CN100337311C - Vertical heat treating equipment - Google Patents
Vertical heat treating equipment Download PDFInfo
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- CN100337311C CN100337311C CNB038077485A CN03807748A CN100337311C CN 100337311 C CN100337311 C CN 100337311C CN B038077485 A CNB038077485 A CN B038077485A CN 03807748 A CN03807748 A CN 03807748A CN 100337311 C CN100337311 C CN 100337311C
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- armed lever
- lever element
- processing apparatus
- thermal processing
- load port
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
Abstract
Vertical heat treating equipment (1), comprising a shutter device (17) shielding a load port (4) when a processed substrate (W) is taken out from the load port (4) of a processing chamber (5), the shutter device (17) further comprising a port cover (18) selectively closing the load port (4) of the processing chamber (5), wherein the port cover (18) is driven by a drive part having an extension arm (19) supporting and moving the port cover (18), and the drive part linearly moves the port cover (18) through the extension arm (19) between a closing position (PB) for closing the load port (4) and a wait position (PA) on the side of the closing position (PB).
Description
Technical field
The present invention relates to be used for implement heat treated vertical thermal processing apparatus together for a plurality of processed substrates.More particularly, the present invention relates to have at processed substrate and when process chamber is removed, cover the load port of process chamber and the vertical thermal processing apparatus of the shutter device (shutter device) improved.
And this vertical thermal processing apparatus typically is assembled into semiconductor processing system and uses.Here, so-called semiconductor processes, mean: by on processed substrate such as semiconductor wafer and glass substrate, forming semiconductor layer, insulating barrier, conductive layer etc. by predetermined pattern, on this processed substrate, for the structure of making the distribution that comprises semiconductor equipment, be connected in semiconductor equipment, electrode etc. and the various processing of implementing.
Background technology
When making semiconductor equipment, for example implement processing such as membrane stack is long-pending, oxidation, diffusion, reformation, annealing, etching on the semiconductor wafer in order to give processed substrate, and use various processing unit.As this processing unit, the vertical thermal processing apparatus of a heat treatment multi-disc wafer is known for everyone.
Usually, vertical thermal processing apparatus has the sealing longitudinal type process chamber (reaction tube) of taking in wafer.Form load port in bottom of treatment chamber, it is by optionally being opened and closed by the lid of cage lifter lifting.In the process chamber, wafer keeps under with the state of piling up at certain intervals each other by the maintenance container that is called as the wafer cabin.The wafer cabin under the state that is supported on the lid, loads and unloading wafer in process chamber through load port by lift when keeping wafer.
When disposing in the wafer cabin that is supported in from the load port taking-up on the lid, a side below the process chamber is being used to cover the shutter device of load port.By shutter device, the heat of high temperature when preventing to open lid in the process chamber is from the load port escape and give the below thermal impact.
Figure 10 for the expression this in the past shutter device and process chamber (reaction tube) between the relation stereogram.As shown in figure 10, this shutter device 110 comprises the port cap 118 of the load port 104 that covers process chamber 103.Port cap 118 is installed in the front end of horizontal rotating arm 116.Turning arm 116 can horizontally rotate and move up and down by horizontal rotary mechanism 114 and the reciprocating mechanism 112 that is disposed at its base end part.
Shown in solid line among Figure 10, when load port was open, port cap 118 was moved to the position of readiness of load port 104 sides.When load port is closed, arm 116 is horizontally rotated about about 60 degree, make port cap 118 move to the below of load port 104.Then, make arm 116 further liftings, port cap 118 is abutted against on the load port 104, load port 104 is closed.
In addition, as other example of shutter device, also have (not having diagram) at the front end installation end flap of vertical turning arm.Under this occasion, vertical turning arm is done vertical rotation by the vertical rotating mechanism of its base end part.Till the vertical rotation of port cap by arm risen to and join with load port, like this, load port was closed.
In shutter device shown in Figure 10, horizontally rotate mobile terminal flap 118 by making turning arm 116.Port cap 118 is owing to having bigger weight, so in the shutter device shown in Figure 10, the Position Control during opening and closing operations port cap 118 takes more.For example, 12 inches this situations of vertical thermal processing apparatus that wafer is used, when carrying out shutoff operation, rotation turning arm 116 approximately takes 25 seconds, and lifting turning arm 116 approximately takes 2 seconds, amounts to about 27 seconds.Shutter device moves for a long time, becomes the reason that reduces output.The size of port cap 118 is along with the increase of the increase of wafer size, process chamber diameter and increase.Therefore, can think the vertical thermal processing apparatus of future generation that is used for handling larger sized wafer, the problems referred to above are particularly outstanding.
