JP2005191554A5 - - Google Patents

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Publication number
JP2005191554A5
JP2005191554A5 JP2004347711A JP2004347711A JP2005191554A5 JP 2005191554 A5 JP2005191554 A5 JP 2005191554A5 JP 2004347711 A JP2004347711 A JP 2004347711A JP 2004347711 A JP2004347711 A JP 2004347711A JP 2005191554 A5 JP2005191554 A5 JP 2005191554A5
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JP
Japan
Prior art keywords
mcu
coolant
cooling
electronic
mcus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004347711A
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English (en)
Japanese (ja)
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JP2005191554A (ja
Filing date
Publication date
Priority claimed from US10/726,377 external-priority patent/US7088585B2/en
Application filed filed Critical
Publication of JP2005191554A publication Critical patent/JP2005191554A/ja
Publication of JP2005191554A5 publication Critical patent/JP2005191554A5/ja
Pending legal-status Critical Current

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JP2004347711A 2003-12-03 2004-11-30 電子ザブシステムを液体冷却するための冷却システムと冷却方法 Pending JP2005191554A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/726,377 US7088585B2 (en) 2003-12-03 2003-12-03 Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems

Publications (2)

Publication Number Publication Date
JP2005191554A JP2005191554A (ja) 2005-07-14
JP2005191554A5 true JP2005191554A5 (enExample) 2007-04-12

Family

ID=34794602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004347711A Pending JP2005191554A (ja) 2003-12-03 2004-11-30 電子ザブシステムを液体冷却するための冷却システムと冷却方法

Country Status (3)

Country Link
JP (1) JP2005191554A (enExample)
CN (1) CN100338983C (enExample)
TW (1) TWI289245B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6973801B1 (en) * 2004-12-09 2005-12-13 International Business Machines Corporation Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack
US7757506B2 (en) * 2007-11-19 2010-07-20 International Business Machines Corporation System and method for facilitating cooling of a liquid-cooled electronics rack
US8286442B2 (en) * 2009-11-02 2012-10-16 Exaflop Llc Data center with low power usage effectiveness
US8113010B2 (en) 2009-11-02 2012-02-14 Exaflop Llc Data center cooling
CN101976937A (zh) * 2010-10-29 2011-02-16 长春轨道客车股份有限公司 动车组牵引变流器冷却液充注工艺方法
CN110160281A (zh) * 2011-12-28 2019-08-23 维谛公司 具有l+1到N+1的泵送制冷剂冷却系统和内置冗余
US9706685B2 (en) 2011-12-28 2017-07-11 Liebert Corporation Cooling system for high density heat loads
US9494371B2 (en) 2011-12-28 2016-11-15 Liebert Corporation Pumped refrigerant cooling system with 1+1 to N+1 and built-in redundancy
WO2013134023A1 (en) 2012-03-08 2013-09-12 Google Inc. Controlling data center cooling
WO2013160293A1 (de) * 2012-04-25 2013-10-31 Basf Se Verfahren zur bereitstellung eines kühlmediums in einem sekundärkreis
TW201424916A (zh) * 2012-12-18 2014-07-01 Gin Dai Prec Technology Co Ltd 冷卻系統
CN104582416B (zh) * 2013-10-23 2017-11-24 华为技术有限公司 一种液体冷却系统及其控制方法
JP5873155B1 (ja) * 2014-10-17 2016-03-01 Necプラットフォームズ株式会社 監視システムと監視装置および監視方法
TWI783678B (zh) * 2021-04-30 2022-11-11 廣達電腦股份有限公司 冷卻電腦系統之冷卻迴路及冷卻系統
US11755084B2 (en) 2021-07-20 2023-09-12 Quanta Computer Inc. Cooling circuits for cooling a computing system and flow control methods thereof
US11937401B2 (en) * 2021-06-22 2024-03-19 Baidu Usa Llc System design and operation for liquid cooling
CN117979620A (zh) 2022-10-24 2024-05-03 台达电子工业股份有限公司 冷却系统
TWI834351B (zh) * 2022-10-24 2024-03-01 台達電子工業股份有限公司 冷卻系統

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3992894A (en) * 1975-12-22 1976-11-23 International Business Machines Corporation Inter-active dual loop cooling system
US5226471A (en) * 1991-09-23 1993-07-13 General Electric Company Leak isolating apparatus for liquid cooled electronic units in a coolant circulation system
JP3329663B2 (ja) * 1996-06-21 2002-09-30 株式会社日立製作所 電子装置用冷却装置

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