FR2563239B1 - Agencement pour revetir des substrats par pulverisation cathodique - Google Patents

Agencement pour revetir des substrats par pulverisation cathodique

Info

Publication number
FR2563239B1
FR2563239B1 FR8505777A FR8505777A FR2563239B1 FR 2563239 B1 FR2563239 B1 FR 2563239B1 FR 8505777 A FR8505777 A FR 8505777A FR 8505777 A FR8505777 A FR 8505777A FR 2563239 B1 FR2563239 B1 FR 2563239B1
Authority
FR
France
Prior art keywords
arrangement
coating substrates
cathode spraying
cathode
spraying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8505777A
Other languages
English (en)
Other versions
FR2563239A1 (fr
Inventor
Urs Wegmann
Eduard Rille
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OC Oerlikon Balzers AG
Original Assignee
Balzers AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Balzers AG filed Critical Balzers AG
Publication of FR2563239A1 publication Critical patent/FR2563239A1/fr
Application granted granted Critical
Publication of FR2563239B1 publication Critical patent/FR2563239B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
FR8505777A 1984-04-19 1985-04-17 Agencement pour revetir des substrats par pulverisation cathodique Expired FR2563239B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1970/84A CH659484A5 (de) 1984-04-19 1984-04-19 Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung.

Publications (2)

Publication Number Publication Date
FR2563239A1 FR2563239A1 (fr) 1985-10-25
FR2563239B1 true FR2563239B1 (fr) 1987-11-06

Family

ID=4222870

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8505777A Expired FR2563239B1 (fr) 1984-04-19 1985-04-17 Agencement pour revetir des substrats par pulverisation cathodique

Country Status (6)

Country Link
US (1) US4622121A (fr)
JP (1) JPS60234970A (fr)
CH (1) CH659484A5 (fr)
DE (1) DE3506227A1 (fr)
FR (1) FR2563239B1 (fr)
GB (1) GB2157715B (fr)

Families Citing this family (87)