Summary of the invention
The objective of the invention is to realize shortening in the vertical thermal processing apparatus opening and closing operations time of shutter device, improve output.
From certain viewpoint of the present invention, provide a kind of and implement heat treated vertical thermal processing apparatus together for a plurality of processed substrates, it comprises:
Take in the sealing processing chamber of aforementioned processed substrate, the bottom of aforementioned processing chamber is provided with load port;
Optionally open and close the lid of the aforementioned load port of aforementioned processing chamber;
Indoor in aforementioned processing, the state that separates accumulation at certain intervals keeps the maintenance container of aforementioned processed substrate;
In aforementioned process chamber, supply with the feed system of handling gas;
Discharge the gas extraction system of aforementioned processing indoor gas;
The heating arrangements of heating aforementioned processing chamber interior environment;
In the aforementioned maintenance container support that will keep aforementioned processed substrate under the state on the aforementioned lid, the lift of the aforementioned lid of lifting; And
When the aforementioned load port of aforementioned process chamber is taken out aforementioned processed substrate, cover the shutter device of aforementioned load port,
Aforementioned shutter device comprises:
Optionally close the port cap of the aforementioned load port of aforementioned processing chamber;
Possess the drive division of the telescopic arm that moves it when supporting aforementioned port cap, aforementioned drive division makes aforementioned port cap do straight line between the position of readiness of off-position of closing aforementioned load port and aforementioned off-position side by aforementioned telescopic arm and moves.
In the aforementioned vertical thermal processing apparatus, aforementioned telescopic arm disposes base portion and supports and support a plurality of armed lever elements of aforementioned port cap for aforementioned base portion; But but aforementioned a plurality of armed lever element can comprise the 1st armed lever element for aforementioned base portion reciprocating action, for the 2nd armed lever element of described the 1st armed lever element reciprocating action.
In the aforementioned vertical thermal processing apparatus, aforementioned shutter device further disposes the box body of taking in aforementioned port cap and aforementioned telescopic arm; In aforementioned position of readiness, aforementioned telescopic arm can be accommodated in the aforementioned box body.
In the aforementioned vertical thermal processing apparatus, aforementioned shutter device further disposes the controller of the aforementioned telescopic arm action of control; The aforementioned controller of described the 2nd armed lever element can make the reciprocating action for described the 1st armed lever element, only carries out under described the 1st armed lever element is in state in the described box body.
In the aforementioned vertical thermal processing apparatus, aforementioned box body is provided with: be formed at the 1st opening on the 1st side with the aforementioned box body of aforementioned off-position subtend, be formed at the 2nd opening on the 2nd side of the aforementioned box body different with aforementioned the 1st side, aforementioned vertical thermal processing apparatus can further dispose formation and flow into and from the mechanism of aforementioned the 2nd opening effluent stream from aforementioned the 1st opening.
Description of drawings
Fig. 1 is the structure chart that diagrammatically expression relates to the vertical thermal processing apparatus of embodiment of the present invention.
Fig. 2 is for diagrammatically being illustrated in the in-built plane graph of the shutter device (shutterdevice) that uses in the device shown in Figure 1.
Fig. 3 is for diagrammatically representing the in-built front view figure of shutter device shown in Figure 2.
Fig. 4 is for diagrammatically being illustrated in the in-built side view of shutter device shown in Figure 2.
Fig. 5 A, B are under the state (receiving state) of the 1st and the 2nd armed lever element co-contraction, the plane graph of shutter device shown in Figure 2 and side view.
Fig. 5 C, D are under the 2nd armed lever element stretched condition only, the plane graph of shutter device shown in Figure 2 and side view.
Fig. 6 A, B are under the common state (stretched condition) of upholding of the 1st and the 2nd armed lever element, the plane graph of shutter device shown in Figure 2 and side view.
Fig. 6 C, D are under the 1st armed lever component shrinkage state only, the plane graph of shutter device shown in Figure 2 and side view.
Fig. 7 is the stereogram of the ventilation structure in the operating area of diagrammatically presentation graphs 1 shown device.
Fig. 8 is the sectional view of the ventilation structure in the operating area of diagrammatically presentation graphs 1 shown device.
Fig. 9 is the side view that diagrammatically expression relates to the shutter device of other execution modes of the present invention.
The stereogram of Figure 10 for concerned between shutter device and the process chamber in the expression vertical thermal processing apparatus in the past.
Embodiment
About embodiments of the present invention, be described as follows with reference to drawing.In addition, below in the explanation, about having the structure element of roughly same function and structure, then give prosign, repeat specification is only carried out when needed.
