CN100338983C - Cooling system and method employing for ensuring cooling of multiple electronics subsystems - Google Patents
Cooling system and method employing for ensuring cooling of multiple electronics subsystems Download PDFInfo
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- CN100338983C CN100338983C CNB2004100780531A CN200410078053A CN100338983C CN 100338983 C CN100338983 C CN 100338983C CN B2004100780531 A CNB2004100780531 A CN B2004100780531A CN 200410078053 A CN200410078053 A CN 200410078053A CN 100338983 C CN100338983 C CN 100338983C
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Abstract
A cooling system is provided employing at least two modular cooling units (MCU). Each MCU is capable of providing system coolant to multiple electronics subsystems to be cooled, and each includes a heat exchanger, a first cooling loop with at least one control valve, and a second cooling loop. The first cooling loop receives chilled facility coolant from a source and passes at least a portion thereof through the heat exchanger, with the portion being controlled by the at least one control valve. The second cooling loop provides cooled system coolant to the multiple electronics subsystems, and expels heat in the heat exchanger from the multiple electronics subsystems to the chilled facility coolant in the first cooling loop. The at least one control valve allows regulation of facility coolant flow through the heat exchanger, thereby allowing control of temperature of system coolant in the second cooling loop.
Description
Technical field
The present invention is relevant with other equipment with the cooling package that is used for to electronic device, module and system radiating generally.Specifically, the present invention comes the cooling system and the method for the electronics subsystems of liquid cools such as electronic enclosures relevant with adopting at least two modularization cooling units (MCU).
Background technology
The heat flux that electronic equipment such as microprocessor and power supply dissipates has reached the degree that the cooling provision that needs outside the simple air cooling comes the control assembly temperature once more.Liquid cools (for example, water-cooled) is a kind of these more attractive technology of high heat-flux that is used for tackling.The heat that liquid dissipates with the high efficiency mode temperature rise minimum of the liquid of the assembly that is cooled (that is, to) absorbent assembly/module.Usually, this heat finally will be transferred to external environment condition from liquid.Otherwise coolant temperature can constantly rise.
From nineteen seventies to the nineties initial stage, International Business Machine Corporation (IBM) by make cooling fluid via as the cooling fluid allocation units of single mainframe computer aqueous humor thermostat unit (CRWCU) circulation finished this task.The cooling water of this CRWCU after with adjustment distributed to each electronic enclosures of the large computer system that needs cooling.Traditionally, the electronic enclosures of mainframe computer comprises Memory Storage Cabinet, processor rack, I/O rack, power supply cabinet etc.When work, this CRWCU receives user's cooling water, with it cooling water after the adjustment of each electronic enclosures of computer floor is dispelled the heat then.
Above-mentioned CRWCU comprises a main cooling circuit, and the building cooling water is supplied with and this main cooling circuit of flowing through by the control valve of motor driven.This valve has been determined the flow of building cooling water that will be by heat exchanger, and the part of this building cooling water can directly turn back to return pipe via the bypass opening simultaneously.Above-mentioned CRWCU also comprises second cooling circuit with water receiver case, and water is carried out adjustment and outputs to the electronic enclosures that needs cooling the computer floor as the water source after the adjustment from this heat exchanger from the above-mentioned heat exchanger of this water receiver case suction by a pump in two pumps.Computer floor coolant-temperature gage regulon separates with electronic equipment cabinet usually and system water (remaining on usually about 22 ℃) will be provided to all electronic equipment cabinets of computer floor.
The cooling fluid allocation units, specifically computer floor coolant-temperature gage regulon (CRWCU) contains single heat exchanger, single water receiver, single control valve and redundant pump.Therefore, under the situation that has a pump to break down, CRWCU can automatically switch to redundant pump, but any other fault in these cooling fluid allocation units can make whole computer floor large computer system shut down.For example, if above-mentioned heat exchanger, control valve or building cooling water source break down, the whole large computer system in the computer floor also will break down.Redundant mass computing chance takes over computer floor so that processing can be proceeded (with the pattern of performance reduction), is repaired up to the large-scale computer of shutting down.
Summary of the invention
Now, replace such as twentieth century 70 and the existing multimachine cabinet of the eighties large computer system by single processor rack or frame.Therefore, a plurality of processor racks to low grade, can obtain the water source from single computer floor coolant-temperature gage regulon from high-grade, middle-grade now.But a problem is arranged wherein.The forfeiture of single heat exchanger fails, control valve fault or cooling water source can make whole computer floor quit work.