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JPS6277460A (ja) * 1985-09-30 1987-04-09 Tokuda Seisakusho Ltd 放電電極
DE3619194A1 (de) * 1986-06-06 1987-12-10 Leybold Heraeus Gmbh & Co Kg Magnetron-zerstaeubungskatode fuer vakuum-beschichtungsanlagen
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DE3624150C2 (de) * 1986-07-17 1994-02-24 Leybold Ag Zerstäubungskatode nach dem Magnetronprinzip
IT1211938B (it) * 1987-11-27 1989-11-08 Siv Soc Italiana Vetro Apparecchiatura e procedimento per la deposizione di uno strato sottile su un substrato trasparente, particolarmente per la realizzazione di vetrature
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US4842703A (en) * 1988-02-23 1989-06-27 Eaton Corporation Magnetron cathode and method for sputter coating
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US5126028A (en) * 1989-04-17 1992-06-30 Materials Research Corporation Sputter coating process control method and apparatus
US4957605A (en) * 1989-04-17 1990-09-18 Materials Research Corporation Method and apparatus for sputter coating stepped wafers
US6024843A (en) * 1989-05-22 2000-02-15 Novellus Systems, Inc. Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile
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US5073245A (en) * 1990-07-10 1991-12-17 Hedgcoth Virgle L Slotted cylindrical hollow cathode/magnetron sputtering device
US5437778A (en) * 1990-07-10 1995-08-01 Telic Technologies Corporation Slotted cylindrical hollow cathode/magnetron sputtering device
DE4022708A1 (de) * 1990-07-17 1992-04-02 Balzers Hochvakuum Aetz- oder beschichtungsanlagen
DE4042417C2 (de) * 1990-07-17 1993-11-25 Balzers Hochvakuum Ätz- oder Beschichtungsanlage sowie Verfahren zu ihrem Zünden oder intermittierenden Betreiben
US5174875A (en) * 1990-08-29 1992-12-29 Materials Research Corporation Method of enhancing the performance of a magnetron sputtering target
KR100231397B1 (ko) * 1991-01-28 1999-11-15 튜그룰 야사르 음극 스퍼터링용 타겟
US5228963A (en) * 1991-07-01 1993-07-20 Himont Incorporated Hollow-cathode magnetron and method of making thin films
JPH059735A (ja) * 1991-07-09 1993-01-19 Kobe Steel Ltd ダイヤモンドの気相合成方法
DE4123274C2 (de) * 1991-07-13 1996-12-19 Leybold Ag Vorrichtung zum Beschichten von Bauteilen bzw. Formteilen durch Kathodenzerstäubung
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US5277779A (en) * 1992-04-14 1994-01-11 Henshaw William F Rectangular cavity magnetron sputtering vapor source
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US5455197A (en) * 1993-07-16 1995-10-03 Materials Research Corporation Control of the crystal orientation dependent properties of a film deposited on a semiconductor wafer
US5378341A (en) * 1993-10-13 1995-01-03 The United States Of America As Represented By The Secretary Of The Air Force Conical magnetron sputter source
US5798029A (en) * 1994-04-22 1998-08-25 Applied Materials, Inc. Target for sputtering equipment
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CH691643A5 (de) * 1995-10-06 2001-08-31 Unaxis Balzers Ag Magnetronzerstäubungsquelle und deren Verwendung.
JPH09228038A (ja) * 1996-02-23 1997-09-02 Balzers Prozes Syst Gmbh 中空のターゲットを備えた、陰極スパッタによりサブストレートを被覆するための装置
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US6432286B1 (en) * 1998-06-10 2002-08-13 David A. Glocker Conical sputtering target
US6235170B1 (en) * 1998-06-10 2001-05-22 David A. Glocker Conical sputtering target
DE19827461A1 (de) 1998-06-19 1999-12-23 Leybold Systems Gmbh Vorrichtung zum Beschichten von Substraten in einer Vakuumkammer
US6231725B1 (en) * 1998-08-04 2001-05-15 Applied Materials, Inc. Apparatus for sputtering material onto a workpiece with the aid of a plasma
DE19837045A1 (de) * 1998-08-14 2000-02-17 Leybold Systems Gmbh Vorrichtung zum Beschichten von Substraten mit dünnen Schichten
US6238528B1 (en) 1998-10-13 2001-05-29 Applied Materials, Inc. Plasma density modulator for improved plasma density uniformity and thickness uniformity in an ionized metal plasma source
US6179973B1 (en) * 1999-01-05 2001-01-30 Novellus Systems, Inc. Apparatus and method for controlling plasma uniformity across a substrate
US6497796B1 (en) 1999-01-05 2002-12-24 Novellus Systems, Inc. Apparatus and method for controlling plasma uniformity across a substrate
US6193854B1 (en) * 1999-01-05 2001-02-27 Novellus Systems, Inc. Apparatus and method for controlling erosion profile in hollow cathode magnetron sputter source
GB2346155B (en) * 1999-01-06 2003-06-25 Trikon Holdings Ltd Sputtering apparatus
JP2000226655A (ja) * 1999-02-02 2000-08-15 Matsushita Electric Ind Co Ltd スパッタリング装置
US6620298B1 (en) * 1999-04-23 2003-09-16 Matsushita Electric Industrial Co., Ltd. Magnetron sputtering method and apparatus
US6409890B1 (en) 1999-07-27 2002-06-25 Applied Materials, Inc. Method and apparatus for forming a uniform layer on a workpiece during sputtering
US6444100B1 (en) 2000-02-11 2002-09-03 Seagate Technology Llc Hollow cathode sputter source