Fig. 1 is the structure chart that diagrammatically expression relates to the vertical thermal processing apparatus of embodiment of the present invention.As shown in Figure 1,1 of this vertical thermal processing apparatus exterior contour is made of shell 2.The configuration of the top of shell 2 to a plurality of processed substrates for example semiconductor wafer W implement for example longitudinal type heat-treatment furnace 3 of oxidation processes of predetermined processing.Heat-treatment furnace 3 comprise the bottom as load port 4 by the reaction tube 5 of for example quartzy system of the process chamber of the lengthwise of opening.
The load port 4 of reaction tube (process chamber) 5 is optionally open or close by lid 6 that can lifting.Lid 6 constitutes openend and the airtight load port 4 of receiving load port 4.On lid 6, be configured in the wafer cabin 9 that keeps a plurality of wafer W under the devices spaced apart stacking states.In lid 6 bottoms, be provided for making the rotating mechanism 11a of wafer cabin 9 rotations.
Around reaction tube 5, dispose heater 7.Heater 7 Be Controlled accomplish the environment in the reaction tube (process chamber) 5 is heated to for example 300～1200 ℃ of set points of temperature.To handle gas and not active gases of cleaning in order in reaction tube 5, importing, to connect the gas supply system GS that comprises a plurality of gas introduction tubes on the reaction tube 5.Also be connected with the gas extraction system ES that discharges gas in the reaction tube 5 on the reaction tube 5.
Wafer W is in reaction tube 5 when processed, under level and be spaced from each other and be maintained at wafer cabin 9 under the stacking states of compartment of terrain.Wafer cabin 9 comprise keep a plurality of heavy calibers for example diameter 300mm, the quartz system cabin main body 9a of 25～150 left and right sides wafer W for example.At the foot 9b of the bottom of cabin main body 9a formation with cabin main body 9a one.The 9b of foot be connected be disposed on the lid 6, make on the rotating shaft of wafer W by the rotating mechanism 11a of circumferencial direction rotation.On lid 6, also be provided with heating arrangements or heat-preservation cylinder (not having diagram).
In shell 2,, flatly dispose for example base 8 of SUS system for reaction tube 5 and the heater 7 that constitutes heat-treatment furnace 3 is set.Be formed with the peristome (not having diagram) that reaction tube 5 is inserted upward from the below on the base 8.The bottom of reaction tube 5 is formed with outside flange part, and this flange part is maintained on the base 8 by flange bearing portion material.In order to clean etc., reaction tube 5 can from base 8 below unload.
In the shell 2, below heat-treatment furnace 3, be provided with and be used to carry out the operating area (loading area, loading area) 10 of wafer W for the transfer in wafer cabin 9.Operating area 10 is provided with the elevating mechanism (lift) 11 (only being shown with the arm of the lift 11 that supports lid 6 among Fig. 1) that makes lid 6 liftings.Wafer cabin 9 is arrived between operating area 10 and the reaction tube 5 by lift 11 conveyances under the state that is supported in lid 6.That is, wafer cabin 9 is loaded and unloads for reaction tube 5 by lift 11.
In the front portion of shell 2, be provided with a plurality of mounting tables 13 of taking in the carrier (also claiming " box ") 12 of wafer W of mounting.Take in a plurality of for example wafers about 25 in each carrier 12.Carrier 12 constitute the hermetic type conveying container, it is provided with the lid that can set up to the front/take off.
In the time of front portion in operating area 10, mounting carrier 12, be provided with the mounting port configuration 13a that the front that makes carrier 12 is connected with operating area 10 sides.On the next door that cuts off between operating area 10 and the mounting port configuration 13a, peristome is set, and is 14 switchings of door.Set up the mechanism that is useful on the lid of installing/take off carrier 12 on the door 14.In addition, near door 14, dispose displacement mechanism (not having diagram) by the environment in the carrier 12 on the displacement of the active gases not mounting port configuration 13a.
In operating area 10, dispose the shifting apparatus 15 that carries out the wafer W transfer between carrier 12 and the wafer cabin 9.Anterior upside outside operating area 10, dispose storage up and down each 2 carrier keeping canopy 16 and from the carrying device (do not have diagram) of mounting table 13 to keeping canopy 16 or the carrier of conveyance in the other direction.
10 the top in the operating area disposes and cover the shutter device 17 of load port 4 when the load port 4 of reaction tube 5 is taken off lid 6.Shutter device 17 is used in the heat of high temperature that prevents in the reaction tube 5 gives the below from load port 4 escapes thermal impact.Therefore, shutter device 17 includes the port cap 18 of optionally opening or closing load port 4.
