FR2568269B1 - Dispositif de pulverisation pour installations de pulverisation cathodique - Google Patents

Dispositif de pulverisation pour installations de pulverisation cathodique

Info

Publication number
FR2568269B1
FR2568269B1 FR8511508A FR8511508A FR2568269B1 FR 2568269 B1 FR2568269 B1 FR 2568269B1 FR 8511508 A FR8511508 A FR 8511508A FR 8511508 A FR8511508 A FR 8511508A FR 2568269 B1 FR2568269 B1 FR 2568269B1
Authority
FR
France
Prior art keywords
spraying
installations
cathode
spraying device
cathode spraying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8511508A
Other languages
English (en)
Other versions
FR2568269A1 (fr
Inventor
Gerhard Hessberger
Michael Scherer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balzers und Leybold Deutschland Holding AG
Original Assignee
Leybold Heraeus GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold Heraeus GmbH filed Critical Leybold Heraeus GmbH
Publication of FR2568269A1 publication Critical patent/FR2568269A1/fr
Application granted granted Critical
Publication of FR2568269B1 publication Critical patent/FR2568269B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)
FR8511508A 1984-07-26 1985-07-26 Dispositif de pulverisation pour installations de pulverisation cathodique Expired FR2568269B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843427587 DE3427587A1 (de) 1984-07-26 1984-07-26 Zerstaeubungseinrichtung fuer katodenzerstaeubungsanlagen

Publications (2)

Publication Number Publication Date
FR2568269A1 FR2568269A1 (fr) 1986-01-31
FR2568269B1 true FR2568269B1 (fr) 1988-11-25

Family

ID=6241644

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8511508A Expired FR2568269B1 (fr) 1984-07-26 1985-07-26 Dispositif de pulverisation pour installations de pulverisation cathodique

Country Status (5)

Country Link
US (1) US4619755A (fr)
JP (1) JPS6184371A (fr)
CH (1) CH665853A5 (fr)
DE (1) DE3427587A1 (fr)
FR (1) FR2568269B1 (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3612721C3 (de) * 1986-04-16 1994-07-14 Ver Glaswerke Gmbh Durchlauf-Kathodenzerstäubungsanlage
DE3624480A1 (de) * 1986-07-19 1988-01-28 Leybold Heraeus Gmbh & Co Kg Zerstaeubungskatode fuer vakuum-beschichtungsanlagen
JPS63170780A (ja) * 1986-10-03 1988-07-14 インタランド・コーポレーション 一体化したマルチ・ディスプレイ型のオーバーレイ制御式通信ワークステーション
US4931158A (en) * 1988-03-22 1990-06-05 The Regents Of The Univ. Of Calif. Deposition of films onto large area substrates using modified reactive magnetron sputtering
EP0543931A4 (en) * 1990-08-10 1993-09-08 Viratec Thin Films, Inc. Shielding for arc suppression in rotating magnetron sputtering systems
US5106474A (en) * 1990-11-21 1992-04-21 Viratec Thin Films, Inc. Anode structures for magnetron sputtering apparatus
WO1992009853A1 (fr) * 1990-11-30 1992-06-11 Tokai Corporation Dispositif d'allumage
US6296743B1 (en) * 1993-04-02 2001-10-02 Applied Materials, Inc. Apparatus for DC reactive plasma vapor deposition of an electrically insulating material using a shielded secondary anode
CA2123479C (fr) * 1993-07-01 1999-07-06 Peter A. Sieck Anode pour systemes de pulverisation par magnetron
DE4415232A1 (de) * 1994-04-30 1995-11-02 Leybold Ag Beschichtungsanlage
US5527439A (en) * 1995-01-23 1996-06-18 The Boc Group, Inc. Cylindrical magnetron shield structure
CH691686A5 (de) * 1995-11-16 2001-09-14 Unaxis Balzers Ag Vakuumbehandlungskammer.
US6103074A (en) * 1998-02-14 2000-08-15 Phygen, Inc. Cathode arc vapor deposition method and apparatus
US6299740B1 (en) 2000-01-19 2001-10-09 Veeco Instrument, Inc. Sputtering assembly and target therefor
US6440280B1 (en) 2000-06-28 2002-08-27 Sola International, Inc. Multi-anode device and methods for sputter deposition
US20060049041A1 (en) * 2004-08-20 2006-03-09 Jds Uniphase Corporation Anode for sputter coating
US7879209B2 (en) * 2004-08-20 2011-02-01 Jds Uniphase Corporation Cathode for sputter coating
US8500973B2 (en) * 2004-08-20 2013-08-06 Jds Uniphase Corporation Anode for sputter coating
US9117637B2 (en) * 2005-11-04 2015-08-25 Von Ardenne Gmbh Redundant anode sputtering method and assembly
JP4142706B2 (ja) * 2006-09-28 2008-09-03 富士フイルム株式会社 成膜装置、成膜方法、絶縁膜、誘電体膜、圧電膜、強誘電体膜、圧電素子および液体吐出装置
WO2010058366A1 (fr) * 2008-11-24 2010-05-27 Oc Oerlikon Balzers Ag Agencement de pulvérisation rf
EP2382648B1 (fr) * 2008-12-23 2016-10-05 Oerlikon Advanced Technologies AG Arrangement pour pulvérisation cathodique rf
DE102013204132B4 (de) * 2013-03-11 2015-04-02 Von Ardenne Gmbh Vorrichtung zur Anodenhalterung beim Magnetron-Sputtern
RU2664350C1 (ru) * 2017-06-14 2018-08-16 Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский Нижегородский государственный университет им. Н.И. Лобачевского" Способ настройки магнетронного распыления составной мишени
RU2677032C1 (ru) * 2017-12-26 2019-01-15 Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский Нижегородский государственный университет им. Н.И. Лобачевского" Способ магнетронного распыления составной мишени

