200528952 九、發明說明： 【發明所屬之技術領域】 本發明大體上係關於用於自電子器件、模組及系統移除 熱之冷卻總成及其它裝置。更特定言之，本發明係關於利 用至少二模組冷卻單元（MCU)，以液體冷卻諸如電子架之 電子次系統之冷卻系統及方法。 【先前技術】 由諸如微處理器及電源之電子設備所耗散之熱流通量再 次達到了需要不同於簡單的空氣冷卻之冷卻作為控制組件 溫度之方法之程度。液體冷卻（例如，水冷卻）為管理此等較 高熱流通量之有吸引力之技術。液體以有效方式吸收由組 件/模組所耗散之熱，意即，以自液體至被冷卻之組件具有 最小溫度上升之方式。通常，熱最終自液體轉移出至外部 環境中。否則，液體冷卻劑溫度會持續上升。 自20世紀70年代至20世紀90年代早期，International Business Machines Corporation (國際商業機器公司）藉由經 由冷卻劑分配單元循環冷卻液體來完成此工作，該冷卻劑 分配單元為單一的大型電腦室水調節單元（CRWCU)。 CRWCU將經調節之冷卻水分酉己至待冷卻之主機電腦系統 之各種電子架。通常，主機電腦之電子架包括記憶體框架、 處理器框架、輸入/輸出框架、電源框架（power frame)等。 在運行上，CRWCU接收用戶冷卻水，然後將其用於自經調 節之冷卻水將熱移除至電腦室之個別電子架。 CRWCU包括一主要冷卻迴路，其中供應建築冷卻水且使 97400.doc 200528952 =過一由馬達所驅動之控制間門。該閥門判定將經過埶 :換器之建築冷卻水之量，纟中該建築冷卻水之一部分； 此經由—^路孔被直接回收至回收處。CRWCU進-步包括 具有儲集相之第二冷卻迴路，自該儲制藉由兩個果中 之任個將水抽沒至熱交換器中以用於調節且作為經調節 之水源自其中輸出至在電腦室内待冷卻之電子架。電腦室 水調節單元通常與電子框架保持分離，且將再次將系統水 (通常保持在約饥）供應至電腦室之所有電子框竿。 冷卻劑分配單元，且更特定言之，電腦室水調節單元 (C_)含有單一熱交換器、單一儲集器、單一控制閥門 及冗餘栗。因此，在出現失效果之情況下，CRWCU將自動 ㈣至冗餘I，但冷卻劑分配單元中之任何其它故障將破 裹t個電細至主機系統。舉例而t，若熱交換器或控制闊 門或建築冷卻水源失效’則電腦室中之整個主機系統亦將 失效。將冗餘主機電腦放在電腦室地面上’以允許繼續處 理（在降級模式中），直至可修復出現故障之主機。 【發明内容】 現今，諸如，存在於20世紀70年代及20世紀8〇年代之多 框架主機系統已被單一處理器框架或架置換。因此，自高 端、中等範圍及低端之多個處理器框架現在可來源於單一 電腦室水調節單元。然而，其中存在問題。單一熱交換器 失效或控制閥門失效或冷卻水源損耗，可破壞整個電腦室 地面0 藉由提供具有至少二模組冷卻單元（MCU)之冷卻系統， 97400.doc 200528952 克服了此等缺點並提供了額外優點，其中每4CU能夠將 系統冷卻劑提供至待冷卻之多個電子次系統。每一動包 各 熱乂換為、一具有至少一控制閥門之第一冷卻迴路 及一第二冷卻迴路。當MCU運行日夺，第一冷卻迴路自一來 源純冷卻之設施冷卻劑，且使其至少_部分通過該熱交 換器”中口亥邛刀由至少一控制閥門控制。第二冷卻迴路 料卻之系統冷卻劑提供至多個電子m且在熱交換 口口中將來自夕個電子次系、统之熱排出至第一冷卻迴路中 之~卻之认施冷卻劑。該至少一控制閥門允許調節流過熱 交換器之冷卻之設施冷卻齊卜藉此允許控制第5冷卻迴路 中之系統冷卻劑之所需溫度，以冷卻多個電子次系統。 在另一態樣中，提供一冷卻之電子系統。該冷卻之電子 系統包括：多個電子次系統及至少二模組冷卻單元 (MCU)。每一 Mcu能夠將系統冷卻劑提供至待冷卻之多個 電子次系統。每一 MCU包括··一熱交換器、一具有至少— 控制閥門之第一冷卻迴路及一第二冷卻迴路。當該Mcu運 行打，第一冷卻迴路自一來源接收冷卻之設施冷卻劑，且 使其至少一部分通過熱交換器，其中該部分由至少一控制 閥門控制。第二冷卻迴路將冷卻之系統冷卻劑提供至多個 電子次系統，且在熱交換器中，將來自多個電子次系统之 熱排出至第一冷卻迴路中之冷卻之設施冷卻劑。該至少— 控制閥門允許調節流過熱交換器之冷卻之設施冷卻劑，且 因此允許控制第二冷卻迴路中之系統冷卻劑之溫度， ^ Μ令 卻多個電子次系統。 97400.doc 200528952 在另一態樣中，提供一用於冷卻多個電子次系統之方 法。該方法包括提供至少二模組冷卻單元（Mcu)，其中每 一 MCU能夠將系統冷卻劑提供至待冷卻之多個電子次系 統。另外，每一MCU包含-熱交換器、一具有至少一控制 閥Η之帛一冷卻迴路及一具有系、统冷卻齊】之第二冷卻迴 路。對於該等至少二MCU之一選定MCU，該方法進一步包 括：自一來源將冷卻之設施冷卻劑提供至第一冷卻迴路且 經由至少一控制閥門使其至少一部分經過熱交換器；自第 二冷卻迴路將冷卻之系統冷卻劑提供至多個電子次系統； 及在熱父換器中將來自多個電子次系統之熱排出至第一冷 部迴路中之冷卻之設施冷卻劑，其中選定Mcu之至少一控 制閥門允許調節流過熱交換器之設施冷卻劑，藉此允許控 制第二冷卻迴路中之系統冷卻劑之溫度以冷卻多個電子次 系統。 藉由本發明之技術實現了額外特點及優點。本文詳細描 述了本發明之其它實施例及態I，且將其認為是所主張之 本發明之一部分。 【實施方式】 如本文所用之，，電子次系統”包含任何外殼、框架、架、 隔室等，其含有需要冷卻之電腦系統或其它電子系統之一 或多個熱產生組件。術語"電子架"包括任何具有電腦系統 或電子系統之熱產生組件之框架或架；且可為（例如）具有高 糕、中端或低端處理能力之單機電腦處理器。在一實施例 中’電子架可包括多個電子抽屜，每一電子抽展均具有需 97400.doc 200528952 要冷卻之一或多個熱產生組件。 本文所述之在冷卻劑分配單元内或更特 ' a <在挺組冷 卻單元（MCU)内之冷卻劑之一實例為水。 ^ ^然而，可容易將 所揭示之概念調適成與在設施方面及扃备^ 久隹糸統方面之冷卻劑 之其它類型-起使用。I例而t ’冷卻劑可包含鹽水、碳 氟化合物液體或其它類似之化學冷卻劑式 ▽ |⑷A致冷劑，而其仍 保持本發明之優點及獨特特點。200528952 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates generally to cooling assemblies and other devices for removing heat from electronic devices, modules and systems. More specifically, the present invention relates to a cooling system and method for cooling electronic secondary systems such as electronic racks with liquids using at least two modular cooling units (MCUs). [Previous Technology] The amount of heat flow dissipated by electronic equipment such as microprocessors and power supplies once again reaches a level that requires cooling other than simple air cooling as a method of controlling the temperature of components. Liquid cooling (for example, water cooling) is an attractive technique for managing these higher heat fluxes. The liquid efficiently absorbs the heat dissipated by the component / module, which means that there is a minimum temperature rise from the liquid to the cooled component. Usually, heat is eventually transferred from the liquid to the external environment. Otherwise, the liquid coolant temperature will continue to rise. From the 1970s to the early 1990s, International Business Machines Corporation did this by circulating cooling liquid through a coolant distribution unit, which is a single large computer room water regulator Unit (CRWCU). CRWCU transfers the adjusted cooling water to various electronic racks of the host computer system to be cooled. Generally, the electronic frame of the host computer includes a memory frame, a processor