JP2005191554A - 電子ザブシステムを液体冷却するための冷却システムと冷却方法 - Google Patents

電子ザブシステムを液体冷却するための冷却システムと冷却方法 Download PDF

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Publication number
JP2005191554A
JP2005191554A JP2004347711A JP2004347711A JP2005191554A JP 2005191554 A JP2005191554 A JP 2005191554A JP 2004347711 A JP2004347711 A JP 2004347711A JP 2004347711 A JP2004347711 A JP 2004347711A JP 2005191554 A JP2005191554 A JP 2005191554A
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Japan
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mcu
mcus
cooling
coolant
cooled
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Pending
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JP2004347711A
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English (en)
Japanese (ja)
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JP2005191554A5 (enExample
Inventor
C Chuu Richard
リチャード・シー・チュー
Jr Michael J Ellsworth
マイケル・ジェイ・エルスワース・ジュニア
Roger R Schmidt
ロジャー・アール・シュミット
Robert E Simons
ロバート・イー・サイモンズ
Takeshi Tsukamoto
たけし 塚本
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International Business Machines Corp
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International Business Machines Corp
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Priority claimed from US10/726,377 external-priority patent/US7088585B2/en
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JP2005191554A publication Critical patent/JP2005191554A/ja
Publication of JP2005191554A5 publication Critical patent/JP2005191554A5/ja
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2004347711A 2003-12-03 2004-11-30 電子ザブシステムを液体冷却するための冷却システムと冷却方法 Pending JP2005191554A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/726,377 US7088585B2 (en) 2003-12-03 2003-12-03 Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems

Publications (2)

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JP2005191554A true JP2005191554A (ja) 2005-07-14
JP2005191554A5 JP2005191554A5 (enExample) 2007-04-12

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JP2004347711A Pending JP2005191554A (ja) 2003-12-03 2004-11-30 電子ザブシステムを液体冷却するための冷却システムと冷却方法

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JP (1) JP2005191554A (enExample)
CN (1) CN100338983C (enExample)
TW (1) TWI289245B (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008523599A (ja) * 2004-12-09 2008-07-03 インターナショナル・ビジネス・マシーンズ・コーポレーション 冷却システム及び方法
JP2009130358A (ja) * 2007-11-19 2009-06-11 Internatl Business Mach Corp <Ibm> 液冷式電子機器ラックの冷却を促進する装置及び方法、並びにこれらを含むデータ・センタ
WO2011053992A3 (en) * 2009-11-02 2011-09-15 Exaflop Llc Data center with low power usage effectiveness
US8590333B2 (en) 2009-11-02 2013-11-26 Exaflop Llc Data center cooling
JP2015514957A (ja) * 2012-04-25 2015-05-21 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 二次回路内の冷媒の供給方法
US9091496B2 (en) 2012-03-08 2015-07-28 Google Inc. Controlling data center cooling
JP5873155B1 (ja) * 2014-10-17 2016-03-01 Ｎｅｃプラットフォームズ株式会社 監視システムと監視装置および監視方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101976937A (zh) * 2010-10-29 2011-02-16 长春轨道客车股份有限公司 动车组牵引变流器冷却液充注工艺方法
CN110160281A (zh) * 2011-12-28 2019-08-23 维谛公司 具有l+1到N+1的泵送制冷剂冷却系统和内置冗余
US9706685B2 (en) 2011-12-28 2017-07-11 Liebert Corporation Cooling system for high density heat loads
US9494371B2 (en) 2011-12-28 2016-11-15 Liebert Corporation Pumped refrigerant cooling system with 1+1 to N+1 and built-in redundancy
TW201424916A (zh) * 2012-12-18 2014-07-01 Gin Dai Prec Technology Co Ltd 冷卻系統
CN104582416B (zh) * 2013-10-23 2017-11-24 华为技术有限公司 一种液体冷却系统及其控制方法
TWI783678B (zh) * 2021-04-30 2022-11-11 廣達電腦股份有限公司 冷卻電腦系統之冷卻迴路及冷卻系統
US11755084B2 (en) 2021-07-20 2023-09-12 Quanta Computer Inc. Cooling circuits for cooling a computing system and flow control methods thereof
US11937401B2 (en) * 2021-06-22 2024-03-19 Baidu Usa Llc System design and operation for liquid cooling
CN117979620A (zh) 2022-10-24 2024-05-03 台达电子工业股份有限公司 冷却系统
TWI834351B (zh) * 2022-10-24 2024-03-01 台達電子工業股份有限公司 冷卻系統

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3992894A (en) * 1975-12-22 1976-11-23 International Business Machines Corporation Inter-active dual loop cooling system
US5226471A (en) * 1991-09-23 1993-07-13 General Electric Company Leak isolating apparatus for liquid cooled electronic units in a coolant circulation system
JP3329663B2 (ja) * 1996-06-21 2002-09-30 株式会社日立製作所 電子装置用冷却装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008523599A (ja) * 2004-12-09 2008-07-03 インターナショナル・ビジネス・マシーンズ・コーポレーション 冷却システム及び方法
JP2009130358A (ja) * 2007-11-19 2009-06-11 Internatl Business Mach Corp <Ibm> 液冷式電子機器ラックの冷却を促進する装置及び方法、並びにこれらを含むデータ・センタ
WO2011053992A3 (en) * 2009-11-02 2011-09-15 Exaflop Llc Data center with low power usage effectiveness
US8286442B2 (en) 2009-11-02 2012-10-16 Exaflop Llc Data center with low power usage effectiveness
CN102762927A (zh) * 2009-11-02 2012-10-31 埃克弗洛普公司 具有低功率使用有效性的数据中心
US8590333B2 (en) 2009-11-02 2013-11-26 Exaflop Llc Data center cooling
US8635881B2 (en) 2009-11-02 2014-01-28 Exaflop Llc Data center with low power usage effectiveness
CN102762927B (zh) * 2009-11-02 2016-04-06 谷歌公司 具有低功率使用有效性的数据中心
US9091496B2 (en) 2012-03-08 2015-07-28 Google Inc. Controlling data center cooling
JP2015514957A (ja) * 2012-04-25 2015-05-21 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 二次回路内の冷媒の供給方法
JP5873155B1 (ja) * 2014-10-17 2016-03-01 Ｎｅｃプラットフォームズ株式会社 監視システムと監視装置および監視方法

Also Published As

Publication number Publication date
CN100338983C (zh) 2007-09-19
TW200528952A (en) 2005-09-01
CN1625328A (zh) 2005-06-08
TWI289245B (en) 2007-11-01

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