CH608825A5 - - Google Patents

Info

Publication number
CH608825A5
CH608825A5 CH756624A CH662475A CH608825A5 CH 608825 A5 CH608825 A5 CH 608825A5 CH 756624 A CH756624 A CH 756624A CH 662475 A CH662475 A CH 662475A CH 608825 A5 CH608825 A5 CH 608825A5
Authority
CH
Switzerland
Application number
CH756624A
Inventor
Melvin A Lipson
Dale W Knoth
Walter D Custer
Michael N Gilano
Original Assignee
Dynachem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynachem Corp filed Critical Dynachem Corp
Publication of CH608825A5 publication Critical patent/CH608825A5/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F20/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/447—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from acrylic compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material
    • Y10T29/49812—Temporary protective coating, impregnation, or cast layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Chemically Coating (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Paints Or Removers (AREA)
CH756624A 1974-05-24 1975-05-23 CH608825A5 (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/473,180 US4003877A (en) 1974-05-24 1974-05-24 Photopolymerizable screen printing inks for permanent coatings prepared from aryloxyalkyl compositions

Publications (1)

Publication Number Publication Date
CH608825A5 true CH608825A5 (nl) 1979-01-31

Family

ID=23878521

Family Applications (1)

Application Number Title Priority Date Filing Date
CH756624A CH608825A5 (nl) 1974-05-24 1975-05-23

Country Status (24)