By providing a kind of cooling system with at least two modularization cooling units (MCU) can overcome these shortcomings and other advantages are provided, wherein each MCU can both provide system cools liquid to a plurality of electronics subsystems of cooling that need.Each MCU comprises heat exchanger, has first cooling circuit and second cooling circuit of at least one control valve.When MCU worked, this first cooling circuit received the apparatus cools liquid of cooling and makes that wherein at least a portion is by described heat exchanger from source, and this part is by described at least one control valve control.This second cooling circuit provides cooled system cools liquid to a plurality of electronics subsystems, will give the apparatus cools liquid of the cooling in described first cooling circuit from the heat discharge of these a plurality of electronics subsystems in described heat exchanger.Described at least one control valve can be regulated the apparatus cools liquid of the cooling of the described heat exchanger of flowing through, thereby can be controlled at system cools liquid temperature required of a plurality of electronics subsystems of cooling in described second cooling circuit.
In yet another aspect, provide a kind of electronic apparatus system that is cooled off.This electronic apparatus system that is cooled off comprises a plurality of electronics subsystems and at least two modularization cooling units (MCU).Each MCU can both provide system cools liquid to a plurality of electronics subsystems of cooling that need.Each MCU comprises heat exchanger, has first cooling circuit and second cooling circuit of at least one control valve.When MCU worked, this first cooling circuit received the apparatus cools liquid of cooling and makes that wherein at least a portion is by described heat exchanger from source, and this part is by described at least one control valve control.This second cooling circuit provides cooled system cools liquid to described a plurality of electronics subsystems, will give the apparatus cools liquid of the cooling in described first cooling circuit from the heat discharge of described a plurality of electronics subsystems in described heat exchanger.Described at least one control valve can be regulated the apparatus cools liquid of the cooling of the described heat exchanger of flowing through, thereby can be controlled at the temperature of the system cools liquid of the described a plurality of electronics subsystems of cooling in described second cooling circuit.
On the other hand, provide a kind of method of cooling off a plurality of electronics subsystems.This method comprises provides at least two modularization cooling units (MCU), and wherein each MCU can both provide system cools liquid to a plurality of electronics subsystems of cooling that need.And then, second cooling circuit that each MCU comprises heat exchanger, has first cooling circuit of at least one control valve and have system cools liquid.For a selected MCU among described at least two MCU, this method also comprises: from a source to described first cooling circuit apparatus cools liquid of cooling is provided and make wherein at least a portion via described at least one control valve by described heat exchanger; Provide cooled system cools liquid from described second cooling circuit to described a plurality of electronics subsystems, and in described heat exchanger, will give the apparatus cools liquid of the cooling in described first cooling circuit from the heat discharge of described a plurality of electronics subsystems, at least one control valve of wherein said selected MCU can be regulated the apparatus cools liquid of the described heat exchanger of flowing through, thereby can be controlled at the temperature of the system cools liquid of the described a plurality of electronics subsystems of cooling in described second cooling circuit.
Other functions and advantage can realize by technology of the present invention.Other embodiment of the present invention and aspect will describe in detail below, and they are counted as the part of the invention applied for.
Description of drawings
Particularly point out and explicitly called in claims behind specification and be counted as theme of the present invention.From the detailed description of doing below in conjunction with accompanying drawing, above-mentioned and other purpose of the present invention, function and advantage are conspicuous, and these accompanying drawings are:
Fig. 1 shows traditional cooling fluid allocation units that are used for computer floor;
Fig. 2 is can be according to an aspect of the present invention and the schematic diagram of the extendible coolant temperature regulon that adopts;
Fig. 3 partly shows the embodiment of the cooling system that adopts two modularization cooling units according to an aspect of the present invention; And
Fig. 4 partly shows another embodiment that adopts the cooling system of at least two modularization cooling units according to an aspect of the present invention.
Embodiment
" electronics subsystems " of Shi Yonging comprises any machine room, rack, frame, compartment of one or more heat generating components of containing computer system or other electronic apparatus systems that need cool off etc. herein.Term " electronic enclosures " comprise any heat generating component with computer system or electronic apparatus system (for example can be one have height, in or the stand-alone computer processor of low side disposal ability) rack or frame.In one embodiment, electronic enclosures can comprise a plurality of electronic equipment cabinet, and each case has one or more heat generating components that need cooling.