frame, an input / output frame, a power frame, and the like. In operation, CRWCU receives user cooling water and then uses it to remove heat from the adjusted cooling water to individual electronic racks in the computer room. CRWCU includes a main cooling circuit in which building cooling water is supplied and 97400.doc 200528952 = passes through a control door driven by a motor. The valve judges that it will pass through 埶: the amount of cooling water in the building, part of the cooling water in the building; this is directly recycled to the recycling place through the 路 way hole. The CRWCU further includes a second cooling circuit with a reservoir phase from which water is pumped into the heat exchanger by either of the two fruits for conditioning and is sourced there as conditioned water Output to an electronic rack to be cooled in the computer room. Computer room The water conditioning unit is usually kept separate from the electronic frame and will again supply system water (usually kept at about hunger) to all electronic frame rods in the computer room. The coolant distribution unit, and more specifically, the computer room water conditioning unit (C_) contains a single heat exchanger, a single reservoir, a single control valve, and a redundant pump. Therefore, in the event of a failure, the CRWCU will automatically go to redundant I, but any other failure in the coolant distribution unit will break t electrical details to the host system. For example, t, if the heat exchanger or control door or building cooling water source fails', the entire host system in the computer room will also fail. Place the redundant host computer on the floor of the computer room 'to allow continued processing (in degraded mode) until the failed host can be repaired. [Summary of the Invention] Today, for example, many frame host systems existing in the 1970s and 1980s have been replaced by single processor frames or shelves. Therefore, multiple processor frames from high-end, mid-range and low-end can now be derived from a single computer room water conditioning unit. However, there are problems. Failure of a single heat exchanger or control valve failure or loss of cooling water source can damage the entire computer room floor. By providing a cooling system with at least two module cooling units (MCU), 97400.doc 200528952 overcomes these shortcomings and provides An additional advantage, where each 4CU can provide system coolant to multiple electronic sub-systems to be cooled. Each thermal package is replaced by a first cooling circuit having at least one control valve and a second cooling circuit. When the MCU runs day by day, the first cooling circuit is purely cooled by a source of facility coolant, and at least _ passes through the heat exchanger. ”Zhongkouhaiji knife is controlled by at least one control valve. The second cooling circuit is The system coolant is provided to a plurality of electrons and the heat from the electronic subsystem and the system is discharged to the first cooling circuit in the heat exchange port. The at least one control valve allows the flow to be adjusted. The cooling facility cooling system through the heat exchanger thereby allows controlling the required temperature of the system coolant in the fifth cooling circuit to cool multiple electronic sub-systems. In another aspect, a cooled electronic system is provided. The cooled electronic system includes: multiple electronic sub-systems and at least two module cooling units (MCU). Each MCU can provide system coolant to multiple electronic sub-systems to be cooled. Each MCU includes a heat An exchanger, a first cooling circuit with at least a control valve, and a second cooling circuit. When the MCU is operating, the first cooling circuit receives cooling facility coolant from a source and makes it A small part passes through the heat exchanger, wherein this part is controlled by at least one control valve. The second cooling circuit provides the cooled system coolant to the plurality of electronic sub-systems, and in the heat exchanger, the heat from the plurality of electronic sub-systems is supplied. Cooled facility coolant discharged into the first cooling circuit. The at least-control valve allows regulation of the cooled facility coolant flowing through the heat exchanger, and therefore allows control of the temperature of the system coolant in the second cooling circuit, ^ Μ Order multiple electronic secondary systems. 