Country Link
US (2) US4003877A (nl)
JP (1) JPS515388A (nl)
AR (1) AR217039A1 (nl)
AT (1) AT339928B (nl)
BE (1) BE829437A (nl)
BG (1) BG26402A3 (nl)
BR (1) BR7503276A (nl)
CA (1) CA1049691A (nl)
CH (1) CH608825A5 (nl)
DD (2) DD124390A5 (nl)
DE (1) DE2522811C2 (nl)
DK (1) DK154919C (nl)
ES (1) ES437825A1 (nl)
FI (1) FI59112C (nl)
FR (1) FR2274652A1 (nl)
GB (1) GB1507842A (nl)
IL (1) IL47310A (nl)
IN (1) IN142791B (nl)
IT (1) IT1035820B (nl)
NL (1) NL173178B (nl)
NO (1) NO146676C (nl)
RO (1) RO67457A (nl)
SE (1) SE431879B (nl)
ZA (1) ZA753049B (nl)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
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JPS5296690A (en) * 1976-02-10 1977-08-13 Dainippon Ink & Chem Inc Rapidly curable photo-setting resin composition
US4234676A (en) * 1978-01-23 1980-11-18 W. R. Grace & Co. Polythiol effect curable polymeric composition
DE2861486D1 (en) * 1977-11-21 1982-02-18 Ciba Geigy Ag Process for the application of soldering masks to printed circuits with through holes for contacting
US4169732A (en) * 1978-01-09 1979-10-02 International Business Machines Corporation Photosensitive coating composition and use thereof
US4322457A (en) * 1978-01-25 1982-03-30 Western Electric Co., Inc. Method of selectively depositing a metal on a surface
US4381951A (en) * 1978-01-25 1983-05-03 Western Electric Co. Inc. Method of removing contaminants from a surface
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit
JPS5953164B2 (ja) * 1978-04-13 1984-12-24 日本文化精工株式会社 印刷とメツキとによるプラスチツク製品の加飾方法
JPS54158661A (en) * 1978-06-01 1979-12-14 Tokyo Purinto Kougiyou Kk Printed circuit board
GB2030584B (en) * 1978-10-03 1983-03-23 Lankro Chem Ltd Photopolymerisable solder resist compositions
NO159729C (no) * 1978-11-01 1989-02-01 Coates Brothers & Co Fremgangsmaate for fremstilling av et moenster av loddemetall paa et lag elektrisk ledende metall baaret av et ikke-ledende underlag.
US4486466A (en) * 1979-01-12 1984-12-04 Kollmorgen Technologies Corporation High resolution screen printable resists
US4240945A (en) * 1979-01-31 1980-12-23 Albert Gabrick Solder mask composition
US4345371A (en) * 1979-03-14 1982-08-24 Sony Corporation Method and apparatus for manufacturing hybrid integrated circuits
JPS55127097A (en) * 1979-03-20 1980-10-01 Matsushita Electric Ind Co Ltd Photocurable resin composition and solder resist
GB2050946B (en) * 1979-05-30 1983-02-16 Tdk Electronics Co Ltd Hot melt screen printing machine and process for producing a screen printing plate
US4376815A (en) * 1979-10-22 1983-03-15 Oddi Michael J Method of applying photoresist by screening in the formation of printed circuits
US4390615A (en) * 1979-11-05 1983-06-28 Courtney Robert W Coating compositions
US4306012A (en) * 1979-12-05 1981-12-15 Hercules Incorporated Process of radiation and heat treatment of printing medium
US4416974A (en) * 1979-12-05 1983-11-22 Hercules Incorporated Radiation curable ceramic pigment composition
US4252888A (en) * 1980-02-26 1981-02-24 Minnesota Mining And Manufacturing Company Solder mask composition
JPS6045665B2 (ja) * 1980-04-21 1985-10-11 日立化成工業株式会社 実装回路板用防湿絶縁塗料組成物
JPS573875A (en) * 1980-06-11 1982-01-09 Tamura Kaken Kk Photopolymerizable ink composition
US4490457A (en) * 1980-11-28 1984-12-25 Honeywell Inc. Cold/dry substrate treatment technique which improves photolithographic limits of resolution and exposure tolerance
JPS5888741A (ja) * 1981-11-20 1983-05-26 Hitachi Chem Co Ltd 感光性樹脂組成物及び感光性樹脂組成物積層体
JPS58177492A (ja) * 1982-04-12 1983-10-18 Tadao Mutou プラスチツク成形品に部分的な金属メツキを施す方法
US4522914A (en) * 1982-10-22 1985-06-11 Wabash College Imaging method of making a raised line facsimile of a photographic image
JPS59204036A (ja) * 1983-05-06 1984-11-19 Dainippon Ink & Chem Inc レジストパタ−ンの形成法
US4533445A (en) * 1983-07-06 1985-08-06 Shipley Company Inc. U.V. Curable composition
US4775611A (en) * 1983-11-10 1988-10-04 Sullivan Donald F Additive printed circuit boards with flat surface and indented primary wiring conductors
US4640719A (en) * 1985-07-01 1987-02-03 Petroleum Fermentations N.V. Method for printed circuit board and/or printed wiring board cleaning
AT389793B (de) * 1986-03-25 1990-01-25 Philips Nv Leiterplatte fuer gedruckte schaltungen und verfahren zur herstellung solcher leiterplatten
US4690833A (en) * 1986-03-28 1987-09-01 International Business Machines Corporation Providing circuit lines on a substrate
US4826705A (en) * 1986-07-02 1989-05-02 Loctite Corporation Radiation curable temporary solder mask
EP0313580B1 (en) * 1986-07-02 1992-06-03 Loctite Corporation Radiation curable temporary solder mask
JPS6462375A (en) * 1987-09-02 1989-03-08 Arakawa Chem Ind Liquid photosolder resist ink composition of alkali development type
GB2214191B (en) * 1988-01-12 1990-10-31 Sicpa Holding Sa Reversibly photochromic printing inks
EP0346522A3 (en) * 1988-06-16 1991-04-03 Nippon CMK Corp. Printed wiring board
US5667934A (en) * 1990-10-09 1997-09-16 International Business Machines Corporation Thermally stable photoimaging composition
US5206116A (en) * 1991-03-04 1993-04-27 Shipley Company Inc. Light-sensitive composition for use as a soldermask and process
DE4316087A1 (de) * 1993-05-13 1994-11-17 Morton Int Inc Verfahren zum bildmäßigen Metallisieren von strukturierten Leiterplatten
US5458921A (en) 1994-10-11 1995-10-17 Morton International, Inc. Solvent system for forming films of photoimageable compositions
US5545440A (en) * 1994-12-05 1996-08-13 At&T Global Information Solutions Company (Aka Ncr Corporation) Method and apparatus for polymer coating of substrates
US5802713A (en) * 1995-01-20 1998-09-08 Fairchild Space And Defense Corportion Circuit board manufacturing method
US5939238A (en) * 1998-06-02 1999-08-17 Morton International, Inc. Photoimageable composition having improved photoinitiator system
US5952153A (en) * 1997-12-01 1999-09-14 Morton International, Inc. Photoimageable composition having improved flexibility, adhesion and stripping characteristics
US5939239A (en) * 1997-12-01 1999-08-17 Nichigo-Morton Co., Ltd. Photoimageable compositions containing photopolymerizable urethane oligomers and dibenzoate plasticizers
US5952154A (en) * 1998-05-29 1999-09-14 Morton International, Inc. Photoimageable composition having improved flexibility
DE19842276A1 (de) * 1998-09-16 2000-03-30 Bosch Gmbh Robert Paste zum Verschweißen von Keramiken mit Metallen und Verfahren zur Herstellung einer Schweißverbindung
JP2000118113A (ja) * 1998-10-15 2000-04-25 Riso Kagaku Corp 孔版印刷方法及び装置
US20030119955A1 (en) * 2001-02-08 2003-06-26 Mbt Holding Ag Polymeric structural support membrane
WO2002070591A2 (en) * 2001-02-08 2002-09-12 Mbt Holding Ag Polymeric excavation structural support membrane
US6855480B2 (en) 2001-04-19 2005-02-15 Shipley Company, L.L.C. Photoresist composition
TW511423B (en) * 2001-09-25 2002-11-21 Benq Corp Soft circuit board for recognition and the manufacturing method thereof
US20060154180A1 (en) 2005-01-07 2006-07-13 Kannurpatti Anandkumar R Imaging element for use as a recording element and process of using the imaging element
US7772295B2 (en) 2005-02-04 2010-08-10 Denki Kagaku Kogyo Kabushiki Kaisha Resin compositions, cured article obtained therefrom, and sheet
US7579134B2 (en) * 2005-03-15 2009-08-25 E. I. Dupont De Nemours And Company Polyimide composite coverlays and methods and compositions relating thereto
US7618766B2 (en) * 2005-12-21 2009-11-17 E. I. Du Pont De Nemours And Company Flame retardant photoimagable coverlay compositions and methods relating thereto
US7527915B2 (en) * 2006-07-19 2009-05-05 E. I. Du Pont De Nemours And Company Flame retardant multi-layer photoimagable coverlay compositions and methods relating thereto
JP5560185B2 (ja) 2008-03-03 2014-07-23 旭化成ケミカルズ株式会社 難燃性樹脂組成物
TWI353808B (en) * 2008-04-28 2011-12-01 Ind Tech Res Inst Method for fabricating conductive pattern on flexi
JP5318222B2 (ja) * 2008-11-25 2013-10-16 ロード コーポレイション 光硬化性材料でダイ表面を保護する方法
US9093448B2 (en) 2008-11-25 2015-07-28 Lord Corporation Methods for protecting a die surface with photocurable materials
US20130029046A1 (en) * 2010-04-09 2013-01-31 Basf Se Printing ink containing a divinyl ester
US8344172B2 (en) 2011-03-25 2013-01-01 Stepan Company Preparation of antiplasticizers for thermoplastic polyesters
KR101560111B1 (ko) 2011-12-28 2015-10-13 아사히 가세이 이-매터리얼즈 가부시키가이샤 레독스 플로우 이차 전지 및 레독스 플로우 이차 전지용 전해질막
GB201223064D0 (en) * 2012-12-20 2013-02-06 Rainbow Technology Systems Ltd Curable coatings for photoimaging
CN105531333A (zh) * 2013-09-13 2016-04-27 巴斯夫欧洲公司 耐刮擦的辐射固化涂料
DE102014106230A1 (de) * 2014-05-05 2015-11-05 Preh Gmbh Galvanisierverfahren für Inselstrukturen