In described cooling fluid allocation units, perhaps an example of the cooling fluid in the modularization cooling unit (MCU) that specifically illustrates herein is a water.But the principle that is disclosed is easy to be applied to the cooling fluid in the other types of equipment side and system side.For example, described cooling fluid can comprise salt solution, fluorohydrocarbon liquid or other similar chemical cooling fluid or refrigerant, but still keeps described advantage of the present invention and unique property.
As above briefly point out, the power level in the computer equipment (mainly being processor) has risen to no longer can air-cooled simply level.These assemblies will be used water-cooled probably.The heat that processor dissipates can be by the coldplate transmission feedwater of water-cooled.User place (that is data center) common available water is not suitable for these coldplates.At first, worry the formation of condensation, because the temperature of the water of data center (from 7 ℃ to 15 ℃) is far below indoor dew point (being generally 18-23 ℃).Secondly, the quality of relatively poor relatively water (its chemical property, cleanliness factor etc.) will influence system reliability.Therefore desirablely be, utilize a kind of water-cooled/thermostat unit, it makes electronic equipment that high-quality current direction need cool off and flows back to from it, ejects the heat from data center water.So-called herein " equipment water " or " apparatus cools liquid " refer to this data center water or cooling fluid, and " system water " or " system cools liquid " refers to water or cooling fluid after the cooled/adjustment that circulates between described cooling fluid allocation units and (a plurality of) electronics subsystems of being cooled off respectively.
With reference now to accompanying drawing,, the same numeral that uses among the wherein different figure refers to identical or similar assembly.Fig. 1 shows an embodiment who is used for traditional cooling fluid allocation units of computer floor.Cooling unit 111 is relatively large, has occupied to think two spaces more than the complete electronic devices rack now.It in this cooling unit power/control element 112; water receiver/expansion tank 113; heat exchanger 114; pump 115 (also subsidiary usually second pump that redundancy is arranged); user's water (or scene or device service water or cooling fluid) water inlet pipe 116 and outlet pipe 117; water is caused the liquid supply manifold (manifold) 118 of each electronic equipment cabinet 130 and time liquid manifold 119 that will draw back from the water of each electronic equipment cabinet 130 via pipeline 123 and connector 121 via connector 120 and pipeline 122.
Fig. 2 shows an embodiment of the coolant temperature expanded regulon (SCCU) 211 according to an aspect of the present invention.In the unit 211 will be power governor and controller (not shown).The system cools liquid that returns from electronic enclosures is collected in back in the liquid manifold 119 and the expansion tank part by integrated heat exchanger/expansion tank 223, is described in detail in the U.S. Patent application of " ScalableCoolant Conditioning Unit with Integral Plate Heat Exchanger/ExpansionTank and Method of Use " (the coolant temperature expanded regulon and using method thereof with integrated plate-type exchanger/expansion tank) as the above title of including in.System cools liquid is introduced to another manifold 224 from expansion tank 223, and this manifold 224 offers a plurality of modularization pumping units (MPU) 227 with cooling fluid." hot side " that the higher discharge liquor of the pressure of these MPU is collected into manifold 225 and is sent to heat exchangers in above-mentioned integrated heat exchanger/expansion tank 223 (hotside).Above-mentioned MPU is connected to manifold by (insertionfacilitation) mechanism that easily inserts that comprises automatic coupling assembling (not shown), and these automatic coupling assemblings are connected to the isolating valve mechanism that comprises a plurality of Electromagnetic Control isolating valves by flexible pipe.Alternately, this isolating valve can or local or remotely manually control, this automatic coupling assembling can replace with the quick decoupler of manually control.This isolating valve is connected to manifold 224 and 225, is used for during mounting and dismounting MPU and manifold being isolated.
