352046C (zh) | 2004-05-27 | 2004-05-27 | 发热电子元件的分体集成热管散热器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1705113A CN1705113A (zh) | 2005-12-07 |
CN100352046C true CN100352046C (zh) | 2007-11-28 |
Family
ID=35577493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB2004100429263A Expired - Fee Related CN100352046C (zh) | 2004-05-27 | 2004-05-27 | 发热电子元件的分体集成热管散热器 |
Country Status (1)
Country | Link |
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CN (1) | CN100352046C (zh) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011064972A1 (ja) * | 2009-11-25 | 2011-06-03 | パナソニック株式会社 | 発熱体収納箱冷却装置 |
CN101900504B (zh) * | 2010-08-19 | 2012-11-14 | 中冶南方工程技术有限公司 | 平板式环路热管 |
CN102157468B (zh) * | 2011-03-17 | 2013-01-16 | 北京芯铠电子散热技术有限责任公司 | 一种大功率环路热管散热器及其制作方法 |
WO2014132592A1 (ja) * | 2013-02-26 | 2014-09-04 | 日本電気株式会社 | 電子機器冷却システム及び電子機器冷却システムの製造方法 |
CN105716321B (zh) * | 2014-12-01 | 2019-03-05 | 青岛海尔特种电冰柜有限公司 | 半导体制冷设备 |
CN105716317B (zh) * | 2014-12-01 | 2019-03-05 | 青岛海尔特种电冰柜有限公司 | 散热装置及半导体制冷设备 |
CN105716365B (zh) * | 2014-12-01 | 2018-09-07 | 青岛海尔特种电冰柜有限公司 | 半导体酒柜 |
CN105716343B (zh) * | 2014-12-01 | 2018-08-07 | 青岛海尔特种电冰柜有限公司 | 半导体制冷设备风冷式散热控制方法 |
CN105716342B (zh) * | 2014-12-01 | 2018-08-07 | 青岛海尔特种电冰柜有限公司 | 半导体制冷设备风冷式散热控制方法 |
CN105716315B (zh) * | 2014-12-01 | 2018-09-07 | 青岛海尔特种电冰柜有限公司 | 半导体制冷设备 |
CN105716320B (zh) * | 2014-12-01 | 2019-05-28 | 青岛海尔特种电冰柜有限公司 | 半导体制冷设备 |
CN105716319B (zh) * | 2014-12-01 | 2019-03-05 | 青岛海尔特种电冰柜有限公司 | 散热装置及半导体制冷设备 |
CN104733603B (zh) * | 2015-01-29 | 2017-11-10 | 李静 | 用于半导体芯片散热的热管换热器 |
CN104851857B (zh) * | 2015-04-28 | 2017-06-27 | 西安交通大学 | 一种芯片冷却系统 |
EP3312879A1 (de) * | 2016-10-20 | 2018-04-25 | Siemens Aktiengesellschaft | Kühlvorrichtung zum kühlen von im innern eines geschlossenen gehäuses angeordneten elektrischen und/oder elektronischen betriebsmitteln |
CN106642897A (zh) * | 2016-12-26 | 2017-05-10 | 青岛海尔股份有限公司 | 具有半导体直冷间室的冰箱 |
TWI623257B (zh) * | 2017-01-04 | 2018-05-01 | 宏碁股份有限公司 | 散熱模組及其製作方法 |
CN108347858B (zh) * | 2017-01-25 | 2019-11-26 | 宏碁股份有限公司 | 散热模块及其制作方法 |
CN109737688B (zh) * | 2018-12-25 | 2020-02-11 | 华中科技大学 | 基于环形制冷片的制冷模块和管内流体快速冷却装置 |
CN109974137A (zh) * | 2019-04-19 | 2019-07-05 | 青岛海尔智能技术研发有限公司 | 一种空调室外机和空调器 |
CN113113370A (zh) * | 2021-03-31 | 2021-07-13 | 杭州芯耘光电科技有限公司 | 一种双循环散热系统及其控制方法 |
CN113079681A (zh) * | 2021-04-08 | 2021-07-06 | 山东烯泰天工节能科技有限公司 | 两相双路自循环散热装置 |
CN113138521A (zh) * | 2021-04-29 | 2021-07-20 | 深圳市火乐科技发展有限公司 | 散热组件及投影仪 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2185925Y (zh) * | 1994-01-31 | 1994-12-21 | 清华大学 | 分离热管式风冷散热器 |
JPH10238973A (ja) * | 1997-02-26 | 1998-09-11 | Akutoronikusu Kk | 薄形複合プレートヒートパイプ |
CN2494038Y (zh) * | 2001-07-13 | 2002-05-29 | 富准精密工业(深圳)有限公司 | 热管散热器组合 |
US6717246B2 (en) * | 2002-04-16 | 2004-04-06 | Intel Corporation | Semiconductor package with integrated conical vapor chamber |
-
2004
- 2004-05-27 CN CNB2004100429263A patent/CN100352046C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2185925Y (zh) * | 1994-01-31 | 1994-12-21 | 清华大学 | 分离热管式风冷散热器 |
JPH10238973A (ja) * | 1997-02-26 | 1998-09-11 | Akutoronikusu Kk | 薄形複合プレートヒートパイプ |
CN2494038Y (zh) * | 2001-07-13 | 2002-05-29 | 富准精密工业(深圳)有限公司 | 热管散热器组合 |
US6717246B2 (en) * | 2002-04-16 | 2004-04-06 | Intel Corporation | Semiconductor package with integrated conical vapor chamber |
Also Published As
Publication number | Publication date |
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CN1705113A (zh) | 2005-12-07 |
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ASS | Succession or assignment of patent right |
Owner name: DALIAN GOLDEN 3D TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: YANG HONGWU Effective date: 20100629 |
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Free format text: CORRECT: ADDRESS; FROM: 116023 NO.1-203, NO.25, HEISHIJIAOJINGBIN LANE, SHAHEKOU DISTRICT, DALIAN CITY, LIAONING PROVINCE TO: 116600 2ND FLOOR, BUILDING 2, NO.11, GUANGGU ROAD, DALIAN DEVELOPMENT AREA, DALIAN CITY, LIAONING PROVINCE |
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TR01 | Transfer of patent right |
Effective date of registration: 20100629 Address after: 2 2 storey East, building 11, 116600 Optics Valley Road, Dalian Development Zone, Liaoning, China Patentee after: Dalian Termalway Technology Co., Ltd. Address before: Shahekou District of Dalian City, Liaoning Province, 116023 Lane 25, Jing bin Heishijiao No. 1-203 Patentee before: Yang Hongwu |
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ASS | Succession or assignment of patent right |
Owner name: DALIAN TERMALWAY HEAT TRANSFER TECHNOLOGY CO., LTD Effective date: 20130419 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130419 Address after: 2 2 storey East, building 11, 116600 Optics Valley Road, Dalian Development Zone, Liaoning, China Patentee after: Dalian Termalway Technology Co., Ltd. Patentee after: Dalian Sanwei Heat Transfer Technology Co., Ltd. Address before: 2 2 storey East, building 11, 116600 Optics Valley Road, Dalian Development Zone, Liaoning, China Patentee before: Dalian Termalway Technology Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071128 Termination date: 20160527 |