CN100342037C - 带有由Ni和/或Co组成的表面镀层的冷轧带钢的热处理方法,由此法生产的薄板和由此法制造的电池槽 - Google Patents

带有由Ni和/或Co组成的表面镀层的冷轧带钢的热处理方法,由此法生产的薄板和由此法制造的电池槽 Download PDF

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CN100342037C
CN100342037C CNB028123344A CN02812334A CN100342037C CN 100342037 C CN100342037 C CN 100342037C CN B028123344 A CNB028123344 A CN B028123344A CN 02812334 A CN02812334 A CN 02812334A CN 100342037 C CN100342037 C CN 100342037C
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W·奥尔比尔丁
B·曼施伍尔
C·达赫门
K·普法伊芬布灵
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Abstract

本发明涉及一带有由Ni和/或Co以及进入的非金属元素C和/或S,在一定情况下还附加有Fe,In,Pd,Au和/或Bi的表面镀层的冷轧带钢的热处理方法,其中冷轧带钢具有低碳含量。因为当不发生再结晶时,沉积在晶界上的由C,S,N和P与表面镀层金属形成的化合物促成主要的微裂纹,则热处理温度应选在低于再结晶温度和高于沉积温度。在再结晶中晶粒大小容易达到镀层厚度尺寸,以致于脆化的化合物同晶界一起迁移出镀层。相反,通过按本发明的表面镀层的热处理温度的选择,将保证晶界的最优脆化,这在制造电池槽时特别有优点。此外还叙述了按本发明生产的薄板和相应的电池槽。