Component cooling water (116, the 117) cooling of " cold side (coldside) " through flowing through heat exchanger, the said system cooling fluid is sent to liquid supply manifold 118, and it distributes to one or more electronic enclosures that need cooling with cooling fluid.Though do not illustrate at this, above-mentioned SCCU can also adopt the measure of system water being filtered and added automatically as required the corrosion inhibitor such as BTA (BTA).Two logical control valves 228 are used for being adjusted to the flow velocity of the component cooling water of the heat exchanger in integrated heat exchanger/expansion tank 223, thereby the temperature of the system cools liquid of electronic enclosures is given in control.Thermally sensitive temperature sensing element (not shown) can be set, so that provide the signal of telecommunication in the import of system cools liquid liquid supply manifold 118 to the power supply/controller of control valve 228 operations.If it is desirable that the system cools liquid temp is higher than, valve 228 can leave bigger, makes the flow increase by the equipment water of heat exchanger, thereby reduces the temperature of delivering to the system water of electronic enclosures from liquid supply manifold 118.Alternately, desirable if the system water temperature is lower than, valve 228 can close smaller, and the flow of the equipment water by heat exchanger is reduced, thereby improves the temperature of delivering to the system water of electronic enclosures from liquid supply manifold 118.As seen from Figure 2, depend on the cooling requirement of computer floor electronics subsystems, by adding the modularization pumping unit to SCCU as required, the function of above-mentioned cooling fluid allocation units is extendible.
Computer system is designed and manufactured as continuously-running now.This can be by can safeguarding simultaneously and can being replaced the redundant component of not influence system operation make up and realize.Example comprises a plurality of fan/blower or a plurality of power module.The original cooling fluid allocation units of Fig. 1 and the enhancement mode of Fig. 2 can be expanded the coolant temperature regulon and not have the necessary redundant rank or the while ability of maintenance that required system can be used.Therefore, provide the cooling system and the method for at least two modularization cooling units of a kind of employing (MCU) here, each modularization cooling unit mates or surpasses the cooling requirement of the computer floor electronics subsystems that needs cooling.In addition, each MCU is by making up the availability of mating or surpassing electronics subsystems itself with the modularization redundancy together with the while ability of maintenance.
Fig. 3 partly show according to an aspect of the present invention cooling system or the embodiment of cooling fluid allocation units 300.In this example, unit 300 comprises at least two modularization cooling units (MCU) 310a, 310b.Each cooling unit 310a, 310b can provide system cools liquid to a plurality of electronics subsystems or electronic enclosures of cooling of needing.Water inlet pipe 312 is sent the equipment water that the water source provides into cooling system.Equipment water is delivered to described MCU by two-way manual ball valve 314a, 314b, unless changing or pull down one of them MCU so as the maintenance, ball valve 314a, 314b often open.In the import of apparatus cools liquid, also dispose lasso connector (ferrule coupling) 315a and 315b, so that can pull down MCU in case of necessity.Electric double- way proportioning valve 316a, 316b determine under the control of system controller whether apparatus cools liquid flows through MCU 310a or MCU 310b.
In the system water side, system water is returned from a plurality of electronics subsystems, by ball valve 330a, 330b and lasso connector 332a, 332b, is added to system cools liquid among expansion tank 322a, the 322b in this place's system water.Then from the system cools liquid of this case by lasso connector 340a, 340b is drawn out of and by pump 342a, 342b supercharging, its system cools liquid after with supercharging is sent the second cooling circuit 327a, the 327b of heat exchanger 324a, 324b back to by check-valves 343a, 343b and lasso connector 344a, 344b.Cooled system water is delivered to suitable electronic enclosures manifold from this second cooling circuit by for example lasso connector 350a, 350b and ball valve 352a, 352b.If desired, can on equipment water water inlet pipe and system water outlet pipe, all dispose temperature sensor " TS ", and on the system water outlet placement force transducer " PS " to monitor the working condition in the cooling system.
The water receiver of MCU 310a, 310b or expansion tank 322a, 322b come fluid connection via ball valve 360 (its both sides also have lasso connector 362,363).Valve 360 and connector 362,363 make and can unload or change one of them modularization cooling unit.
Advantageously, as shown in Figure 3, the rarest two the modularization cooling units of each cooling system.These cooling units link together by above-mentioned ball valve and connector, so that can work at the arbitrary MCU of given time.As noted, each MCU is configured as needs one or more electronics subsystems of cooling that cooling system ability completely is provided.Though be shown integrated heat exchanger/expansion tank in Fig. 2, each modularization cooling unit also can be configured to have independent expansion tank and heat exchanger.In addition, each heat exchanger can be one of various embodiment, comprises plate-type exchanger or shell and tube heat exchanger.These MCU connect together by manifold, so that can work at the arbitrary MCU of given time.The work of MCU and the switching between the MCU can be carried out microcode control by the power supply and the control device subsystem of cooling system.All there is the lasso connector water outlet of each MCU/water inlet pipe junction, so that can pull down and change MCU in case of necessity.Each lasso connector is associated with manual isolating valve, so that the MCU that is working can be isolated or separates with the MCU of free time.Pump in each MCU has all disposed additional lasso connector, needn't pull down whole M CU so that can change this pump.The pipeline that is further characterized in that above-mentioned two water receivers of connection of the design of Fig. 3.During normal operating conditions, can not guarantee that system water flows into an expansion tank or another expansion tank.Therefore, by being linked together as shown in Figure 3, these expansion tanks avoid going wrong.