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL160988A (fr) * 1950-05-08
US3514391A (en) * 1967-05-05 1970-05-26 Nat Res Corp Sputtering apparatus with finned anode
US3617463A (en) * 1969-06-18 1971-11-02 Ibm Apparatus and method for sputter etching
GB1290863A (fr) * 1969-08-05 1972-09-27
US3884793A (en) * 1971-09-07 1975-05-20 Telic Corp Electrode type glow discharge apparatus
US4031424A (en) * 1971-09-07 1977-06-21 Telic Corporation Electrode type glow discharge apparatus
US3748253A (en) * 1972-01-24 1973-07-24 Gte Automatic Electric Lab Inc Apparatus with labyrinth heat exchanger for the sputtering depositionof thin films
US4166018A (en) * 1974-01-31 1979-08-28 Airco, Inc. Sputtering process and apparatus
DE2522227A1 (de) * 1975-05-20 1976-12-02 Telic Corp Verfahren und vorrichtung zur erzeugung einer glimmentladung
US4046660A (en) * 1975-12-29 1977-09-06 Bell Telephone Laboratories, Incorporated Sputter coating with charged particle flux control
DE2606453C2 (de) * 1976-02-18 1978-03-09 Ionit Anstalt Bernhard Berghaus, Vaduz Vorrichtung zum Messen der Temperatur von mittels stromstarker Glimmentladung zu behandelnder Werkstücke
DE2636293A1 (de) * 1976-08-12 1978-02-16 Leybold Heraeus Gmbh & Co Kg Katodenzerstaeubungsvorrichtung
DE3067724D1 (en) * 1980-02-07 1984-06-14 Matsushita Electric Ind Co Ltd Method of forming a glass spacer in the magnetic gap of a magnetic head

Also Published As

Publication number Publication date
JPS6184371A (ja) 1986-04-28
DE3427587A1 (de) 1986-02-06
CH665853A5 (de) 1988-06-15
FR2568269A1 (fr) 1986-01-31
DE3427587C2 (fr) 1992-01-16
US4619755A (en) 1986-10-28

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Legal Events

Date Code Title Description
ST Notification of lapse