At position of readiness PA place, the drive division (being described in detail later) of port cap 18, arm 19 and arm 19 all is incorporated in the box body 21 that is fixed for shell 2.In operating area 10, take a breath by following mode in the box body 21.Fig. 7 and Fig. 8 are for diagrammatically representing stereogram and the sectional view for the ventilation mechanism of operating area 10 and box body 21.
With the side of the off-position PB subtend of box body 21, be formed with the front openings 52 of the size that port cap 18 and arm 19 can come in and go out.In addition, in the another side (left side among Fig. 7 and Fig. 8) of box body 21, be formed with the opening 54 of ventilation usefulness.Other parts of box body 21 are though non-tight is substantially airtight to the degree that does not produce air-flow.In addition, in the outside of box body 21, the side of operating area 10 (left side among Fig. 7 and Fig. 8) also is provided with the opening 56 of ventilation usefulness.
That is, by the air-supply effect of fan 66, pure air is supplied in the operating area 10 from filter element 68.This pure air forms air-flow FG in the operating area 10 and box body 21 inside, from being formed on the pipeline 58 that opening 54,56 on the opposite flank flows into exhausts one side.Pure air after the use of flow ipe 58 by the air-supply effect that fan 66 causes, returns filter element 68 once more, and the limit is filtered unit 68 and purifies, and the limit is recycled.
Particularly, for box body 21, a part of pure air flows in the box body 21 from the front openings 52 of box body 21, and opening 54 from the side flows into the pipeline 58 of exhaust one side.Like this, pass the front openings 52 of box body 21, form air-flow FG from the outside of box body 21 towards the inboard, in view of the above, the dust (subparticle) that (contact portion particularly slides over each other between the armed lever element of telescopic arm 19) produces in box body 21 inside can not flow out to operating area 10 1 sides.Like this, just can prevent in the shutter device 17 that moves by the aftermentioned mode by the pollution of the dust that produces the wafer W of processing operating area 10 in.
Fig. 2～4 are for diagrammatically representing shutter device 17 in-built plane graphs, front view and side view.Shown in Fig. 2～4, the supporting mechanism 20 that supports telescopic arm 19 has front support 20a and back support 20b.The front support 20a of pair of right and left is fixed in the bottom of base 8.Back support 20b is fixed on the pallet 2a of shell 2.
The the 1st and the 2nd armed lever element 24,26 is driven advance and retreat by the 1st and the 2nd cylinder 27,28.The the 1st and the 2nd cylinder 27,28 is made of so-called piston-rodless cylinder.In this piston-rodless cylinder, the piston of band magnetite is inserted in cylinder flexible pipe 27a, the 28a slidably.In addition, in the periphery of cylinder flexible pipe 27a, 28a, insert work ring portion 27b, 28b slidably with the band magnetite of piston interlock.
The 1st cylinder 27 is installed on the base portion armed lever element 22, and its work ring portion 27b is connected on the 1st armed lever element 24.The 2nd cylinder 28 is installed on the 1st armed lever element 24, and its work ring portion 28b is connected on the 2nd armed lever element 26.Below base portion armed lever element 22, the base plate 30 of the bottom that constitutes box body 21 is installed.Base plate 30 can optionally tilt downwards with telescopic arm 19.
That is, as shown in Figure 4, telescopic arm 19 is the center with the axial region of cardinal extremity one side, can be supported rotatably.Like this, the state that is horizontally disposed with that moves between off-position PB and the position of readiness PA and be used for the operator near and between the maintenance state PC that tilts downwards, telescopic arm 19 can switch.More particularly, the base end part of base portion armed lever element 22 can be supported on vertical rotation ground by fulcrum 31 by back support 20b.Support on the 20a, the pull bar of making by connecting rod 32 is connecting base plate 30.By pull bar 32, arm 19 relies on base plate 30 can remain on the maintenance state PC of inclination downwards.
In order to protect water conduction hose 35 not to be subjected to from the influence of port device 4 liberated heats, front end one side of aqueduct 34 is provided with front end housing 36.In a side of the 1st armed lever element 24, be provided with the middle cover 37 of cross section " コ " word shape of allowing front end housing 36 and moving.In order loosely not guide flexible hose, dispose flexible pipe bearing 38 to the 2nd cylinder 28 supply gas.
During opening and closing operations shutter device 17, the action of telescopic arm 19 is by the controller Be Controlled by sequential control for example.Controller is controlled the reciprocating action of the 2nd armed lever element 26 for the 1st armed lever element 24, only carries out under the 1st armed lever element 24 is in state in the box body 21.Like this, just become the structure that the dust that is produced by the slip of arm 19 can not flow out to 10 inside, operating area.