Fig. 4 partly shows the embodiment of another cooling system that also adopts at least two modularization cooling unit 410a, 410b or cooling fluid allocation units execution mode 400.In this alternate embodiments, user's water passage be independent with isolate so that respectively by the first feed pipe 412a and the second feed pipe 412b receiving equipment water, by first return pipe and the second return pipe Returning equipment water.If it is real redundant and separate that these two equipment water are presented, just can realize the availability that increases.This has guaranteed to have an equipment water water source to can be used for cooling off the electronics subsystems that is moving.
Be in operation, it also is two-way manual ball valve 414a, the 414b that often opens that the water supply of the said equipment water is flow through.Equipment water is provided for electric three passes proportioning valve 416a, 416b by lasso connector 415a, 415b.Valve 416a, 416b have determined will be by the equipment water yield of bypass with the expansion tank 422a, the 422b that walk around integrated heat exchanger 424a, 424b.Flow through shunt valve equipment water by motorised cut-off valves 420a, 420b control (for example, valve 420a, 420b can turn-off the by-pass of idle MCU, flow through idle MCU to prevent equipment water).As mentioned above, by the cooled equipment water yield of control flows, can control the temperature of the system cools liquid in the second cooling circuit 427a, the 427b through the first cooling circuit 425a, 425b.This can realize by the equipment water yield of control flows through corresponding shunt valve.Flow through behind the heat exchanger, equipment water flows out by lasso connector 421a, 421b and ball valve 423a, 423b, returns independent water source separately.
In the system water side, the system water of returning is collected into back in the liquid manifold, delivers to thermostat unit of working among thermostat unit 410a, the 410b by two-way ball valve 430a with 430b and related lasso connector 432a and 432b again.The system water of returning flows into expansion tank 422a, 422b.Simultaneously, water is extracted out from above-mentioned case 422a, 422b by related lasso connector 440a, 440b by pump.System water is imported the second cooling circuit 427a, 427b by check-valves 443a, 443b with related lasso connector 444a, 444b after by pump 442a, 442b supercharging, obtains cooling in this place's system water in heat exchanger 424a, 424b.Cooled system cools liquid is exported from heat exchanger, and lasso connector 450a, the 450b by association and ball valve 452a, 452b offer one or more electronics subsystems that need cooling.In addition, temperature sensor " TS " and pressure sensor " PS " on the system water water supply line have been shown among Fig. 4, it can be used for monitoring the operation of above-mentioned cooling system.Above-mentioned expansion tank also is to be communicated with by the ball valve 460 with related lasso connector 462,463.
Though illustrate and describe in detail some preferred embodiments here, but those skilled in the art be it is evident that, can make various modifications, replenish, replacement etc. and do not depart from spirit of the present invention, therefore, as defining in following claims, these modifications, replenish, replacement etc. is counted as within the scope of the present invention.
Claims (27)
1. cooling system, described cooling system comprises:
At least two modularization cooling unit MCU, each MCU can both provide system cools liquid to a plurality of electronics subsystems of cooling that need; And
Each MCU among wherein said at least two MCU comprises heat exchanger, first cooling circuit and second cooling circuit with at least one control valve, and during MCU work among wherein said at least two MCU, described first cooling circuit receives the apparatus cools liquid of cooling and makes wherein at least a portion by described heat exchanger from source, this part is by described at least one control valve control, and described second cooling circuit provides cooled system cools liquid to described a plurality of electronics subsystems, and in described heat exchanger, will give the apparatus cools liquid of the cooling in described first cooling circuit from the heat discharge of described a plurality of electronics subsystems, wherein said at least one control valve can be regulated the apparatus cools liquid of the described heat exchanger of flowing through, thereby can control the temperature required of the system cools liquid that is used for cooling off described a plurality of electronics subsystems in described second cooling circuit
Wherein each MCU also comprises system cools liquid expansion tank, and wherein the described heat exchanger of each MCU is arranged in the system cools liquid expansion tank of this MCU.
