CH659484A5 - Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung. - Google Patents

Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung. Download PDF

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Publication number
CH659484A5
CH659484A5 CH1970/84A CH197084A CH659484A5 CH 659484 A5 CH659484 A5 CH 659484A5 CH 1970/84 A CH1970/84 A CH 1970/84A CH 197084 A CH197084 A CH 197084A CH 659484 A5 CH659484 A5 CH 659484A5
Authority
CH
Switzerland
Prior art keywords
cathode
atomization
arrangement according
shaped
substrate
Prior art date
Application number
CH1970/84A
Other languages
German (de)
English (en)
Inventor
Urs Wegmann
Eduard Dr Dipl-Ing Rille
Original Assignee
Balzers Hochvakuum
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Balzers Hochvakuum filed Critical Balzers Hochvakuum
Priority to CH1970/84A priority Critical patent/CH659484A5/de
Priority to DE19853506227 priority patent/DE3506227A1/de
Priority to GB08508897A priority patent/GB2157715B/en
Priority to FR8505777A priority patent/FR2563239B1/fr
Priority to US06/725,016 priority patent/US4622121A/en
Priority to JP60084356A priority patent/JPS60234970A/ja
Publication of CH659484A5 publication Critical patent/CH659484A5/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
CH1970/84A 1984-04-19 1984-04-19 Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung. CH659484A5 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CH1970/84A CH659484A5 (de) 1984-04-19 1984-04-19 Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung.
DE19853506227 DE3506227A1 (de) 1984-04-19 1985-02-22 Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung
GB08508897A GB2157715B (en) 1984-04-19 1985-04-04 Apparatus for cathodic sputtering
FR8505777A FR2563239B1 (fr) 1984-04-19 1985-04-17 Agencement pour revetir des substrats par pulverisation cathodique
US06/725,016 US4622121A (en) 1984-04-19 1985-04-18 Apparatus for coating materials by cathode sputtering
JP60084356A JPS60234970A (ja) 1984-04-19 1985-04-19 カソードスパツタによる基板被覆装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1970/84A CH659484A5 (de) 1984-04-19 1984-04-19 Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung.

Publications (1)

Publication Number Publication Date
CH659484A5 true CH659484A5 (de) 1987-01-30

Family

ID=4222870

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1970/84A CH659484A5 (de) 1984-04-19 1984-04-19 Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung.

Country Status (6)

Country Link
US (1) US4622121A (en:Method)
JP (1) JPS60234970A (en:Method)
CH (1) CH659484A5 (en:Method)
DE (1) DE3506227A1 (en:Method)
FR (1) FR2563239B1 (en:Method)
GB (1) GB2157715B (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0981150A3 (de) * 1998-08-14 2004-12-01 Leybold Systems GmbH Vorrichtung zum Beschichten von Substraten mit dünnen Schichten

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US4842703A (en) * 1988-02-23 1989-06-27 Eaton Corporation Magnetron cathode and method for sputter coating
DE3844064A1 (de) * 1988-12-28 1990-07-05 Leybold Ag Katodenzerstaeubungsvorrichtung nach dem magnetron-prinzip mit einer hohlkatode und einem zylindrischen target
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US4957605A (en) * 1989-04-17 1990-09-18 Materials Research Corporation Method and apparatus for sputter coating stepped wafers
US6024843A (en) * 1989-05-22 2000-02-15 Novellus Systems, Inc. Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile
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US5437778A (en) * 1990-07-10 1995-08-01 Telic Technologies Corporation Slotted cylindrical hollow cathode/magnetron sputtering device
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DE4022708A1 (de) * 1990-07-17 1992-04-02 Balzers Hochvakuum Aetz- oder beschichtungsanlagen
DE4042417C2 (de) * 1990-07-17 1993-11-25 Balzers Hochvakuum Ätz- oder Beschichtungsanlage sowie Verfahren zu ihrem Zünden oder intermittierenden Betreiben
US5174875A (en) * 1990-08-29 1992-12-29 Materials Research Corporation Method of enhancing the performance of a magnetron sputtering target
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US5228963A (en) * 1991-07-01 1993-07-20 Himont Incorporated Hollow-cathode magnetron and method of making thin films
JPH059735A (ja) * 1991-07-09 1993-01-19 Kobe Steel Ltd ダイヤモンドの気相合成方法
DE4123274C2 (de) * 1991-07-13 1996-12-19 Leybold Ag Vorrichtung zum Beschichten von Bauteilen bzw. Formteilen durch Kathodenzerstäubung
US5194131A (en) * 1991-08-16 1993-03-16 Varian Associates, Inc. Apparatus and method for multiple ring sputtering from a single target
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US6235170B1 (en) * 1998-06-10 2001-05-22 David A. Glocker Conical sputtering target
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US6231725B1 (en) * 1998-08-04 2001-05-15 Applied Materials, Inc. Apparatus for sputtering material onto a workpiece with the aid of a plasma
US6238528B1 (en) 1998-10-13 2001-05-29 Applied Materials, Inc. Plasma density modulator for improved plasma density uniformity and thickness uniformity in an ionized metal plasma source
US6193854B1 (en) * 1999-01-05 2001-02-27 Novellus Systems, Inc. Apparatus and method for controlling erosion profile in hollow cathode magnetron sputter source
US6497796B1 (en) 1999-01-05 2002-12-24 Novellus Systems, Inc. Apparatus and method for controlling plasma uniformity across a substrate
US6179973B1 (en) * 1999-01-05 2001-01-30 Novellus Systems, Inc. Apparatus and method for controlling plasma uniformity across a substrate
GB2346155B (en) * 1999-01-06 2003-06-25 Trikon Holdings Ltd Sputtering apparatus
JP2000226655A (ja) * 1999-02-02 2000-08-15 Matsushita Electric Ind Co Ltd スパッタリング装置
US6620298B1 (en) * 1999-04-23 2003-09-16 Matsushita Electric Industrial Co., Ltd. Magnetron sputtering method and apparatus
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US6444100B1 (en) 2000-02-11 2002-09-03 Seagate Technology Llc Hollow cathode sputter source
US6605195B2 (en) 2000-04-14 2003-08-12 Seagate Technology Llc Multi-layer deposition process using four ring sputter sources
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0981150A3 (de) * 1998-08-14 2004-12-01 Leybold Systems GmbH Vorrichtung zum Beschichten von Substraten mit dünnen Schichten

Also Published As

Publication number Publication date
JPS60234970A (ja) 1985-11-21
FR2563239B1 (fr) 1987-11-06
DE3506227A1 (de) 1985-10-31
GB8508897D0 (en) 1985-05-09
JPH0352534B2 (en:Method) 1991-08-12
GB2157715B (en) 1987-10-07
GB2157715A (en) 1985-10-30
FR2563239A1 (fr) 1985-10-25
US4622121A (en) 1986-11-11

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