Specifically, make port cap 18 when moving to off-position PB (closing mobile), at first, shown in Fig. 5 A, B, C, D, the 2nd armed lever element 26 be advanced, then, shown in Fig. 6 A, B, the 1st armed lever element 24 is advanced from position of readiness PA (in the box body 21).On the other hand, when making port cap 18 move (open moving) to position of readiness PA (in the box body 21), at first, shown in Fig. 6 A, B, C, D, the 1st armed lever element 24 is retreated, then, shown in Fig. 5 A, B, the 2nd armed lever element 26 is retreated from off-position PB.
Sliding through in box body 21 when telescopic arm 19 stretches carried out, and the dust that produces because of sliding is discharged by the air-flows in the shell 21.So, can prevent that dust from flowing out to operating area 10.
The telescopic location (stroke end) of the 1st armed lever element 24 of arm 19 and the 2nd armed lever element 26 be not subject in the box body 21 of the thermal impact of load port 4, and by the least possible sensor sensing of quantity.Therefore, on the base portion armed lever element 22, with specified configuration 3 transducers, for example limit switch 38a, 38b, 38c are installed at its length direction.
For these limit switches of opening/closing 38a～38c successively, injector 39 is slidably mounted on the base portion armed lever element 22 by guide rail 40.On the injector 39, cradle portion 39a, 39b are arranged in the position configuration of separate front and back.On the 1st and the 2nd armed lever element 24,26, dispose and hang over hook stick 41a, the 41b that is used to operate injector 39 on cradle portion 39a, the 39b, outstanding from sidepiece respectively.
For example, if it is mobile that port cap 18 is closed to off-position PB from position of readiness PA (in the box body 21), limit switch 38a～38c does following action so.At first, shown in Fig. 5 A, B, the state from arm 19 is shunk for the 1st armed lever element 24, advances the 2nd armed lever element 26.Like this, shown in Fig. 5 C, D, the hook stick 41b of the 2nd armed lever element 26 tangles the cradle portion 39a of injector 39 front sides, makes injector 39 move to middle limit switch 38b place.Therefore, limit switch 38b opens, and detects the 2nd armed lever element 26 and has upheld.
Then, for base portion armed lever element 22, the 1st armed lever element 24 is advanced.Like this, shown in Fig. 6 A, B, the hook stick 41b of the 2nd armed lever element 26 tangles the cradle portion 39a of injector 39 front sides, makes cradle portion 39 move to the position of anterior limit switch 38c.Therefore, limit switch 38c opens, and detects the 1st armed lever element 24 and has upheld, and promptly port cap 18 is come off-position PB.
On the other hand, move to position of readiness PA (in the box body 21) if port cap 18 is opened from off-position PB, limit switch 38a～38c carries out following action so.At first, shown in Fig. 6 A, B,, the 1st armed lever element 24 is retreated for base portion armed lever element 22 from arm 19 stretched conditions.Like this, shown in Fig. 6 C, D, the hook stick 41a of the 1st armed lever element 24 tangles the cradle portion 39b of injector 39 rear sides, makes cradle portion 39 move to middle limit switch 38b place.Therefore, limit switch 38b opens, and detects and knows that the 1st armed lever element 24 has shunk.
Then, the 2nd armed lever element 26 is retreated for the 1st armed lever element 24.Like this, shown in Fig. 5 A, B, the hook stick 41b of the 2nd armed lever element 26 tangles the cradle portion 39b of injector 39 rear sides, and cradle portion 39 is moved to till the position of middle limit switch 38a.Therefore, limit switch 38a opens, and detects the 2nd armed lever element 26 and has shunk, and promptly port cap 18 is come position of readiness PA.
Next, the action step of the shutter device 17 that is formed by above-mentioned structure is described.Usually, shutter device 17 is in the state of moving into/take out of operation that carries out wafer cabin 9 in the heat treated stove 3 that do not hinder.That is, telescopic arm 19 is contracted to port cap 18 and is in position of readiness PA, in port cap 18 is taken in box body 21.
When lid 6 being opened downwards by lift (elevating mechanism) 11, promptly after the heat treatment when wafer cabin 9 is taken out of in operating area 10, shutter device 17 is upheld arm 19, makes port cap 18 move to off-position PB, covers load port 4 by port cap 18.Like this, just can suppress and even prevent to emit heat of high temperature in the stove to operating area 10 from load port 4.