Description

带有由Ni和/或Co组成的表面镀层的冷轧带钢的热处理方法,由此法生产的薄板和由此法制造的电池槽
本发明涉及一带有由Ni和/或Co以及进入的非金属元素C和/或S,在一定情况下还附加有Fe,In,Pd,Au和/或Bi组成的表面镀层的冷轧带钢的热处理方法,其中冷轧带钢具有低碳含量。
从文献中已知,镀层的硬度可通过有目标的热处理提高。这导致硬度和脆性的增加和一般不希望的在变形中镀层破裂。相反,在制造电池槽时这一效应是希望的。
已知的镀层方法是电镀(电解)镀层和自动催化镀层,其中常用的镀层是Ni或Co镀层,或其合金镀层。最常用的是Ni镀层,据此进行以下的解释,当然,这一解释对其它相似的镀层也适用。
在电解镀层中,电流接到要镀的材料上,后者浸入含Ni离子的溶液中。镍转化为金属镍,并在材料上形成镀层。如果往处理槽里搀和进有机物质,则镀层将以另外的形态沉积,这导致更硬的镀层和镀层有发亮的外观。有机物质的分解物将一起进入镀层,分解物一般是C或S,但也可能是N和P。
自动催化Ni镀层的种类有许多名字:“自动催化的”,“无外电流的”,“化学的”镀镍,它们都描述同一个过程。在这个方法中镍不是通过“电流”转变为金属镍,而是往处理槽中加入一种材料,它提供转变必要的电子。对于这一反应一般使用一含磷的物质。这一含磷物质的分解物将一起进入镀层,而且浓度比在电解亮镍槽中C和S的浓度高得多(6-12%比0.001-0.1%)。众所周知,该含磷镀层很硬,且其硬度能通过热处理升高。不过此法的沉积速度明显慢于电镀镀镍,由此从商业观点看自动催化镀层在许多情况下是不利的。
对于电镀镀层原则上可选择所有已知的涂加镀层用的槽型。作为镀镍的例子这里仅列举瓦特槽和氨基磺酸盐槽。这些槽的改变形式也适用于镀Co或Co/Ni合金镀层。
在专业杂志金属表面49中刊登了“电解沉积的镍镀层-硫含量对硬度和延展性的影响”(Kreye等,584-587页,1995)。它是针对生产压印薄膜的镍沉积的。文章的内容是由氨基磺酸盐槽沉积的Ni层通过热处理的脆化。已确定,含硫镀层在再结晶温度以上热处理后,由于硫沉积到晶界上而脆化。推测沉积的硫在晶界迁移时被拖带着移动。从一在从邻磺酰苯酰亚胺(电解液中的含硫化合物)中沉积的镀层出现脆化起的退火温度与镀层中硫含量有关,并开始于大约250℃至350℃。此外还确定了附加进入的锰可避免镀层脆化。
文章“化学镍镀层-性能和镀层组合”(电镀技术53,34-36页,1999)叙述,通过热处理由无外电流沉积的Ni层形成Ni3P结晶,后者起到混合晶体硬化的作用。与此相反,电镀沉积的Ni层表现不同。这里为了提高硬度往槽中添加主要含硫的化合物,一般是邻磺酰苯酰亚胺,它一起进入镀层。作为这一措施的缺点是镍由于硫含量只能有一很有限的耐热性,并且在大约200℃就脆化,因为S降低电镀镍的再结晶温度。由于低硬度的再结晶镍层,在点载荷下整个镀层系统破裂。
在小册子“德国工程师协会进展,关于电镀沉积的镍镀层的微观结构和性质”(Mueller,73-76页,1987)中研究了关于从添加和不添加邻磺酰苯酰亚胺的氨基磺酸盐槽中在电流密度范围从0.5到16A/dm2电镀沉积的Ni层的行为。这一工作的目的尤其包括研究Ni镀层中的微观结晶构造缺陷。发现在含硫的Ni镀层中,在200℃以上的热处理中,在晶界上形成细微的Ni3S2沉积物。它导致在250℃上下热处理时发生材料脆化。由于微观残余应力,在室温和约200℃之间仅发生很小的微观结构的变化。然而,在温度范围从200℃到400℃的一小时退火时,镀层发生再结晶。高于400℃时镀层发生硬度降低的再结晶。在电镀镍层中含硫化合物的太高的进入速率会在热处理时由于形成硫化镍粒子而导致镍镀层的脆化。
在EP 0 725 453 A1中建议,在用于拉拔电池槽的材料上覆上一Ni/Sn合金层,以便使阴极外壳与预先镀镍的材料的接触通过形成所谓“微观-裂化”而改善。作为根据的想法是以此增大表面和提供一较大的接触面。叙述了在Ni/Sn层下借助于含硫光亮剂和一热处理镀上硬的Ni层的可能性。这在拉拔时除了Ni/Sn合金层微观-裂化外还生成另外的微观-裂化,它将进一步提高电池的功率。热处理的典型温度在400℃以上。
对现有技术背景可概括地如下评价,即所有使镍层脆化的热处理涉及再结晶,在其中发生非金属元素如C和S向晶界迁移。非金属元素使晶界脆化,特别是与表面镀层金属形成化合物(杂质)时,并且在随后的变形时,优先是在深冲和拉拔时,晶界破裂,并形成小的微裂纹。这些微裂纹,如已提到的,首先对电池有决定性的优点,因为在内表面上需要尽量小的电阻,以避免不必要的损失。
本发明是以以下任务为根据,即得到用以改进可深冲冷轧带钢的这种表面镀层脆化的方法,首先是为生产电池槽用的薄板。
为解决这个任务建议,选择的热处理温度应低于表面镀层的再结晶温度和高于沉积在晶界上的由非金属元素与表面镀层金属形成的化合物的沉积温度。