97400.doc 200528952 In another aspect, a method for cooling multiple electronic secondary systems is provided. The method includes providing at least two modular cooling units (Mcu), each MCU The system coolant can be provided to a plurality of electronic sub-systems to be cooled. In addition, each MCU includes a heat exchanger, a cooling circuit with at least one control valve, and a cooling system with a system. Two cooling circuits. For one of the at least two MCUs selected, the method further includes: providing the cooled facility coolant from a source to the first cooling And at least a part of it passes through a heat exchanger via at least one control valve; the cooled system coolant is provided from the second cooling circuit to a plurality of electronic sub-systems; and the heat from the plurality of electronic sub-systems is provided in the heat parent switch Cooled facility coolant discharged into the first cold circuit, wherein at least one control valve of the selected MCU allows the facility coolant flowing through the heat exchanger to be regulated, thereby allowing the temperature of the system coolant in the second cooling circuit to be controlled to Cooling multiple electronic sub-systems. Additional features and advantages are achieved by the technology of the present invention. This document describes other embodiments and state I of the present invention in detail, and considers them as part of the claimed invention. [Embodiment] As used herein, an "electronic secondary system" includes any enclosure, frame, rack, compartment, etc. that contains one or more heat generating components of a computer system or other electronic system that requires cooling. The term " electronic rack " includes any frame or rack with a computer system or heat generating component of an electronic system; and may be, for example, a stand-alone computer processor with high, mid-range, or low-end processing capabilities. In one embodiment, the 'electronic rack may include multiple electronic drawers, each of which has one or more heat generating components that need to be cooled to 97400.doc 200528952. One example of a coolant described herein in a coolant distribution unit or more specifically a < in a cooling unit (MCU) is water. ^ ^ However, it is easy to adapt the disclosed concepts to other types of coolants in facilities and equipment. For example, t 'coolant may include brine, fluorocarbon liquid or other similar chemical coolant formula ▽ | ⑷A refrigerant, which still maintains the advantages and unique features of the present invention.
-水冷部/調節單元’其向/自待冷卻之電子器件循環高品質 水且自資料中心水排出熱。如本文所用之"設施水，，或"設施 冷卻劑’’係指此資料中心水或冷卻劑，而，，系統水"或"系統冷 卻劑"分別係指冷卻/調節水或冷卻劑，其在冷卻劑分配： 元與被冷卻之電子次系統之間循環。 如上文簡要說明，電腦設備(主要為處理器)中之功率位 準已再次上升至其可不再被簡單地空氣冷卻之位準。該等 組件將很可能被水冷卻。可將由處理器所耗散之轨經由水 冷卻之冷板轉移至水。通常在用戶位置（意即，資料中心） 處可用之水不適合於在此等冷板中使用。第一，縮合形成 是關心的問題，因為資料中心水之自7。〇至15。〇範圍:溫度 遠低於室露點（通常為18-23。〇。第二，水之相對差之 (其化學性質、清潔度等）影響系統可靠性。因此，需要=-Water-cooling section / regulating unit 'which circulates high-quality water to / from the electronics to be cooled and discharges heat from the data center water. As used herein, " facility water, or " facility coolant " refers to this data center water or coolant, and system water " or " system coolant " refers to cooling / conditioning water, respectively. Or coolant, which circulates between the coolant distribution unit and the cooled electronic subsystem. As explained briefly above, the power levels in computer equipment (mainly processors) have once again risen to a level where they can no longer simply be air-cooled. Such components will likely be cooled by water. The rails dissipated by the processor can be transferred to water via a water-cooled cold plate. Water that is usually available at user locations (ie, data centers) is not suitable for use in such cold plates. First, the formation of condensation is a matter of concern, because the data center is water-free. 〇 to 15. 〇Range: The temperature is much lower than the dew point of the room (usually 18-23. 〇 Second, the relative difference of water (its chemical properties, cleanliness, etc.) affects system reliability. Therefore, it is necessary to =