When carrying out the upkeep operation of shutter device 17, answer horizontal keeping arm 19, the screw that base plate 30 is fixed on the front support 20a unclamps.Then, be fulcrum rotating shuttle device 17 downwards with base portion fulcrum 31, by pull bar 32 be pulled low to remain to heeling condition till.In this case, arm 19 is shunk, but also can be as shown in Figure 4, it is tilted making below tiltedly.
If shutter device 17 is tilted to oblique below, above shutter device 17, use the space so with regard to having formed spacious upkeep operation.Therefore, can carry out the maintenance of shutter device 17 easily, for example the upkeep operation of port cap 18 and telescopic arm 19.
Open and close the port cap 18 of the load port 4 of reaction tube 5 in the shutter device 17, between the position of readiness PA of off-position PB and side, do straight line by telescopic arm 19 and move.Therefore, the control that stops during driving just becomes easily, can shorten the opening and closing operations time of shutter device 17.Promptly, owing to heavy port cap 18 is moved with rectilinear motion, so and move the situation that heavy port cap 18 is moved and compare to rotate, can port cap 18 be moved with the short period (for example closing motion or opening operation approximately take 10 seconds) and in little spatial dimension.Like this, can realize the lifting and the saving space of the output of vertical thermal processing apparatus 1.
During opening and closing operations shutter device 17, controller is controlled, and makes the reciprocating action of the 2nd armed lever element 26 for the 1st armed lever element 24, only carries out under the 1st armed lever element 24 is in state in the box body 21.That is, port cap 18 is closed when moving to off-position PB from position of readiness PA, the 2nd armed lever element 26 is advanced after, the 1st armed lever element 24 is advanced.When making port cap 18 move to position of readiness PA from off-position PB is open, the 1st armed lever element 24 is retreated after, the 2nd armed lever element 26 is retreated.Like this, just accomplished not flow out in the operating area 10 by the dust that the slip of arm 19 produces.
In addition, by the front openings 52 of box body 21, form from the air-flow of the lateral flows inside of box body 21.Therefore, dust can not flow out to operating area 10 1 sides in box body 21.Like this, can prevent in the shutter device 17 because the wafer W of handling in the dust pollution operating area 10 that produces.
Fig. 9 is the side view that diagrammatically expression relates to the shutter device of other execution modes of the present invention.This shutter device 17X is included in off-position PB rises with the pressing mechanism 42 of sealing load port 4 port cap 18.Pressing mechanism 42 is configured to make the port cap 18 and the integral body of telescopic arm 19 to move at above-below direction.And even present embodiment, telescopic arm 19 also makes port cap 18 do straight line and moves, and carries out opening and closing operations.
In the bottom of base 8, the pair of right and left that clips telescopic arm 19 settings supports on 20, and the movable frame 43 that can move up and down is installed.Movable frame 43 drives by the cylinder 42a of pressing mechanism 42.The rear end side of the base portion armed lever element 22 of telescopic arm 19 can vertically be supported by fulcrum 44 rotatably by movable frame 43.For movable frame 43, the front of base portion armed lever element 22 is connected by screw (not having diagram), can set up/take off.
Like this, can obtain the action effect same by shutter device 17X shown in Figure 9 with shutter device shown in Figure 4 17.And, because shutter device 17X is provided with the pressing mechanism 42 that telescopic arm 19 is moved at above-below direction, so can lifting port cap 18 be attempted by on the load port 4.Therefore,, can accomplish fully to prevent, simultaneously, make to be in decompression state in the stove from load port 4 liberated heats by with port cap 18 sealing load port 4.
The vertical thermal processing apparatus that relates to above-mentioned execution mode is to be suitable for example of the present invention, and the present invention also can similarly be applicable to the vertical thermal processing apparatus of other types.In addition, in the above-mentioned execution mode,, be that example is illustrated with the semiconductor wafer as processed substrate, still not limited thereto, also the present invention can be applicable to aspects such as glass substrate, LCD substrate.
