CH560999A5 - - Google Patents

Info

Publication number
CH560999A5
CH560999A5 CH1179873A CH1179873A CH560999A5 CH 560999 A5 CH560999 A5 CH 560999A5 CH 1179873 A CH1179873 A CH 1179873A CH 1179873 A CH1179873 A CH 1179873A CH 560999 A5 CH560999 A5 CH 560999A5
Authority
CH
Switzerland
Application number
CH1179873A
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH1179873A priority Critical patent/CH560999A5/xx
Priority to DE19732347049 priority patent/DE2347049C2/de
Publication of CH560999A5 publication Critical patent/CH560999A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
CH1179873A 1973-08-16 1973-08-16 CH560999A5 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CH1179873A CH560999A5 (ja) 1973-08-16 1973-08-16
DE19732347049 DE2347049C2 (de) 1973-08-16 1973-09-19 Verfahren zum Einkapseln von miniaturisierten Schaltungen, insbesondere Hybridschaltungen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1179873A CH560999A5 (ja) 1973-08-16 1973-08-16

Publications (1)

Publication Number Publication Date
CH560999A5 true CH560999A5 (ja) 1975-04-15

Family

ID=4376971

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1179873A CH560999A5 (ja) 1973-08-16 1973-08-16

Country Status (2)

Country Link
CH (1) CH560999A5 (ja)
DE (1) DE2347049C2 (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5435666B2 (ja) * 1975-02-11 1979-11-05
DE3019239A1 (de) * 1980-05-20 1981-11-26 SIEMENS AG AAAAA, 1000 Berlin und 8000 München Umhuellung fuer halbleiterbauelement
JPS6018145B2 (ja) * 1980-09-22 1985-05-09 株式会社日立製作所 樹脂封止型半導体装置
JPS59198740A (ja) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp 樹脂封止形半導体複合素子
US4616406A (en) * 1984-09-27 1986-10-14 Advanced Micro Devices, Inc. Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit layers therein
DE3442131A1 (de) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen
DE3505086A1 (de) * 1985-02-14 1986-08-28 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit einem kunststoffgehaeuse
US4768286A (en) * 1986-10-01 1988-09-06 Eastman Christensen Co. Printed circuit packaging for high vibration and temperature environments
EP0308676A3 (de) * 1987-09-25 1990-01-10 Siemens Aktiengesellschaft Spannungsarme Umhüllung für elektrische und elektronische Bauelemente, insbesondere Hybridschaltungen
EP0361194A3 (de) * 1988-09-30 1991-06-12 Siemens Aktiengesellschaft Verfahren zum Umhüllen von elektrischen oder elektronischen Bauelementen oder Baugruppen und Umhüllung für elektrische oder elektronische Bauelemente oder Baugruppen
JPH0779191B2 (ja) * 1991-04-08 1995-08-23 株式会社東芝 立体配線板の製造方法
JP2765278B2 (ja) * 1991-05-31 1998-06-11 株式会社デンソー 電子装置の製造方法
DE4224122C2 (de) * 1992-07-22 1995-11-02 Turck Werner Kg In einem Gehäuse eingegossene elektronische Schaltunng
US5285559A (en) * 1992-09-10 1994-02-15 Sundstrand Corporation Method and apparatus for isolating electronic boards from shock and thermal environments
FR2713396B1 (fr) * 1993-11-30 1996-02-09 Giat Ind Sa Procédé d'encapsulation de composants ou de modules électroniques et composants ou modules électroniques encapsulés par ledit procédé.
DE4435120C2 (de) * 1994-09-30 2000-08-03 Siemens Ag Schutzschicht für Wafer und Verfahren zu deren Herstellung
US5689878A (en) * 1996-04-17 1997-11-25 Lucent Technologies Inc. Method for protecting electronic circuit components
DE19638669A1 (de) * 1996-09-20 1998-04-02 Siemens Components A T Herstellungsverfahren von Kunststoffgehäusen für auf Trägerrahmen befestigten Chips
JP3564994B2 (ja) * 1997-08-25 2004-09-15 株式会社村田製作所 電子部品およびその製造方法
CN1146988C (zh) * 1997-12-08 2004-04-21 东芝株式会社 半导体功率器件的封装及其组装方法
WO2005096374A1 (de) * 2004-03-15 2005-10-13 Siemens Aktiengesellschaft Elektrotechnisches erzeugnis mit einem elektrischen bauelement und einer vergussmasse zur elektrischen isolierung des bauelements sowie verfahren zum herstellen des erzeugnisses
DE102005036445A1 (de) * 2005-08-03 2007-02-15 Robert Bosch Gmbh Zündspule für eine Brennkraftmaschine
JP5168866B2 (ja) 2006-09-28 2013-03-27 三菱電機株式会社 パワー半導体モジュール
TWI518852B (zh) * 2013-10-02 2016-01-21 矽品精密工業股份有限公司 半導體封裝件及其製法
EP3404675A1 (de) * 2017-05-15 2018-11-21 EBG Elektronische Bauelemente GmbH Leistungswiderstand
FR3114643B1 (fr) * 2020-09-25 2022-09-09 Nexter Munitions Fusee electronique pour projectile

Also Published As

Publication number Publication date
DE2347049C2 (de) 1982-09-02
DE2347049A1 (de) 1975-02-27

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Legal Events

Date Code Title Description
PL Patent ceased