現在參看圖式，其中貫穿不同圖中所使用之相同參考數 字表示相同或類似之組件。圖i描繪一用於電腦室之習知冷 部知丨刀配單兀之-實施例。冷卻單元111相對大且佔據比現 在§忍為是兩個全部電子框架更多之位Ϊ。在冷卻單元内的 97400.doc -10- 200528952 係功率/控制元件112、儲集器/膨脹箱113、熱交換器114、 泵115 (經常伴隨有一冗餘第二泵）、用戶水（或場所或設施 用水或冷卻劑）入口 116及出口 117供水管、經由接頭12〇與 管線122將水引導至電子框架13〇之供應歧管118、及自電子 框架130經由管線123與接頭121引導水之回收歧管丨19。 圖2說明根據本發明之一態樣之可升級之冷卻劑調節單 7L(SCCU)2n。在單元211内的將係功率調節器及控制器（未 圖示）。如上文倂入之標題為，，Scalable c〇〇lant c〇nditi〇ningReference is now made to the drawings in which the same reference numerals are used throughout the different drawings to designate the same or similar components. FIG. I depicts an example of a conventional cooling unit for a computer room. The cooling unit 111 is relatively large and occupies more space than what is currently considered to be two full electronic frames. 97400.doc -10- 200528952 in the cooling unit is the power / control element 112, the reservoir / expansion tank 113, the heat exchanger 114, the pump 115 (often accompanied by a redundant second pump), the user water (or place) Or facility water or coolant) inlet 116 and outlet 117 water supply pipes, supply manifold 118 that directs water to the electronic frame 13 via the joints 120 and 122, and directs water from the electronic frame 130 via the lines 123 and joints 121 Recovery Manifold 丨 19. Fig. 2 illustrates a scalable coolant adjustment unit 7L (SCCU) 2n according to one aspect of the present invention. The unit 211 will be a power conditioner and controller (not shown). As mentioned above, the title is, Scalable c〇〇lant c〇nditi〇ning
Unit with Integral Plate Heat Exchanger/Expansion Tank and Method ofUse”之美國專利申請案中之詳細描述，自該等電 子架回收之系統冷卻劑被收集在回收歧管119中，並被引導 通過一體式熱交換器/膨脹箱223之膨脹箱區。自膨脹箱 223,將系統冷卻劑引導至將冷卻劑供應至多個模組泵浦單 元(MPU)227之另一歧管224。將刪之較高壓力排出，收 集在歧管225中，並引導至—體式熱交換器/膨脹箱223内之 熱交換器之”熱側”。卿經由一包含自動連接組件（未圖示） =入式便利機械裝置連接至歧管，該等自動連接組件經 广軟官連接至-包含複數個力管操作之隔離閥門之隔 == 機械^㈣…㈣—作隔離 P離間nLl手動％作之快速斷開，來置換自動連接組件。 :::歧管224及225，以用於在安裝 間，使ΜΡϋ與歧管分離。 冷二 =::_(116、117)之’’冷〜施冷卻水 將系、，先冷卻劑送至將冷卻劑分配至需要冷卻之 97400.doc 200528952 —或多個電子架之供應歧管118。儘管此處未圖示，作是 s咖亦可併人詩過濾系統水，且根據需要，自動添加諸 如本幷三唑(BTA)之腐蝕抑制劑之構件。使用雙向控制閥門 咖7調節設施冷卻水流至—體式熱交換器/膨脹箱223内 之熱交換器之流動速率，藉此控制被傳遞至電子架之系統 冷卻劑之溫度。熱敏電阻溫度感測元件（未圖示）可位於系统 冷卻劑供應歧管118之人口處，以將電子訊號供應至控制閥 門228之運行的功率/控制器。若系統冷卻劑溫度高於所需 溫f，則可將閥門228打開得更纟，以允許增加設施水通過 熱父換器之流量，導致自供應歧管丨丨8被引導至電子架之系 、、先水之溫度降低。或者，若系統水溫度低於所需溫度，則 可將閥門228關閉得更小以使設施水穿過熱交換器之流量 降低，導致自供應歧管118被引導至電子架之系統水之溫度 立曰加。自圖2中注意到，冷卻劑分配單元之功能藉由根據需 要，視電腦室電子次系統之冷卻需求而定將模組泵浦單元 添加至SCCU係可升級的。 現今，為連續運行而設計並建置電腦系統。此可藉由可 同時保持且可被置換而不影響系統運行之冗餘組件之組合 而完成。實例包括多個風扇/吹風機或多個電源模組。圖1 之最初冷卻劑分配單元或圖2之增強可升級之冷卻劑調節 單元均不具有冗餘或同時保持能力之必要程度來提供可用 之所需系統。因此，本文所提供的係一利用至少二模組冷 卻單元（MCU)之冷卻系統及方法，每一 MCU匹配或超過待 冷卻之電腦室電子次系統之冷卻需求。另外，每一 MCU藉 97400.doc -12- 200528952 由模組冗餘結合同時保持能力之組合而匹配或超過電子次 系統本身之可用性。 圖3描繪根據本發明之一態樣之冷卻系統或冷卻劑分配 單元300之一部分實施例。在此實例中，單元3〇〇包括至少 二模組冷卻單元（MCU)310a、310b。每一冷卻單元310a、 3 1 Ob能夠將系統冷卻劑提供至待冷卻之多個電子次系統或 電子架。入口管線312將來自一來源之設施供水連接至冷卻 系統中。穿過雙向手動球閥門314a、314b將設施水引導至 MCU，該等閥門通常是打開的，除非為了修復而置換或移 除一 MCU。必要時亦可將套管接頭315a及315b定位於設施 冷卻劑供應入口上以促進MCU之移除。用電運行之雙向比 例閥門3 16a、3 16b判定設施冷卻劑是否在對系統控制器之 控制下流過]\10：1；31(^或]\4(：113101}。 提供旁路3 1 8a、3 1 8b以分流此實施例之一體式膨脹箱/熱 父換器周圍之設施冷卻劑之一部分。穿過旁路3 18a、3 1 8b 之設施冷卻劑之量由控制器使用用電運行之雙向比例閥門 320a、320b控制。進入膨脹箱322a、322b之設施冷卻劑繼 續穿過熱交換器（Hx)324a、324b内之第一冷卻迴路325a、 325b。在退出第一冷卻迴路之後，設施水在回收至設施水 之來源之前經過另一套管接頭321a、32 lb及雙向手動球閥 門 323a 、 323b 。 在系統水方面，系統水自多個電子次系統回收並經過球 閥門330a、330b及套管接頭332a、332b，在該處將其添加 至膨脹箱322a、322b中之系統冷卻劑。然後，將來自該箱 97400.doc -13- 200528952 之系統冷卻劑抽汲經過套管接頭340a、340b及藉由果 342a、342b來對其加壓，該泵使經加壓之系統冷卻劑經過 止回閥門343a、343b及套管接頭344a、344b而回收至熱交 換器324a、324b之第二冷卻迴路327a、327b。自第二冷卻 迴路，將冷卻之系統水經由（例如）套管接頭35〇a、35〇b及球 閥門352a、352b轉遞至適當之電子架歧管。若須要，則可 將溫度感測器"TS’’提供於設施水入口供應管線與系統水出 口供應管線上，且可將壓力感測器”PS”安置於上系統水出 口供應管線上以監視冷卻系統内之運行條件。 MCU31〇a、310b之儲集器或膨脹箱322a、322b藉由球閥 門360而流體連通，該球閥門36〇在其兩側又具有套管接頭 3 62、363。閥門360及接頭362、363允許移除或置換一模組 冷卻單元。 有利地，在諸如圖3中所描繪之每一冷卻系統中存在最低 限度之二模組冷卻單元。此等冷卻單元藉由上文所論述之 球閥門及接頭而連接在一起，使得可在特定時間運行任一 MCU。