Claims (15)
1. vertical thermal processing apparatus is used for implementing together for a plurality of processed substrates heat treated, it is characterized in that, comprising:
Take in the process chamber of the sealing of described processed substrate, described bottom of treatment chamber has load port;
Optionally open and close the lid of the described load port of described process chamber;
In described process chamber, the state of piling up separatedly with mutual certain intervals keeps the maintenance container of described processed substrate;
In described process chamber, supply with the feed system of handling gas;
Discharge the gas extraction system of described processing indoor gas;
Heat the heating arrangements of described inner treatment chamber environment;
In the described maintenance container support that will keep described processed substrate under the state on the described lid, the lift of the described lid of lifting; And
When the described load port of described process chamber is taken out described processed substrate, cover the shutter device of described load port, described shutter device comprises:
Optionally close the port cap of the described load port of described process chamber; With
The drive division that possesses the telescopic arm that moves it when supporting described port cap, described drive division makes described port cap do straight line between the position of readiness of off-position of closing described load port and described off-position side by described telescopic arm and moves, wherein
Described telescopic arm possesses a plurality of armed lever elements that base portion arranged and support and support described port cap for described base portion, but but described a plurality of armed lever element comprises for the 1st armed lever element of described base portion reciprocating action with for the 2nd armed lever element of described the 1st armed lever element reciprocating action
Described shutter device further possesses the box body of taking in described port cap and described telescopic arm is arranged; Described position of readiness is configured in the described box body.
2. vertical thermal processing apparatus according to claim 1 is characterized in that: described the 1st armed lever element possesses linear guide rail, and described the 2nd armed lever element slides on the described linear guide rail of described the 1st armed lever element.
3. vertical thermal processing apparatus according to claim 2 is characterized in that: described base portion possesses linear guide rail is arranged, and described the 1st armed lever element slides on the described linear guide rail of described base portion.
4. root institute is according to the described vertical thermal processing apparatus of claim 1, it is characterized in that: described telescopic arm is that the center is rotatably being supported with the axial region of base end part, can switch between state that is provided with that moves between described off-position and the position of readiness and the maintenance state that tilts downwards.
5. vertical thermal processing apparatus according to claim 1 is characterized in that: described shutter device further possesses the pressing mechanism that makes the affiliated load port of described port cap sealing is arranged.
6. vertical thermal processing apparatus according to claim 5 is characterized in that: described pressing mechanism rises overally described telescopic arm.
7. vertical thermal processing apparatus according to claim 1 is characterized in that: described shutter device further possesses coolant path that forms in described port cap and the feed system of supplying with refrigerant in described coolant path is arranged.
8. vertical thermal processing apparatus according to claim 1 is characterized in that: described shutter device further possesses the controller that the described telescopic arm action of control is arranged; Described controller makes described the 2nd armed lever element only carry out under described the 1st armed lever element is in state in the described box body for the reciprocating action of described the 1st armed lever element.
9. vertical thermal processing apparatus according to claim 1 is characterized in that: described shutter device further possesses the controller that the described telescopic arm action of control is arranged; Described controller make described port cap from described position of readiness when described off-position moves, after described the 2nd armed lever element is advanced, described the 1st armed lever element is advanced, make described port cap from described off-position when described position of readiness moves, after described the 1st armed lever element is retreated, described the 2nd armed lever element is retreated.
10. vertical thermal processing apparatus according to claim 1, it is characterized in that described box body possesses and has: be formed at the 1st opening on the 1st side with the affiliated box body of described off-position subtend, be formed at the 2nd opening on the 2nd side of the affiliated box body different with described the 1st side; Described device further possesses has formation to flow into and from the mechanism of described the 2nd opening effluent stream from described the 1st opening.
11. vertical thermal processing apparatus according to claim 10 is characterized in that, described the 2nd opening is connected with gas attraction portion by pipeline.
12. a vertical thermal processing apparatus is used for implementing together for a plurality of processed substrates heat treated, it is characterized in that, comprising:
Take in the process chamber of the sealing of described processed substrate, described bottom of treatment chamber has load port;
Optionally open and close the lid of the described load port of described process chamber;
In described process chamber, the state of piling up separatedly with mutual certain intervals keeps the maintenance container of described processed substrate;
In described process chamber, supply with the feed system of handling gas;
Discharge the gas extraction system of described processing indoor gas;
Heat the heating arrangements of described inner treatment chamber environment;
In the described maintenance container support that will keep described processed substrate under the state on the described lid, the lift of the described lid of lifting; And
When the described load port of described process chamber is taken out described processed substrate, cover the shutter device of described load port, described shutter device comprises:
Optionally close the port cap of the described load port of described process chamber; With
The drive division that possesses the telescopic arm that moves it when supporting described port cap, described drive division makes described port cap do straight line between the position of readiness of off-position of closing described load port and described off-position side by described telescopic arm and moves, wherein
Described telescopic arm is that the center is rotatably being supported with the axial region of base end part, can switch between state that is provided with that moves between described off-position and the position of readiness and the maintenance state that tilts downwards.
