CN100336634C - 输送系统的输送位置对准方法 - Google Patents

输送系统的输送位置对准方法 Download PDF

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Publication number
CN100336634C
CN100336634C CNB2003801044416A CN200380104441A CN100336634C CN 100336634 C CN100336634 C CN 100336634C CN B2003801044416 A CNB2003801044416 A CN B2003801044416A CN 200380104441 A CN200380104441 A CN 200380104441A CN 100336634 C CN100336634 C CN 100336634C
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China
Prior art keywords
pick
transport
conveying
position coordinates
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Expired - Fee Related
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CNB2003801044416A
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English (en)
Chinese (zh)
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CN1717302A (zh
Inventor
熊谷元宏
近藤圭祐
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN1717302A publication Critical patent/CN1717302A/zh
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Publication of CN100336634C publication Critical patent/CN100336634C/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CNB2003801044416A 2002-11-27 2003-11-27 输送系统的输送位置对准方法 Expired - Fee Related CN100336634C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002344693A JP4239572B2 (ja) 2002-11-27 2002-11-27 搬送システムの搬送位置合わせ方法及び処理システム
JP344693/2002 2002-11-27

Publications (2)

Publication Number Publication Date
CN1717302A CN1717302A (zh) 2006-01-04
CN100336634C true CN100336634C (zh) 2007-09-12

Family

ID=32375962

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2003801044416A Expired - Fee Related CN100336634C (zh) 2002-11-27 2003-11-27 输送系统的输送位置对准方法

Country Status (5)

Country Link
US (1) US7129147B2 (https=)
JP (1) JP4239572B2 (https=)
KR (1) KR100641430B1 (https=)
CN (1) CN100336634C (https=)
WO (1) WO2004048048A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115335978A (zh) * 2020-03-17 2022-11-11 应用材料公司 电子处理系统的校准

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JP2005262367A (ja) * 2004-03-18 2005-09-29 Tokyo Electron Ltd 搬送ロボットの搬送ズレ確認方法及び処理装置
TWD107385S1 (zh) * 2004-07-20 2005-11-01 東京威力科創股份有限公司 晶圓搬運機
JP4468159B2 (ja) * 2004-12-24 2010-05-26 東京エレクトロン株式会社 基板処理装置及びその搬送位置合わせ方法
US7361920B2 (en) 2004-12-24 2008-04-22 Tokyo Electron Limited Substrate processing apparatus and transfer positioning method thereof
JP4841183B2 (ja) * 2005-06-28 2011-12-21 東京エレクトロン株式会社 基板処理装置，搬送装置，搬送装置の制御方法
JP4925650B2 (ja) * 2005-11-28 2012-05-09 東京エレクトロン株式会社 基板処理装置
JP2007251090A (ja) * 2006-03-20 2007-09-27 Tokyo Electron Ltd 真空処理装置の搬送位置合わせ方法、真空処理装置及びコンピュータ記憶媒体
US20070259457A1 (en) * 2006-05-04 2007-11-08 Texas Instruments Optical endpoint detection of planarization
JP5030542B2 (ja) * 2006-11-10 2012-09-19 株式会社日立ハイテクノロジーズ 真空処理装置
JP2008173744A (ja) * 2007-01-22 2008-07-31 Tokyo Electron Ltd 搬送システムの搬送位置合わせ方法
JP4616873B2 (ja) * 2007-09-28 2011-01-19 東京エレクトロン株式会社 半導体製造装置、基板保持方法及びプログラム
US8185242B2 (en) * 2008-05-07 2012-05-22 Lam Research Corporation Dynamic alignment of wafers using compensation values obtained through a series of wafer movements
USD642352S1 (en) * 2010-09-28 2011-07-26 Hon Hai Precision Industry Co., Ltd. Robot
JP5675416B2 (ja) * 2011-02-17 2015-02-25 東京エレクトロン株式会社 被処理体の搬送方法及び被処理体処理装置
JP2013045817A (ja) * 2011-08-23 2013-03-04 Hitachi High-Technologies Corp 真空処理装置および真空処理方法
JP5854741B2 (ja) * 2011-10-04 2016-02-09 株式会社アルバック 基板処理装置
JP6094148B2 (ja) 2012-10-29 2017-03-15 東京エレクトロン株式会社 基板処理装置
TWD163955S (zh) * 2013-04-03 2014-11-01 鴻海精密工業股份有限公司 機器人之部分
JP6422695B2 (ja) 2014-07-18 2018-11-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN106449466A (zh) * 2015-08-11 2017-02-22 中微半导体设备(上海)有限公司 一种基片处理系统
US10707107B2 (en) 2015-12-16 2020-07-07 Kla-Tencor Corporation Adaptive alignment methods and systems
JP6779636B2 (ja) * 2016-03-11 2020-11-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6298109B2 (ja) * 2016-07-08 2018-03-20 キヤノントッキ株式会社 基板処理装置及びアライメント方法
JP7097691B2 (ja) * 2017-12-06 2022-07-08 東京エレクトロン株式会社 ティーチング方法
JP7246256B2 (ja) * 2019-05-29 2023-03-27 東京エレクトロン株式会社 搬送方法及び搬送システム
US11823937B2 (en) * 2019-08-19 2023-11-21 Applied Materials, Inc. Calibration of an aligner station of a processing system
KR102812685B1 (ko) 2019-10-03 2025-05-27 가부시키가이샤 니데크 안경 렌즈 주연 가공 시스템 및 기록 매체
JP7367439B2 (ja) * 2019-10-03 2023-10-24 株式会社ニデック 眼鏡レンズ周縁加工システムおよび眼鏡レンズ周縁加工プログラム
JP7771621B2 (ja) * 2021-10-19 2025-11-18 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法