如所說明，組態5 — MCU以提供用於待冷卻之一或 多個電子次系統之整個冷卻系統能力。儘管展示為圖2之一 體式熱交換器/膨脹箱’但是可用分離之膨脹箱及熱交換器 士組態每-模組冷卻單元。另外，每一熱交換器可為各種 實把例之’其包括板式熱交換器或殼管式熱交換器。Μ。。 藉由歧^裝置連接在—起，使得可在特定時間運行任一 MCU。藉由冷卻系統之功率及控制器次系統，可微碼控制 該等MCU之間的切換及其運行。套管接頭存在於每—μ⑶ 97400.doc •14- 200528952 内/外之管道連接處，使得必要時可移除及置換MCU。手動 隔離閥門與每一套管接頭相關聯，使得可將運行之]^(31；自 閒置之MCU隔離或分離。為每_MCU内之泵提供額外套管 接頭，使得可置換該泵而不必移除整個Mcu。圖3之設計之 另一特點係連接兩個儲集器之管道。在正常運行條件期 間，不能確保系統水將流進一膨脹箱或另一膨脹箱中。因 此藉由如圖3中所示將此等膨脹箱連接在一起而避免了出 現問題。 圖4描繪一替代冷卻系統或冷卻劑分配單元實施例4〇〇之 一部分實施例，其再次利用至少二模組冷卻單元41〇a、 41〇b。在此替代實施例中，將用戶水路徑分離及隔離，使 得分別經由第一輸入管線412a與第二輸入管線412b而接收 設施水，並經由第一回收管線及第二回收管線來回收該設 施水。若兩設施水饋入確實冗餘且相互獨立，則可實現更 多之可用性。以此方式確保將存在可用之設施供水來冷卻 運行之電子次系統。 在運行中，設施供應水流過雙向手動球閥門414a、414b， 其再次通常係打開的。經由套管接頭415a、415b將設施水 提供至用電運行之三程比例閥門416a、416b。閥門416a、 416b判定在膨脹箱422a、422b與一體式熱交換器424a、42仆 周圍待分流之設施水之量。流過旁路之設施水由用電運行 之關閉閥門420a、420b控制。（舉例而言，閥門420a、42Ob 了關閉非運行MCU中之旁路流動以防止設施水流過該非運 行MCU)。如上文所解釋，藉由控制流過第一冷卻迴路 97400.doc 15 200528952 425a、425b之冷卻之設施水的量，可控制第二冷卻迴路 427a、427;b中之系統冷卻劑之溫度。此可藉由控制經過個 別旁路之設施水的量而達成。在經過熱交換器之後，穿過 套管接頭42丨a、421b及球閥門423a、芯讣輸出設施水以回 收至個別獨立來源。 在系統水方面，將回收之系統水收集在回收歧管中並經 由雙向球閥門43〇a與430b及相關聯之套管接頭432a、432b 轉遞至調節單元410a、410b中之一運行調節單元。回收之 系統水流進膨脹箱422a、422b中。同時，經由泵442a、442b 將水自該箱抽出穿過相關聯之套管接頭44〇a、44沘。藉由 泵442a、442b對系統水加壓，使其經過止回閥門443&、44孙 及相關聯之套管接頭444a、444b，並將其輸入至第二冷卻 迴路427a、427b，其中系統水在熱交換器42乜、42仆内冷 卻自熱父換杰輸出之冷卻之系統冷卻劑經過相關聯之套 管接頭450a、450b及球閥門452a、452b，在該處將其提供 至待冷卻之一或多個電子次系統。同樣，圖4中展示了在系 統供水管線上之溫度感測器，，TS”及壓力感測器"ps"，其可 用於監視冷卻系統之運行。膨脹箱經由一具有相關聯之套 管接頭462、463之球閥門460亦再次連通。 儘管本文已詳細描繪及描述了較佳實施例，但是熟習此 項技術者將顯而易見，可在不脫離本發明之精神的情況下 進行各種修改、添加、替代及其類似動作，且因此將其考 慮在如由以下申請專利範圍中所界定之本發明之範疇内。 【圖式簡單說明】 97400.doc -16- 200528952 圖1描繪一用於電腦室 圖2為可根據本發明之 調節單元之示意圖； 匕白知冷卻劑分配單元； 一悲、樣而利用之可升級之冷卻劑 一模組冷卻單元之冷 圖3描緣根據本發明之一態樣利用 卻糸統之一部分實施例；及 二模組冷卻單元 圖4描緣根據本發明之一態樣利用至少 之冷卻系統之一替代的部分實施例。 【主要元件符號說明】 111 冷卻單元 112 功率/控制元件 113 儲集器/膨脹箱 114、324a、324b 熱交換器 115、342a、342b、 泵 442a、442b 116 入口 117 出口 118 供應歧管 119 回收歧管 120 、 121 接頭 122 、 123 管線 130 電子框架 211 可升級之冷卻劑調節單元 223 一體式熱交換器/膨脹箱 224 、 225 歧管 97400.doc -17- 200528952 227 228 300 310a 410b 312 314a 323b 315a 321b 340a 344b 362、 415b 432a 440b 450a 463 316a 320b 318a 322a 422b 325a 、：310b、410a、 、314b、323a、 〜414a、414b 、315b、321a、 、332a、332b、 、340b、344a、 、350a 、 350b 、 363、415a、 、421a、421b、 、432b 、 440a 、 、444a、444b、 、450b 、 462 、 、316b、320a、 、318b 、322b 、 422a 、 、325b 、 425a 、 模組泵浦單元 雙向控制閥門 冷卻劑分配單元 模組冷卻單元 入口管線 雙向手動球閥門 套管接頭 雙向比例閥門 旁路 膨脹箱 第一冷卻迴路 97400.doc -18- 200528952 425b 327a、327b、427a、 427b 330a、330b、352a、 352b 、 360 、 423a 、 423b 、 430a 、 430b 、 452a、452b、460 343a、343b、443a、 443b 400 412a 412b 416a、416b 420a、420b 424a、424b 第二冷卻迴路 球閥門 止回閥門 冷卻劑分配單元實施例 第一輸入管線 第二輸入管線 三程比例閥門 關閉閥門 一體式熱交換器 97400.doc -19-Unit with Integral Plate Heat Exchanger / Expansion Tank and Method of Use ”is described in detail in the US patent application. The system coolant recovered from these electronic racks is collected in a recovery manifold 119 and guided through an integrated heat exchange Expansion tank area of the compressor / expansion tank 223. From the expansion tank 223, the system coolant is guided to another manifold 224 that supplies the coolant to a plurality of modular pump units (MPUs) 227. The higher pressures to be removed are discharged , Collected in the manifold 225, and guided to the "hot side" of the heat exchanger in the bulk heat exchanger / expansion tank 223. It is connected via a mechanical device including an automatic connection module (not shown) To the manifold, these automatic connection components are connected to the valve by Guangsoft officials-including the isolation valve operated by a plurality of force tubes = = mechanical ^ ㈣ ... ㈣—for quick disconnection by isolating P and isolating nLl manually to replace Automatically connect the components. ::: Manifolds 224 and 225, used to separate MPϋ from the manifold in the installation room. Cold 2 = :: _ (116, 117) `` Cold ~ will be cooled with water, Coolant first to distribute coolant to need However, 97400.doc 200528952—or multiple electronic rack supply manifolds 118. Although not shown here, it can be used as a coffee filter system, and if necessary, such as Benzotriazole ( BTA) corrosion inhibitor component. Use bidirectional control valve