2. the cooling system of claim 1, when wherein said cooling system is worked, have only MCU work at least among described two MCU, provide system cools liquid to described a plurality of electronics subsystems, and among described at least two MCU at least another MCU be in standby mode.
3. the cooling system of claim 2, also comprise the related connector with described at least two MCU, this connector allows when another MCU work among described at least two MCU and can dismantle each MCU when described a plurality of electronics subsystems provides system cools liquid.
4. the cooling system of claim 3, wherein each MCU comprise make system cools liquid by described second cooling circuit pump and be positioned at described pump both sides so that need not to dismantle the connector that described MCU just can dismantle described pump.
5. the cooling system of claim 1, the source of the apparatus cools liquid of wherein said cooling comprises the common source of the apparatus cools liquid of the cooling that offers described at least two MCU.
6. the cooling system of claim 1, the source of the apparatus cools liquid of wherein said cooling comprises having first feed pipe that is connected with a MCU among described at least two MCU and first source of first liquid back pipe, and has second feed pipe that is connected with the 2nd MCU among described at least two MCU and second source of second liquid back pipe.
7. the cooling system of claim 1, wherein said a plurality of electronics subsystems comprise the electronic enclosures of a plurality of formation computer floor computing environment, wherein each MCU can both provide system cools liquid to cool off this computer floor computing environment.
8. the cooling system of claim 1, also comprise controller, described controller is used for monitoring that the work of described at least two MCU and a MCU in detecting described at least two MCU automatically switch to another MCU among described at least two MCU to guarantee to cool off continuously described a plurality of electronics subsystems when breaking down.
9. the cooling system of claim 8, also comprise being connected to each MCU and can be by the electric controlled shutoff valve of described controller control, the controlled shutoff valve of described electricity be used for making selectively the apparatus cools liquid of cooling flow through among described at least two MCU a MCU and make the MCU of system cools liquid from described at least two MCU flow to described a plurality of electronics subsystems selectively.
10. the cooling system of claim 1, wherein each MCU also comprises the system cools liquid expansion tank that is communicated with described second cooling circuit, and the system cools liquid expansion tank of wherein said at least two MCU connects into fluid connection to keep enough system cools liquid in the described system cools liquid expansion tank of the MCU that guarantees working.
11. the cooling system of claim 1, wherein the described heat exchanger of each MCU comprises the plate-type exchanger that integrally is arranged in the described system cools liquid expansion tank.
12. an electronic apparatus system that is cooled off, the described electronic apparatus system that is cooled off comprises:
A plurality of electronics subsystems;
At least two modularization cooling unit MCU, each MCU can both provide system cools liquid to a plurality of electronics subsystems of cooling that need; And
Each MCU among wherein said at least two MCU comprises heat exchanger, first cooling circuit and second cooling circuit with at least one control valve, wherein when described MCU works, described first cooling circuit receives the apparatus cools liquid of cooling and makes wherein at least a portion by described heat exchanger from source, this part is by described at least one control valve control, and described second cooling circuit provides cooled system cools liquid to described a plurality of electronics subsystems, and in described heat exchanger, will give the apparatus cools liquid of the cooling in described first cooling circuit from the heat discharge of described electronics subsystems, wherein said at least one control valve can be regulated the apparatus cools liquid of the described heat exchanger of flowing through, thereby can control the temperature of the system cools liquid that is used for cooling off described a plurality of electronics subsystems in described second cooling circuit
Wherein each MCU also comprises system cools liquid expansion tank, and wherein the described heat exchanger of each MCU is arranged in the system cools liquid expansion tank of this MCU.
13. the electronic apparatus system that is cooled off of claim 12 when the wherein said electronic apparatus system that is cooled off is worked, has only a MCU job at least among described two MCU, provide system cools liquid to described a plurality of electronics subsystems.
14. the electronic apparatus system that is cooled off of claim 13, also comprise the related connector with described at least two MCU, this connector allows when another MCU work among described at least two MCU and can dismantle each MCU when described a plurality of electronics subsystems provides system cools liquid.
15. the electronic apparatus system that is cooled off of claim 14, wherein each MCU comprise make system cools liquid by described second cooling circuit pump and be positioned at described pump both sides so that need not to dismantle the connector that described MCU just can dismantle described pump.
