CN100338983C - 确保冷却多个电子设备子系统的冷却系统和方法 - Google Patents

确保冷却多个电子设备子系统的冷却系统和方法 Download PDF

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Publication number
CN100338983C
CN100338983C CNB2004100780531A CN200410078053A CN100338983C CN 100338983 C CN100338983 C CN 100338983C CN B2004100780531 A CNB2004100780531 A CN B2004100780531A CN 200410078053 A CN200410078053 A CN 200410078053A CN 100338983 C CN100338983 C CN 100338983C
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China
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mcu
cooling
cools liquid
liquid
electronics subsystems
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Expired - Fee Related
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CNB2004100780531A
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English (en)
Chinese (zh)
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CN1625328A (zh
Inventor
朱兆凡
M·J·小埃尔斯沃思
R·R·施密特
R·E·西蒙斯
冢本刚史
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International Business Machines Corp
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International Business Machines Corp
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  • Cooling Or The Like Of Electrical Apparatus (AREA)
CNB2004100780531A 2003-12-03 2004-09-20 确保冷却多个电子设备子系统的冷却系统和方法 Expired - Fee Related CN100338983C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/726,377 2003-12-03
US10/726,377 US7088585B2 (en) 2003-12-03 2003-12-03 Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems
JP10/726,377 2003-12-03

Publications (2)

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CN1625328A CN1625328A (zh) 2005-06-08
CN100338983C true CN100338983C (zh) 2007-09-19

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CNB2004100780531A Expired - Fee Related CN100338983C (zh) 2003-12-03 2004-09-20 确保冷却多个电子设备子系统的冷却系统和方法

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JP (1) JP2005191554A (enExample)
CN (1) CN100338983C (enExample)
TW (1) TWI289245B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6973801B1 (en) * 2004-12-09 2005-12-13 International Business Machines Corporation Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack
US7757506B2 (en) * 2007-11-19 2010-07-20 International Business Machines Corporation System and method for facilitating cooling of a liquid-cooled electronics rack
US8286442B2 (en) * 2009-11-02 2012-10-16 Exaflop Llc Data center with low power usage effectiveness
US8113010B2 (en) 2009-11-02 2012-02-14 Exaflop Llc Data center cooling
CN101976937A (zh) * 2010-10-29 2011-02-16 长春轨道客车股份有限公司 动车组牵引变流器冷却液充注工艺方法
CN110160281A (zh) * 2011-12-28 2019-08-23 维谛公司 具有l+1到N+1的泵送制冷剂冷却系统和内置冗余
US9706685B2 (en) 2011-12-28 2017-07-11 Liebert Corporation Cooling system for high density heat loads
US9494371B2 (en) 2011-12-28 2016-11-15 Liebert Corporation Pumped refrigerant cooling system with 1+1 to N+1 and built-in redundancy
WO2013134023A1 (en) 2012-03-08 2013-09-12 Google Inc. Controlling data center cooling
WO2013160293A1 (de) * 2012-04-25 2013-10-31 Basf Se Verfahren zur bereitstellung eines kühlmediums in einem sekundärkreis
TW201424916A (zh) * 2012-12-18 2014-07-01 Gin Dai Prec Technology Co Ltd 冷卻系統
CN104582416B (zh) * 2013-10-23 2017-11-24 华为技术有限公司 一种液体冷却系统及其控制方法
JP5873155B1 (ja) * 2014-10-17 2016-03-01 Necプラットフォームズ株式会社 監視システムと監視装置および監視方法
TWI783678B (zh) * 2021-04-30 2022-11-11 廣達電腦股份有限公司 冷卻電腦系統之冷卻迴路及冷卻系統
US11755084B2 (en) 2021-07-20 2023-09-12 Quanta Computer Inc. Cooling circuits for cooling a computing system and flow control methods thereof
US11937401B2 (en) * 2021-06-22 2024-03-19 Baidu Usa Llc System design and operation for liquid cooling
CN117979620A (zh) 2022-10-24 2024-05-03 台达电子工业股份有限公司 冷却系统
TWI834351B (zh) * 2022-10-24 2024-03-01 台達電子工業股份有限公司 冷卻系統

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3992894A (en) * 1975-12-22 1976-11-23 International Business Machines Corporation Inter-active dual loop cooling system
US5226471A (en) * 1991-09-23 1993-07-13 General Electric Company Leak isolating apparatus for liquid cooled electronic units in a coolant circulation system
US6182742B1 (en) * 1996-06-21 2001-02-06 Hitachi, Ltd. Cooling apparatus for use in an electronic system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3992894A (en) * 1975-12-22 1976-11-23 International Business Machines Corporation Inter-active dual loop cooling system
US5226471A (en) * 1991-09-23 1993-07-13 General Electric Company Leak isolating apparatus for liquid cooled electronic units in a coolant circulation system
US6182742B1 (en) * 1996-06-21 2001-02-06 Hitachi, Ltd. Cooling apparatus for use in an electronic system

Also Published As

Publication number Publication date
TW200528952A (en) 2005-09-01
JP2005191554A (ja) 2005-07-14
CN1625328A (zh) 2005-06-08
TWI289245B (en) 2007-11-01

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Granted publication date: 20070919

Termination date: 20110920