C7 to regulate the flow rate of cooling water in the facility to the heat exchanger in the bulk heat exchanger / expansion tank 223, thereby controlling the system coolant passed to the electronic rack. Temperature. Thermistor temperature sensing element (not shown) may be located at the population of the system coolant supply manifold 118 to supply electronic signals to the power / controller that controls the operation of the valve 228. If the system coolant temperature Above the required temperature f, the valve 228 can be opened even more so as to allow the flow of facility water to pass through the thermal parent switch, resulting in the self-supplying manifold being led to the system of the electronic frame, the first of the water. The temperature is reduced. Alternatively, if the system water temperature is lower than the required temperature, the valve 228 may be closed smaller to reduce the flow of facility water through the heat exchanger, resulting in the system water being directed from the supply manifold 118 to the electronic rack The temperature rises. It is noted from Figure 2 that the function of the coolant distribution unit can be upgraded by adding a modular pump unit to the SCCU according to the cooling needs of the computer room's electronic secondary system. Today, Computer systems are designed and built for continuous operation. This can be accomplished by a combination of redundant components that can be maintained simultaneously and replaced without affecting the operation of the system. Examples include multiple fans / blowers or multiple power modules. Neither the initial coolant distribution unit of FIG. 1 nor the enhanced and upgradeable coolant conditioning unit of FIG. 2 has the redundancy or the necessary degree of maintaining capacity to provide the required systems that are available. Therefore, the system provided in this article is a cooling system and method using at least two module cooling units (MCUs). Each MCU matches or exceeds the cooling requirements of the computer room electronic sub-system to be cooled. In addition, each MCU uses 97400.doc -12-200528952 to match or exceed the availability of the electronic sub-system itself by the combination of module redundancy combined with maintaining capabilities. Figure 3 depicts a partial embodiment of a cooling system or coolant distribution unit 300 according to one aspect of the present invention. In this example, the unit 300 includes at least two modular cooling units (MCUs) 310a, 310b. Each cooling unit 310a, 31 Ob can provide system coolant to a plurality of electronic sub-systems or electronic racks to be cooled. The inlet line 312 connects the facility water supply from a source to the cooling system. The facility water is directed to the MCU through two-way manual ball valves 314a, 314b, which are normally open unless an MCU is replaced or removed for repair. Where necessary, sleeve joints 315a and 315b can also be positioned on the facility coolant supply inlet to facilitate removal of the MCU. Electrically operated bidirectional proportional valves 3 16a, 3 16b determine whether the facility coolant flows under the control of the system controller] \ 10: 1; 31 (^ or] \ 4 (: 113101}. Provide bypass 3 1 8a 3, 8b shunts part of the facility coolant around the body expansion tank / heat parent converter of one of the embodiments. The amount of facility coolant passing through the bypass 3 18a, 3 1 8b is operated by the controller using electricity The two-way proportional valves 320a, 320b are controlled. The facility coolant entering the expansion tanks 322a, 322b continues to pass through the first cooling circuits 325a, 325b in the heat exchanger (Hx) 324a, 324b. After exiting the first cooling circuit, the facility water Passed through another casing joint 321a, 32 lb and two-way manual ball valves 323a, 323b before recycling to the source of facility water. In terms of system water, system water is recovered from multiple electronic sub-systems and passed through ball valves 330a, 330b and sleeves Pipe joints 332a, 332b, where they are added to the system coolant in