16. the electronic apparatus system that is cooled off of claim 12, the source of the apparatus cools liquid of wherein said cooling comprises having first feed pipe that is connected with a MCU among described at least two MCU and first source of first liquid back pipe, and has second feed pipe that is connected with the 2nd MCU among described at least two MCU and second source of second liquid back pipe.
17. the electronic apparatus system that is cooled off of claim 12, wherein said a plurality of electronics subsystems comprises the electronic enclosures of a plurality of common formation computer floor computing environment, and each MCU among wherein said at least two MCU can both provide system cools liquid to cool off this computer floor computing environment.
18. the electronic apparatus system that is cooled off of claim 12, also comprise controller, described controller is used for monitoring that described at least two MCU and a MCU in detecting described at least two MCU automatically switch to another MCU among described at least two MCU to guarantee to cool off continuously described a plurality of electronics subsystems when breaking down.
19. the electronic apparatus system that is cooled off of claim 18, also comprise being connected to each MCU and can be by the electric controlled shutoff valve of described controller control, the controlled shutoff valve of described electricity be used for making selectively the apparatus cools liquid of cooling flow through among described at least two MCU a MCU and make the MCU of system cools liquid from described at least two MCU flow to described a plurality of electronics subsystems selectively.
20. the electronic apparatus system that is cooled off of claim 12, wherein each MCU also comprises the system cools liquid expansion tank that is communicated with described second cooling circuit, and the system cools liquid expansion tank of wherein said at least two MCU connects into fluid connection to keep enough system cools liquid in the described system cools liquid expansion tank of the MCU that guarantees working.
21. the electronic apparatus system that is cooled off of claim 12, wherein the described heat exchanger of each MCU comprises the plate-type exchanger that integrally is arranged in the described system cools liquid expansion tank.
22. the method for a plurality of electronics subsystems of cooling, described method comprises:
At least two modularization cooling unit MCU are provided, each MCU can both provide system cools liquid, second cooling circuit that each MCU among wherein said at least two MCU comprises heat exchanger, has first cooling circuit of at least one control valve and have system cools liquid to a plurality of electronics subsystems of cooling that need;
For a selected MCU among described at least two MCU, from a source to described first cooling circuit apparatus cools liquid of cooling is provided and make wherein at least a portion through described at least one control valve by described heat exchanger;
For the described selected MCU among described at least two MCU, provide cooled system cools liquid from described second cooling circuit to described a plurality of electronics subsystems, and in described heat exchanger, will give the apparatus cools liquid of the cooling in described first cooling circuit from the heat discharge of described a plurality of electronics subsystems;
At least one control valve of wherein said selected MCU can be regulated the apparatus cools liquid of the described heat exchanger of flowing through, thereby can control the temperature of the system cools liquid that is used for cooling off described a plurality of electronics subsystems in described second cooling circuit; And
Wherein each MCU also comprises system cools liquid expansion tank, and wherein the described heat exchanger of each MCU is arranged in the system cools liquid expansion tank of this MCU.
23. the method for claim 22 comprise that also a MCU who only adopts among described at least two MCU cools off described a plurality of electronics subsystems, and other MCU among described at least two MCU is in standby mode.
24. the method for claim 22, comprise also the related connector with described at least two MCU is provided that this connector allows when another MCU work among described at least two MCU and can dismantle each MCU when described a plurality of electronics subsystems provide system cools liquid.
25. the method for claim 22, the source of the apparatus cools liquid of wherein said cooling comprises having first feed pipe that is connected with a MCU among described at least two MCU and first source of first liquid back pipe, with have second feed pipe that is connected with the 2nd MCU among described at least two MCU and second source of second liquid back pipe, and wherein said method also is included in detects the operation of automaticallying switch when leaking appears in feed pipe or liquid back pipe between a described MCU and described the 2nd MCU.
26. the method for claim 22, wherein said a plurality of electronics subsystems comprises the electronic enclosures of a plurality of formation computer floor computing environment, and wherein said method comprises that also each only MCU from described at least two MCU provides system cools liquid to cool off this computer floor computing environment.