通过表面镀层热处理的有优点的选择,在热处理中温度是足够高以便镀层金属与非金属的化合物沉积,但还没有表面镀层再结晶发生,可保证表面镀层的晶界的最优脆化而不用求助于像锡这样的电池毒。到目前已知的带伴随再结晶的方法的缺点在于镀层的厚度,它一般与再结晶的表面镀层的晶粒大小有相同的数量级。因为化合物在晶界上沉积,则镀层的再结晶导致非金属组分从镀层迁移出去和脆化至少部分地抵消。另外,通过再结晶由于晶粒长大,在镀层中的晶界数量减少。如果避免热处理过程中的再结晶,则晶粒大小保持不变,并且脆表面镀层在随后的材料变形中很好地破裂。在这样破裂的表面上能很好地黏附例如后来覆上的用于减小电池内阻的含碳镀层或碱性Zn/MnO2电池的阴极外壳。这总的导致电池的能力的改进,特别是对于需要大电流的使用。
下列表1和表2借助一些实施例表明,为了得到镀层最大的裂纹形成,热处理应在多高温度下进行。热处理在稍低于再结晶温度下进行,以便保证脆化的化合物尽快沉积,而脆化的化合物不会通过再结晶而由镀层迁移出去。
由表1可知道取决于温度的Ni镀层结构。
表1:Ni镀层结构
 添加剂   #   热处理[℃]   硬度HV 0.2   镀层结构
 无   1A   -   200   柱状组织
  1B   360   177   柱状组织
  1C   390   149   再结晶开始
 TSA   2A   -   557   柱状组织
  2B   240   530   柱状组织+沉积
  2C   270   575   柱状组织+沉积
  2D   300   385   再结晶组织
  2E   380   357   再结晶组织
 邻磺酰苯酰亚胺   3A   -   484   柱状组织
  3B   250   500   柱状组织
  3C   330   262   再结晶组织
 丁炔二醇   4A   -   484(493)   柱状+条状组织
  4B   360   471(483)   柱状+条状组织
  4C   400   424   柱状+条状组织
  4D   430   251   再结晶开始
 丁炔二醇+邻磺酰苯酰亚胺   5A   -   857   层状组织
  5B   290   765   层状组织
  5C   320   773   层状组织
  5D   350   418   再结晶组织
Ni镀层结构是借助于电镀镀层的显微照片获得的。镀层是在没有或有添加剂如TSA(甲苯磺酰胺),邻磺酰苯酰亚胺和丁炔二醇的各种镀槽中镀上的。每组以A表示的试样是未经热处理的。如果比如观察5A至5C的试样系列,则可发现低于320℃的热处理的温度可得到最优的裂纹形成。借助于给出的硬度值可发现,小小的温度变化就已影响镀层的硬度差异。这样,除脆化外,通过妥协也可优化镀层的硬度。
表2表示取决于温度的Co镀层结构。试样如表1中的一样借助于显微照片评价。其结果允许很好地确定稍低于再结晶温度的最优沉积温度。对于镀层槽中的添加剂TSA和丁炔二醇,在较高温度下仍不能发现再结晶。
表2:Co镀层结构
  添加剂   #   热处理[℃]   硬度HV 0.2   镀层结构
  无   6A   289   柱状组织(粗大)
  6B   420   300   柱状组织(粗大)
  6C   490   286   柱状组织(粗大)
  6D   520   256   (50%)再结晶组织
  6F   550   274   再结晶组织
  TSA   7A   274   柱状组织(粗大)
  7B   400   270   柱状组织(粗大)
  7C   480   271   柱状组织(粗大)
  丁炔二醇   9A   352   柱状组织(很细小)
  9B   380   400   柱状组织(很细小)
  9C   410   418   柱状组织(很细小)
  丁炔二醇+邻磺酰苯酰亚胺   10A   326   柱状+层状组织
  10B   240   379   柱状+层状组织
  10C   360   350   (10%)再结晶组织
  10D   430   406   (50%)再结晶组织
  10E   460   411   再结晶组织
本发明的有优点的设计考虑冷轧带钢的碳含量在0.5%以下。本发明的另一个有优点的设计考虑由Ni和/或Co或由这些元素的多层系统的预精处理层在表面镀层前先覆到冷轧带钢上。特别有意义的是预精处理层是通过扩散退火的。然而,预精处理层借助于弥散沉积覆上也是有优点的。特别适宜的是预精处理层作为C-Ni弥散层或C-Ni/Co合金弥散层覆上。另外适宜的是在扩散退火的预精处理层后覆上一弥散镀层和接着覆上一表面镀层,其中按本发明另外有意义的是弥散层作为C-Ni弥散层或C-Ni/Co合金弥散层覆上。表面镀层下的这些不同的预精处理层有优点,特别是对于防腐蚀性和导电性。
本发明的其它有优点的特征是考虑以P代替C和S作为非金属元素加入脆化的表面镀层,或者由P,C和/或S的混合物,或者以N代替C和S作为非金属元素加入脆化的表面镀层,或者由N,C和/或S和/或P的混合物。虽然主要是C和S进入镀层中,有时其它非金属元素,特别是P和N进入表面镀层也可能是有优点的,因为它们也起脆化的作用,但对镀层的其它性能作用不同。
本发明的另一有利的特征考虑表面镀层通过热处理根据沉积的非金属组分而有目标的脆化。通过温度的适当选择和以上提到的非金属元素的为此而成比例的量的选择,可以除了造成脆化外,还附加得到希望的表面硬度。
按本发明的装置权利要求涉及一薄板或电池槽,它们伴随按本发明的方法而来,并且上述优点在它们中实现。