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US3066112A (en) * 1959-01-30 1962-11-27 Rafael L Bowen Dental filling material comprising vinyl silane treated fused silica and a binder consisting of the reaction product of bis phenol and glycidyl acrylate
US3539533A (en) * 1968-06-14 1970-11-10 Johnson & Johnson Dental filling material
US3661576A (en) * 1970-02-09 1972-05-09 Brady Co W H Photopolymerizable compositions and articles
US3772062A (en) * 1971-11-16 1973-11-13 Inmont Corp Ultra-violet curable coating compositions
JPS5414605B2 (nl) * 1972-07-05 1979-06-08
JPS5625441B2 (nl) * 1972-09-04 1981-06-12
JPS535712B2 (nl) * 1973-01-24 1978-03-01
DE2349979A1 (de) * 1973-10-04 1975-04-17 Bayer Ag Uv-licht-haertende massen hoher reaktivitaet

Also Published As

Publication number Publication date
JPS515388A (en) 1976-01-17
NL173178B (nl) 1983-07-18
SE431879B (sv) 1984-03-05
FI59112B (fi) 1981-02-27
DK154919B (da) 1989-01-02
BG26402A3 (nl) 1979-03-15
ES437825A1 (es) 1977-07-01
SE7505838L (sv) 1975-12-11
NO146676C (no) 1982-11-17
AU8112875A (en) 1976-11-18
GB1507842A (en) 1978-04-19
DK227875A (da) 1975-11-25
BR7503276A (pt) 1976-04-27
ZA753049B (en) 1976-04-28
NO146676B (no) 1982-08-09
DD124390A5 (nl) 1977-02-16
DE2522811A1 (de) 1975-11-27
RO67457A (ro) 1981-07-30
IT1035820B (it) 1979-10-20
FI59112C (fi) 1981-06-10
NO751830L (nl) 1975-11-25
IN142791B (nl) 1977-08-27
FI751475A (nl) 1975-11-25
FR2274652B1 (nl) 1979-01-19
DD120662A5 (nl) 1976-06-20
AT339928B (de) 1977-11-10
US4064287A (en) 1977-12-20
IL47310A0 (en) 1975-07-28
BE829437A (fr) 1975-09-15
ATA400775A (de) 1977-03-15
AR217039A1 (es) 1980-02-29
FR2274652A1 (fr) 1976-01-09
US4003877A (en) 1977-01-18
DE2522811C2 (de) 1983-01-13
IL47310A (en) 1978-07-31
DK154919C (da) 1989-05-29
CA1049691A (en) 1979-02-27
NL7506080A (nl) 1975-11-26

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Legal Events

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PL Patent ceased