Citations (7)

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US5661090A (en) * 1995-06-30 1997-08-26 Sumitomo Metal (Smi) Electronics Devices, Inc. Process and apparatus for manufacturing ceramic semiconductor packages
JPH11207668A (ja) * 1998-01-20 1999-08-03 Sankyo Seiki Mfg Co Ltd ロボットのティーチング方法
JP2000127069A (ja) * 1998-10-27 2000-05-09 Tokyo Electron Ltd 搬送システムの搬送位置合わせ方法
JP2000208589A (ja) * 1998-11-09 2000-07-28 Tokyo Electron Ltd 処理装置
US6259525B1 (en) * 1998-09-01 2001-07-10 Micron Technology, Inc. Semiconductor wafer alignment tools
JP2001202123A (ja) * 2000-01-18 2001-07-27 Sony Corp 搬送ロボットの教示方法
US6432744B1 (en) * 1997-11-20 2002-08-13 Texas Instruments Incorporated Wafer-scale assembly of chip-size packages

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US5274434A (en) * 1990-04-02 1993-12-28 Hitachi, Ltd. Method and apparatus for inspecting foreign particles on real time basis in semiconductor mass production line
US6730541B2 (en) * 1997-11-20 2004-05-04 Texas Instruments Incorporated Wafer-scale assembly of chip-size packages
JP4576694B2 (ja) 2000-10-11 2010-11-10 東京エレクトロン株式会社 被処理体の処理システムの搬送位置合わせ方法及び被処理体の処理システム
US6716723B2 (en) * 2002-06-05 2004-04-06 Intel Corporation Wafer cutting using laser marking

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5661090A (en) * 1995-06-30 1997-08-26 Sumitomo Metal (Smi) Electronics Devices, Inc. Process and apparatus for manufacturing ceramic semiconductor packages
US6432744B1 (en) * 1997-11-20 2002-08-13 Texas Instruments Incorporated Wafer-scale assembly of chip-size packages
JPH11207668A (ja) * 1998-01-20 1999-08-03 Sankyo Seiki Mfg Co Ltd ロボットのティーチング方法
US6259525B1 (en) * 1998-09-01 2001-07-10 Micron Technology, Inc. Semiconductor wafer alignment tools
JP2000127069A (ja) * 1998-10-27 2000-05-09 Tokyo Electron Ltd 搬送システムの搬送位置合わせ方法
JP2000208589A (ja) * 1998-11-09 2000-07-28 Tokyo Electron Ltd 処理装置
JP2001202123A (ja) * 2000-01-18 2001-07-27 Sony Corp 搬送ロボットの教示方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115335978A (zh) * 2020-03-17 2022-11-11 应用材料公司 电子处理系统的校准
TWI857220B (zh) * 2020-03-17 2024-10-01 美商應用材料股份有限公司 電子處理系統的校準用於校準電子處理系統之方法、用於電子處理系統之校準物件以及電子處理系統

Also Published As

Publication number Publication date
JP2004174669A (ja) 2004-06-24
JP4239572B2 (ja) 2009-03-18
KR100641430B1 (ko) 2006-11-01
KR20050086778A (ko) 2005-08-30
US20050255609A1 (en) 2005-11-17
WO2004048048A1 (ja) 2004-06-10
US7129147B2 (en) 2006-10-31
CN1717302A (zh) 2006-01-04

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Granted publication date: 20070912

Termination date: 20211127