CN2671129Y - 发热电子元件的热管散热器 - Google Patents
发热电子元件的热管散热器 Download PDFInfo
- Publication number
- CN2671129Y CN2671129Y CN 200420000975 CN200420000975U CN2671129Y CN 2671129 Y CN2671129 Y CN 2671129Y CN 200420000975 CN200420000975 CN 200420000975 CN 200420000975 U CN200420000975 U CN 200420000975U CN 2671129 Y CN2671129 Y CN 2671129Y
- Authority
- CN
- China
- Prior art keywords
- heat
- thin
- fluid passage
- electronic elements
- generating electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (15)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200420000975 CN2671129Y (zh) | 2004-01-09 | 2004-01-09 | 发热电子元件的热管散热器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200420000975 CN2671129Y (zh) | 2004-01-09 | 2004-01-09 | 发热电子元件的热管散热器 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2671129Y true CN2671129Y (zh) | 2005-01-12 |
Family
ID=34482086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200420000975 Expired - Lifetime CN2671129Y (zh) | 2004-01-09 | 2004-01-09 | 发热电子元件的热管散热器 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2671129Y (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006074583A1 (en) * | 2005-01-14 | 2006-07-20 | Hongwu Yang | A plate radiator of a heat pipe type |
CN100370890C (zh) * | 2005-06-27 | 2008-02-20 | 中山大学 | 一种平板式回路热管装置 |
CN101483173B (zh) * | 2008-01-10 | 2011-06-08 | 株式会社电装 | 半导体冷却结构 |
CN104488371A (zh) * | 2014-06-04 | 2015-04-01 | 华为技术有限公司 | 一种电子设备 |
CN110413084A (zh) * | 2019-08-05 | 2019-11-05 | 周坤 | 一种数据中心用方便服务器安装、拆卸的液冷装置 |
CN112146496A (zh) * | 2020-09-30 | 2020-12-29 | 河南瀚光科技有限公司 | 一种液体相变和微孔结构的散热器 |
CN113446883A (zh) * | 2021-06-25 | 2021-09-28 | 西安交通大学 | 一种基于弹性湍流的双流体回路错排波型微通道散热器 |
-
2004
- 2004-01-09 CN CN 200420000975 patent/CN2671129Y/zh not_active Expired - Lifetime
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006074583A1 (en) * | 2005-01-14 | 2006-07-20 | Hongwu Yang | A plate radiator of a heat pipe type |
CN100370890C (zh) * | 2005-06-27 | 2008-02-20 | 中山大学 | 一种平板式回路热管装置 |
CN101483173B (zh) * | 2008-01-10 | 2011-06-08 | 株式会社电装 | 半导体冷却结构 |
US10409340B2 (en) | 2014-06-04 | 2019-09-10 | Huawei Technologies Co., Ltd. | Electronic device |
WO2015184603A1 (zh) * | 2014-06-04 | 2015-12-10 | 华为技术有限公司 | 一种电子设备 |
CN107613724A (zh) * | 2014-06-04 | 2018-01-19 | 华为技术有限公司 | 一种电子设备 |
CN104488371A (zh) * | 2014-06-04 | 2015-04-01 | 华为技术有限公司 | 一种电子设备 |
CN107613724B (zh) * | 2014-06-04 | 2020-04-28 | 华为技术有限公司 | 一种电子设备 |
US11144101B2 (en) | 2014-06-04 | 2021-10-12 | Huawei Technologies Co., Ltd. | Electronic device |
US11789504B2 (en) | 2014-06-04 | 2023-10-17 | Huawei Technologies Co., Ltd. | Electronic device |
CN110413084A (zh) * | 2019-08-05 | 2019-11-05 | 周坤 | 一种数据中心用方便服务器安装、拆卸的液冷装置 |
CN112146496A (zh) * | 2020-09-30 | 2020-12-29 | 河南瀚光科技有限公司 | 一种液体相变和微孔结构的散热器 |
CN113446883A (zh) * | 2021-06-25 | 2021-09-28 | 西安交通大学 | 一种基于弹性湍流的双流体回路错排波型微通道散热器 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: DALIAN GOLDEN 3D TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: YANG HONGWU Effective date: 20100629 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 116023 NO.1-203, NO.25, HEISHIJIAOJINGBIN LANE, SHAHEKOU DISTRICT, DALIAN CITY, LIAONING PROVINCE TO: 116600 2ND FLOOR, BUILDING 2, NO.11, GUANGGU ROAD, DALIAN DEVELOPMENT AREA, DALIAN CITY, LIAONING PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20100629 Address after: 2 2 storey East, building 11, 116600 Optics Valley Road, Dalian Development Zone, Liaoning, China Patentee after: Dalian Termalway Technology Co., Ltd. Address before: Shahekou District of Dalian City, Liaoning Province, 116023 Lane 25, Jing bin Heishijiao No. 1-203 Patentee before: Yang Hongwu |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Expiration termination date: 20140109 Granted publication date: 20050112 |