Claims (32)

1.带有由Ni和/或Co以及进入的非金属元素C和/或S,非必要地附加有Fe,In,Pd,Au和/或Bi组成的表面镀层的冷轧带钢的热处理方法,其中冷轧带钢具有在0.5%以下的碳含量,其特征为:选择的热处理温度低于表面镀层的再结晶温度和高于沉积在晶界上的由非金属元素与表面镀层金属形成的化合物的沉积温度。
2.按权利要求1的方法,其特征为:由Ni和/或Co组成的或由这些元素的多层体系组成的预精处理层在表面镀层前先覆到冷轧带钢上。
3.按权利要求2的方法,其特征为:预精处理层是通过扩散退火的。
4.按权利要求2的方法,其特征为:预精处理层借助于弥散沉积覆上。
5.按权利要求3的方法,其特征为:预精处理层借助于弥散沉积覆上。
6.按权利要求2的方法,其特征为:预精处理层作为C-Ni弥散层或C-Ni/Co合金弥散层覆上。
7.按权利要求3的方法,其特征为:在扩散退火的预精处理层后覆上一弥散镀层和接着覆上一表面镀层。
8.按权利要求7的方法,其特征为:弥散层作为C-Ni弥散层或C-Ni/Co合金弥散层覆上。
9.按权利要求1至8中之一的方法,其特征为:以P代替C和S作为非金属元素加入表面镀层,或者加入由P,C和/或S形成的混合物。
10.按权利要求1至8中之一的方法,其特征为:以N代替C和S作为非金属元素加入表面镀层,或者加入由N,C和/或S和/或P形成的混合物。
11.按权利要求1至8中之一的方法,其特征为:表面镀层通过热处理根据填充的非金属组分而有目标地脆化。
12.由适于深冲工艺的碳含量在0.5%以下的冷轧带钢生产的薄钢板,用一通过热处理而脆化的由Ni和/或Co以及进入的非金属元素C和/或S,非必要地附加有Fe,In,Pd,Au和/或Bi组成的表面镀层镀覆,其中表面镀层在深冲或拉拔后出现大量微裂纹,其特征为:表面镀层通过热处理不发生再结晶,非金属元素与表面镀层材料形成的化合物沉积在晶界上。
13.按权利要求12的薄钢板,其特征为:在冷轧带钢与脆化表面镀层之间有一由Ni和/或Co组成的或由这些元素的多层体系形成的预精处理层。
14.按权利要求13的薄钢板,其特征为:预精处理层是扩散退火的。
15.按权利要求13的薄钢板,其特征为:预精处理层是一弥散层。
16.按权利要求14的薄钢板,其特征为:预精处理层是一弥散层。
17.按权利要求13的薄钢板,其特征为:预精处理层是一C-Ni弥散层或C-Ni/Co合金弥散层。
18.按权利要求14的薄钢板,其特征为:在扩散退火的预精处理层与脆化表面镀层之间覆上了一弥散层。
19.按权利要求18的薄钢板,其特征为:弥散层是一C-Ni弥散层或C-Ni/Co合金弥散层。
20.按权利要求12至19中之一的薄钢板,其特征为:以P代替C和S作为非金属元素加入脆化的表面镀层,或者加入由P,C和/或S形成的混合物。
21.按权利要求12至19中之一的薄钢板,其特征为:以N代替C和S作为非金属元素加入脆化的表面镀层,或者加入由N,C和/或S和/或P形成的混合物。
22.按权利要求12至19中之一的薄钢板,其特征为:表面镀层通过热处理根据填充的非金属组分而有目标地脆化。
23.由适于深冲工艺的碳含量在0.5%以下的冷轧带钢制造的电池槽,用一位于内面上的在热处理后脆化的由Ni和/或Co以及进入的非金属元素C和/或S,非必要地附加有Fe,In,Pd,Au和/或Bi组成的表面镀层镀覆,其中表面镀层在深冲或拉拔后出现大量微裂纹,其特征为:表面镀层通过热处理不发生再结晶,非金属元素与表面镀层材料形成的化合物沉积在晶界上。
24.按权利要求23的电池槽,其特征为:在冷轧带钢与脆化表面镀层之间有一由Ni和/或Co组成的或由这些元素的多层体系形成的预精处理层。
25.按权利要求24的电池槽,其特征为:预精处理层是扩散退火的。
26.按权利要求24的电池槽,其特征为:预精处理层是一弥散层。
27.按权利要求25的电池槽,其特征为:预精处理层是一弥散层。
28.按权利要求24的电池槽,其特征为:预精处理层是一C-Ni弥散层或C-Ni/Co合金弥散层。
29.按权利要求25的电池槽,其特征为:在扩散退火的预精处理层与脆化表面镀层之间覆上了一弥散层。
30.按权利要求29的电池槽,其特征为:弥散层是一C-Ni弥散层或C-Ni/Co合金弥散层。
31.按权利要求23至30中之一的电池槽,其特征为:以P代替C和S作为非金属元素加入脆化的表面镀层,或者加入由P,C和/或S形成的混合物。
32.按权利要求22至30中之一的电池槽,其特征为:以N代替C和S作为非金属元素加入脆化的表面镀层,或者加入由N,C和/或S和/或P形成的混合物。
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