the expansion tanks 322a, 322b. Then, the system coolant from the tank 97400.doc -13-200528952 is pumped through the bushing joints 340a, 340b And by fruit 342a, 342b Pressurizing it, the pump passes the pressurized system coolant through the check valves 343a, 343b and the bushing joints 344a, 344b to recover to the second cooling circuits 327a, 327b of the heat exchangers 324a, 324b. Cooling circuit, which transfers the cooled system water to (for example) sleeve joints 35〇a, 35〇b and ball valves 352a, 352b to the appropriate electronic rack manifold. If necessary, the temperature sensor " "TS" is provided on the facility water inlet supply line and the system water outlet supply line, and the pressure sensor "PS" can be placed on the upper system water outlet supply line to monitor the operating conditions in the cooling system. MCU31〇a 、 The reservoir or expansion tanks 322a, 322b of 310b are in fluid communication through a ball valve 360, which also has sleeve joints 3 62, 363 on both sides. Valve 360 and joints 362, 363 allow removal or Replace one modular cooling unit. Advantageously, there are a minimum of two modular cooling units in each cooling system such as that depicted in Figure 3. These cooling units are connected by ball valves and joints as discussed above Together so that Run any MCU at a fixed time. As illustrated, configure 5-MCU to provide the entire cooling system capability for one or more electronic subsystems to be cooled. Although shown as a bulk heat exchanger / expansion tank in Figure 2 'However, each module cooling unit can be configured with separate expansion tanks and heat exchangers. In addition, each heat exchanger can be a variety of examples.' It includes plate heat exchangers or shell and tube heat exchangers. Μ. . By connecting the devices together, it is possible to run any MCU at a specific time. With the power of the cooling system and the secondary system of the controller, microcode can control the switching between these MCUs and their operation. Sleeve joints are present at the inside / outside of the pipe connection at —μ⑶ 97400.doc • 14- 200528952, allowing the MCU to be removed and replaced if necessary. A manual isolation valve is associated with each bushing joint so that it can be operated] ^ (31; isolated or separated from idle MCUs. An extra bushing joint is provided for each pump in the MCU, so that the pump can be replaced without having to Remove the entire MCU. Another feature of the design of Figure 3 is the pipe connecting the two reservoirs. During normal operating conditions, there is no guarantee that system water will flow into one expansion tank or another expansion tank. This expansion tank is connected together to avoid problems as shown in Figure 3. Figure 4 depicts an alternative cooling system or coolant distribution unit, which is part of Embodiment 400, which again utilizes at least two modular cooling units 41〇a, 41〇b. In this alternative embodiment, the user water path is separated and isolated, so that the facility water is received through the first input line 412a and the second input line 412b, and the first recovery line and the first Two recovery pipelines to recover the facility water. If the two facility water feeds are indeed redundant and independent of each other, more availability can be achieved. In this way, it is ensured that there will be available facility water to cool the running electricity In operation, the facility supply water flows through the two-way manual ball valves 414a, 414b, which are usually open again. The facility water is supplied to the three-way proportional valves 416a, 416b for electrical operation via casing joints 415a, 415b. The valves 416a and 416b determine the amount of facility water to be diverted around the expansion tanks 422a and 422b and the integrated heat exchangers 424a and 42. The facility water flowing through the bypass is controlled by the electric shut-off valves 420a and 420b. For example, valves 420a, 42Ob close the bypass flow in a non-operational MCU to prevent facility water from flowing through the non-operational MCU.) As