13. vertical thermal processing apparatus according to claim 12, it is characterized in that, described telescopic arm possesses and base portion is arranged and for described base portion supports and support a plurality of armed lever elements of described port cap, but but described a plurality of armed lever element comprise for the 1st armed lever element of described base portion reciprocating action with for the 2nd armed lever element of described the 1st armed lever element reciprocating action.
14. vertical thermal processing apparatus according to claim 13 is characterized in that: described the 1st armed lever element possesses linear guide rail, and described the 2nd armed lever element slides on the described linear guide rail of described the 1st armed lever element.
15. vertical thermal processing apparatus according to claim 13 is characterized in that: described base portion possesses linear guide rail is arranged, and described the 1st armed lever element slides on the described linear guide rail of described base portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002103316A JP4421806B2 (en) | 2002-04-05 | 2002-04-05 | Vertical heat treatment apparatus, shutter mechanism thereof, and operation method thereof |
| JP103316/2002 | 2002-04-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1647253A CN1647253A (en) | 2005-07-27 |
| CN100337311C true CN100337311C (en) | 2007-09-12 |
Family
ID=28786297
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB038077485A Expired - Fee Related CN100337311C (en) | 2002-04-05 | 2003-03-20 | Vertical heat treating equipment |
| CNU032446241U Expired - Fee Related CN2694474Y (en) | 2002-04-05 | 2003-04-04 | Longitudinal type thermal treatment facility |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU032446241U Expired - Fee Related CN2694474Y (en) | 2002-04-05 | 2003-04-04 | Longitudinal type thermal treatment facility |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4421806B2 (en) |
| KR (1) | KR100670869B1 (en) |
| CN (2) | CN100337311C (en) |
| TW (1) | TWI276178B (en) |
| WO (1) | WO2003085712A1 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100356505C (en) * | 2003-12-26 | 2007-12-19 | 清华大学 | Fast semiconductor heat-treating facility with vertical heat treating chamber |
| KR100971755B1 (en) * | 2008-05-30 | 2010-07-22 | 주식회사 테라세미콘 | Furnace |
| JP5131094B2 (en) * | 2008-08-29 | 2013-01-30 | 東京エレクトロン株式会社 | Heat treatment apparatus, heat treatment method, and storage medium |
| JP5042950B2 (en) * | 2008-09-05 | 2012-10-03 | 東京エレクトロン株式会社 | Vertical heat treatment apparatus and substrate support |
| JP5134495B2 (en) | 2008-10-16 | 2013-01-30 | 東京エレクトロン株式会社 | Processing apparatus and processing method |
| CN102889791B (en) * | 2012-09-27 | 2014-11-19 | 北京七星华创电子股份有限公司 | Furnace exhaust control device |
| JP6185863B2 (en) * | 2013-04-24 | 2017-08-23 | 日本碍子株式会社 | Heat treatment method and heat treatment apparatus |
| JP6258726B2 (en) * | 2014-03-04 | 2018-01-10 | 東京エレクトロン株式会社 | Vertical heat treatment equipment |
| WO2020059427A1 (en) * | 2018-09-19 | 2020-03-26 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | Substrate processing device, lid opening and closing mechanism, manufacturing method for semiconductor device, and fluid pressure drive system |
| CN114061316B (en) * | 2021-11-15 | 2024-03-26 | 北京北方华创微电子装备有限公司 | Vertical heat treatment equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04157162A (en) * | 1990-10-22 | 1992-05-29 | Shinko Electric Co Ltd | Surface treating device |
-
2002
- 2002-04-05 JP JP2002103316A patent/JP4421806B2/en not_active Expired - Fee Related
-
2003
- 2003-03-20 WO PCT/JP2003/003476 patent/WO2003085712A1/en active Application Filing
- 2003-03-20 KR KR1020047009948A patent/KR100670869B1/en active IP Right Grant
- 2003-03-20 CN CNB038077485A patent/CN100337311C/en not_active Expired - Fee Related
- 2003-04-03 TW TW092107640A patent/TWI276178B/en not_active IP Right Cessation
- 2003-04-04 CN CNU032446241U patent/CN2694474Y/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04157162A (en) * | 1990-10-22 | 1992-05-29 | Shinko Electric Co Ltd | Surface treating device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100670869B1 (en) | 2007-01-19 |
| WO2003085712A1 (en) | 2003-10-16 |
| TWI276178B (en) | 2007-03-11 |
| JP2003297769A (en) | 2003-10-17 |
| CN2694474Y (en) | 2005-04-20 |
| JP4421806B2 (en) | 2010-02-24 |
| TW200400566A (en) | 2004-01-01 |
| CN1647253A (en) | 2005-07-27 |
| KR20040094400A (en) | 2004-11-09 |
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