27. the method for claim 22 comprises that also the work that monitors described at least two MCU and a MCU who is working in detecting described at least two MCU automatically switch to another MCU among described at least two MCU to guarantee to cool off continuously described a plurality of electronics subsystems when breaking down.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10/726,377 | 2003-12-03 | ||
| US10/726,377 | 2003-12-03 | ||
| US10/726,377 US7088585B2 (en) | 2003-12-03 | 2003-12-03 | Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1625328A CN1625328A (en) | 2005-06-08 |
| CN100338983C true CN100338983C (en) | 2007-09-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100780531A Expired - Fee Related CN100338983C (en) | 2003-12-03 | 2004-09-20 | Cooling system and method employing for ensuring cooling of multiple electronics subsystems |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2005191554A (en) |
| CN (1) | CN100338983C (en) |
| TW (1) | TWI289245B (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6973801B1 (en) * | 2004-12-09 | 2005-12-13 | International Business Machines Corporation | Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack |
| US7757506B2 (en) * | 2007-11-19 | 2010-07-20 | International Business Machines Corporation | System and method for facilitating cooling of a liquid-cooled electronics rack |
| US8113010B2 (en) | 2009-11-02 | 2012-02-14 | Exaflop Llc | Data center cooling |
| US8286442B2 (en) * | 2009-11-02 | 2012-10-16 | Exaflop Llc | Data center with low power usage effectiveness |
| CN101976937A (en) * | 2010-10-29 | 2011-02-16 | 长春轨道客车股份有限公司 | Cooling fluid filling process method for traction converter of motor train unit |
| US9494371B2 (en) | 2011-12-28 | 2016-11-15 | Liebert Corporation | Pumped refrigerant cooling system with 1+1 to N+1 and built-in redundancy |
| CN110160281A (en) * | 2011-12-28 | 2019-08-23 | 维谛公司 | Pump refrigerant cooling system and built-in redundancy with l+1 to N+1 |
| US9706685B2 (en) | 2011-12-28 | 2017-07-11 | Liebert Corporation | Cooling system for high density heat loads |
| US9091496B2 (en) | 2012-03-08 | 2015-07-28 | Google Inc. | Controlling data center cooling |
| IN2014DN08409A (en) * | 2012-04-25 | 2015-05-08 | Basf Se | |
| TW201424916A (en) * | 2012-12-18 | 2014-07-01 | Gin Dai Prec Technology Co Ltd | Cooling System |
| CN104582416B (en) * | 2013-10-23 | 2017-11-24 | 华为技术有限公司 | A kind of liquid-cooling system and its control method |
| JP5873155B1 (en) * | 2014-10-17 | 2016-03-01 | Ｎｅｃプラットフォームズ株式会社 | Monitoring system, monitoring apparatus and monitoring method |
| TWI783678B (en) * | 2021-04-30 | 2022-11-11 | 廣達電腦股份有限公司 | Cooling circuits for cooling a computing system and cooling system thereof |
| US11755084B2 (en) | 2021-07-20 | 2023-09-12 | Quanta Computer Inc. | Cooling circuits for cooling a computing system and flow control methods thereof |
| TWI834351B (en) * | 2022-10-24 | 2024-03-01 | 台達電子工業股份有限公司 | Cooling system |
Citations (3)
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|---|---|---|---|---|
| US3992894A (en) * | 1975-12-22 | 1976-11-23 | International Business Machines Corporation | Inter-active dual loop cooling system |
| US5226471A (en) * | 1991-09-23 | 1993-07-13 | General Electric Company | Leak isolating apparatus for liquid cooled electronic units in a coolant circulation system |
| US6182742B1 (en) * | 1996-06-21 | 2001-02-06 | Hitachi, Ltd. | Cooling apparatus for use in an electronic system |
-
2004
- 2004-09-20 CN CNB2004100780531A patent/CN100338983C/en not_active Expired - Fee Related
- 2004-11-15 TW TW93134972A patent/TWI289245B/en not_active IP Right Cessation
- 2004-11-30 JP JP2004347711A patent/JP2005191554A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3992894A (en) * | 1975-12-22 | 1976-11-23 | International Business Machines Corporation | Inter-active dual loop cooling system |
| US5226471A (en) * | 1991-09-23 | 1993-07-13 | General Electric Company | Leak isolating apparatus for liquid cooled electronic units in a coolant circulation system |
| US6182742B1 (en) * | 1996-06-21 | 2001-02-06 | Hitachi, Ltd. | Cooling apparatus for use in an electronic system |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI289245B (en) | 2007-11-01 |
| TW200528952A (en) | 2005-09-01 |
| JP2005191554A (en) | 2005-07-14 |
| CN1625328A (en) | 2005-06-08 |
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