explained above, by controlling the flow through the first cooling circuit 97400.doc 15 200528952 425a, 425b The amount of facility water that is cooled can control the temperature of the system coolant in the second cooling circuit 427a, 427; b. This can be achieved by controlling the amount of facility water that passes through individual bypasses. After passing through the heat exchanger Through the casing joints 42 丨 a, 421b, ball valve 423a, and core output facility water to recover to individual independent sources. In terms of system water, the recovered system water is collected in a recovery manifold and passed through The two-way ball valves 43a and 430b and the associated bushing joints 432a and 432b are transferred to one of the adjustment units 410a and 410b to operate the adjustment unit. The recovered system water flows into the expansion tanks 422a and 422b. At the same time, the pump 442a, 442b Withdraws water from the tank through the associated casing joints 44〇a, 44 沘. The system water is pressurized by pumps 442a, 442b and passed through check valves 443 & 44 and associated Casing joints 444a, 444b, and input them to the second cooling circuit 427a, 427b, in which the system water is cooled in the heat exchangers 42 乜, 42 and the cooled system coolant output from the heating parent is replaced Bushings 450a, 450b and ball valves 452a, 452b, where they are provided to one or more electronic secondary systems to be cooled. Similarly, Figure 4 shows the temperature sensor, TS "and pressure sensor" ps "on the system's water supply line, which can be used to monitor the operation of the cooling system. The expansion tank passes through an associated casing The ball valves 460 of the joints 462 and 463 are also connected again. Although the preferred embodiment has been described and described in detail herein, it will be apparent to those skilled in the art that various modifications and additions can be made without departing from the spirit of the present invention. , Substitution, and similar actions, and therefore it is considered within the scope of the invention as defined by the scope of the following patent applications. [Simplified illustration of the drawing] 97400.doc -16- 200528952 Figure 1 depicts a computer room Figure 2 is a schematic diagram of an adjustment unit that can be used in accordance with the present invention; the cooling agent distribution unit is known; the upgradeable coolant that can be used in the same way as a modular cooling unit; Figure 3 depicts one aspect of the present invention. A part of the embodiment using the same system; and the two module cooling unit FIG. 4 depicts a part of the embodiment using at least one of the cooling systems according to an aspect of the present invention. Key component symbols] 111 Cooling unit 112 Power / control element 113 Accumulator / Expansion tank 114, 324a, 324b Heat exchanger 115, 342a, 342b, Pump 442a, 442b 116 Inlet 117 Outlet 118 Supply manifold 119 Recovery manifold 120, 121 Connectors 122, 123 Pipeline 130 Electronic frame 211 Upgradeable coolant conditioning unit 223 Integrated heat exchanger / expansion tank 224, 225 Manifold 97400.doc -17- 200528952 227 228 300 310a 410b 312 314a 323b 315a 321b 340a 344b 362, 415b 432a 440b 450a 463 316a 320b 318a 322a 422b 325a: 310b, 410a,, 314b, 323a, ~ 414a, 414b, 315b, 321a,, 332a, 332b, 340b, 344a,, 350a, 350b, 350b, 363, 415a, 421a, 421b, 432b, 440a, 444a, 444b, 450b, 462, 316b, 320a, 318b, 322b, 422a, 325b, 425a, module pump unit bidirectional control valve cooling Agent distribution unit module cooling unit inlet pipeline bidirectional manual ball valve bushing joint bidirectional proportional valve bypass expansion tank first cooling circuit 97400.do c -18- 200528952 425b 327a, 327b, 427a, 427b 330a, 330b, 352a, 352b, 360, 423a, 423b, 430a, 430b, 452a, 452b, 460 343a, 343b, 443a, 443b 400 412a 412b 416a, 416b 420a 420b 424a, 424b second cooling circuit ball valve check valve coolant distribution unit embodiment first input line second input line three-way proportional valve closed valve integrated heat exchanger 97400.doc -19-