US6605195B2 (en) 2000-04-14 2003-08-12 Seagate Technology Llc Multi-layer deposition process using four ring sputter sources
US6406599B1 (en) * 2000-11-01 2002-06-18 Applied Materials, Inc. Magnetron with a rotating center magnet for a vault shaped sputtering target
US6471831B2 (en) 2001-01-09 2002-10-29 Novellus Systems, Inc. Apparatus and method for improving film uniformity in a physical vapor deposition system
US7781327B1 (en) 2001-03-13 2010-08-24 Novellus Systems, Inc. Resputtering process for eliminating dielectric damage
US8043484B1 (en) 2001-03-13 2011-10-25 Novellus Systems, Inc. Methods and apparatus for resputtering process that improves barrier coverage
US7186648B1 (en) 2001-03-13 2007-03-06 Novellus Systems, Inc. Barrier first method for single damascene trench applications
US6764940B1 (en) 2001-03-13 2004-07-20 Novellus Systems, Inc. Method for depositing a diffusion barrier for copper interconnect applications
EP1254970A1 (fr) 2001-05-03 2002-11-06 Unaxis Balzers Aktiengesellschaft Source de pulvérisation magnétron avec cible de mosaique
US6613199B1 (en) 2001-10-25 2003-09-02 Novellus Systems, Inc. Apparatus and method for physical vapor deposition using an open top hollow cathode magnetron
US6683425B1 (en) 2002-02-05 2004-01-27 Novellus Systems, Inc. Null-field magnetron apparatus with essentially flat target
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US20030183518A1 (en) * 2002-03-27 2003-10-02 Glocker David A. Concave sputtering apparatus
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US6589398B1 (en) * 2002-03-28 2003-07-08 Novellus Systems, Inc. Pasting method for eliminating flaking during nitride sputtering
US8298933B2 (en) 2003-04-11 2012-10-30 Novellus Systems, Inc. Conformal films on semiconductor substrates
US7842605B1 (en) 2003-04-11 2010-11-30 Novellus Systems, Inc. Atomic layer profiling of diffusion barrier and metal seed layers
US6929720B2 (en) * 2003-06-09 2005-08-16 Tokyo Electron Limited Sputtering source for ionized physical vapor deposition of metals
US7179351B1 (en) 2003-12-15 2007-02-20 Novellus Systems, Inc. Methods and apparatus for magnetron sputtering
US7569123B1 (en) 2004-05-25 2009-08-04 Novellus Systems, Inc. Optimizing target erosion using multiple erosion regions in a magnetron sputtering apparatus
JP2006037127A (ja) * 2004-07-23 2006-02-09 Cyg Gijutsu Kenkyusho Kk スパッタ電極構造
US20060054494A1 (en) * 2004-09-16 2006-03-16 Veeco Instruments Inc. Physical vapor deposition apparatus for depositing thin multilayer films and methods of depositing such films
US20060207871A1 (en) * 2005-03-16 2006-09-21 Gennady Yumshtyk Sputtering devices and methods
US20060207872A1 (en) * 2005-03-21 2006-09-21 Sergey Mishin Dual magnetron thin film deposition system
US20070158179A1 (en) * 2006-01-11 2007-07-12 Anthony Ciancio Method and apparatus for improving symmetry of a layer deposited on a semiconductor substrate
US7855147B1 (en) 2006-06-22 2010-12-21 Novellus Systems, Inc. Methods and apparatus for engineering an interface between a diffusion barrier layer and a seed layer
US7645696B1 (en) 2006-06-22 2010-01-12 Novellus Systems, Inc. Deposition of thin continuous PVD seed layers having improved adhesion to the barrier layer
US7510634B1 (en) * 2006-11-10 2009-03-31 Novellus Systems, Inc. Apparatus and methods for deposition and/or etch selectivity
US7682966B1 (en) 2007-02-01 2010-03-23 Novellus Systems, Inc. Multistep method of depositing metal seed layers
US7922880B1 (en) 2007-05-24 2011-04-12 Novellus Systems, Inc. Method and apparatus for increasing local plasma density in magnetically confined plasma
US7897516B1 (en) 2007-05-24 2011-03-01 Novellus Systems, Inc. Use of ultra-high magnetic fields in resputter and plasma etching
US7659197B1 (en) 2007-09-21 2010-02-09 Novellus Systems, Inc. Selective resputtering of metal seed layers
US8017523B1 (en) 2008-05-16 2011-09-13 Novellus Systems, Inc. Deposition of doped copper seed layers having improved reliability
WO2010125002A1 (fr) 2009-04-27 2010-11-04 Oc Oerlikon Balzers Ag Pulvérisation cathodique réactive avec de multiples sources de pulvérisation cathodique
WO2015015669A1 (fr) * 2013-08-02 2015-02-05 キヤノンアネルバ株式会社 Appareil de pulvérisation cathodique et cible de pulvérisation cathodique
US9368330B2 (en) 2014-05-02 2016-06-14 Bh5773 Ltd Sputtering targets and methods
JP6423290B2 (ja) * 2015-03-06 2018-11-14 東京エレクトロン株式会社 成膜装置

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Also Published As

Publication number Publication date
DE3506227A1 (de) 1985-10-31
GB2157715A (en) 1985-10-30
US4622121A (en) 1986-11-11
JPH0352534B2 (fr) 1991-08-12
GB2157715B (en) 1987-10-07
CH659484A5 (de) 1987-01-30
GB8508897D0 (en) 1985-05-09
FR2563239A1 (fr) 1985-10-25
JPS60234970A (ja) 1985-11-21

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Legal Events

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ST Notification of lapse