CH560999A5 - - Google Patents

Info

Publication number
CH560999A5
CH560999A5 CH1179873A CH1179873A CH560999A5 CH 560999 A5 CH560999 A5 CH 560999A5 CH 1179873 A CH1179873 A CH 1179873A CH 1179873 A CH1179873 A CH 1179873A CH 560999 A5 CH560999 A5 CH 560999A5
Authority
CH
Switzerland
Application number
CH1179873A
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH1179873A priority Critical patent/CH560999A5/xx
Priority to DE19732347049 priority patent/DE2347049C2/de
Publication of CH560999A5 publication Critical patent/CH560999A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CH1179873A 1973-08-16 1973-08-16 CH560999A5 (enrdf_load_stackoverflow)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CH1179873A CH560999A5 (enrdf_load_stackoverflow) 1973-08-16 1973-08-16
DE19732347049 DE2347049C2 (de) 1973-08-16 1973-09-19 Verfahren zum Einkapseln von miniaturisierten Schaltungen, insbesondere Hybridschaltungen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1179873A CH560999A5 (enrdf_load_stackoverflow) 1973-08-16 1973-08-16

Publications (1)

Publication Number Publication Date
CH560999A5 true CH560999A5 (enrdf_load_stackoverflow) 1975-04-15

Family

ID=4376971

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1179873A CH560999A5 (enrdf_load_stackoverflow) 1973-08-16 1973-08-16

Country Status (2)

Country Link
CH (1) CH560999A5 (enrdf_load_stackoverflow)
DE (1) DE2347049C2 (enrdf_load_stackoverflow)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5435666B2 (enrdf_load_stackoverflow) * 1975-02-11 1979-11-05
DE3019239A1 (de) * 1980-05-20 1981-11-26 SIEMENS AG AAAAA, 1000 Berlin und 8000 München Umhuellung fuer halbleiterbauelement
JPS6018145B2 (ja) * 1980-09-22 1985-05-09 株式会社日立製作所 樹脂封止型半導体装置
JPS59198740A (ja) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp 樹脂封止形半導体複合素子
US4616406A (en) * 1984-09-27 1986-10-14 Advanced Micro Devices, Inc. Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit layers therein
DE3442131A1 (de) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen
DE3505086A1 (de) * 1985-02-14 1986-08-28 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit einem kunststoffgehaeuse
US4768286A (en) * 1986-10-01 1988-09-06 Eastman Christensen Co. Printed circuit packaging for high vibration and temperature environments
EP0308676A3 (de) * 1987-09-25 1990-01-10 Siemens Aktiengesellschaft Spannungsarme Umhüllung für elektrische und elektronische Bauelemente, insbesondere Hybridschaltungen
EP0361194A3 (de) * 1988-09-30 1991-06-12 Siemens Aktiengesellschaft Verfahren zum Umhüllen von elektrischen oder elektronischen Bauelementen oder Baugruppen und Umhüllung für elektrische oder elektronische Bauelemente oder Baugruppen
JPH0779191B2 (ja) * 1991-04-08 1995-08-23 株式会社東芝 立体配線板の製造方法
JP2765278B2 (ja) * 1991-05-31 1998-06-11 株式会社デンソー 電子装置の製造方法
DE4224122C2 (de) * 1992-07-22 1995-11-02 Turck Werner Kg In einem Gehäuse eingegossene elektronische Schaltunng
US5285559A (en) * 1992-09-10 1994-02-15 Sundstrand Corporation Method and apparatus for isolating electronic boards from shock and thermal environments
FR2713396B1 (fr) * 1993-11-30 1996-02-09 Giat Ind Sa Procédé d'encapsulation de composants ou de modules électroniques et composants ou modules électroniques encapsulés par ledit procédé.
DE4435120C2 (de) * 1994-09-30 2000-08-03 Siemens Ag Schutzschicht für Wafer und Verfahren zu deren Herstellung
US5689878A (en) * 1996-04-17 1997-11-25 Lucent Technologies Inc. Method for protecting electronic circuit components
DE19638669A1 (de) * 1996-09-20 1998-04-02 Siemens Components A T Herstellungsverfahren von Kunststoffgehäusen für auf Trägerrahmen befestigten Chips
JP3564994B2 (ja) * 1997-08-25 2004-09-15 株式会社村田製作所 電子部品およびその製造方法
TW408453B (en) * 1997-12-08 2000-10-11 Toshiba Kk Package for semiconductor power device and method for assembling the same
WO2005096374A1 (de) * 2004-03-15 2005-10-13 Siemens Aktiengesellschaft Elektrotechnisches erzeugnis mit einem elektrischen bauelement und einer vergussmasse zur elektrischen isolierung des bauelements sowie verfahren zum herstellen des erzeugnisses
DE102005036445A1 (de) * 2005-08-03 2007-02-15 Robert Bosch Gmbh Zündspule für eine Brennkraftmaschine
JP5168866B2 (ja) * 2006-09-28 2013-03-27 三菱電機株式会社 パワー半導体モジュール
TWI518852B (zh) * 2013-10-02 2016-01-21 矽品精密工業股份有限公司 半導體封裝件及其製法
EP3404675A1 (de) 2017-05-15 2018-11-21 EBG Elektronische Bauelemente GmbH Leistungswiderstand
FR3114643B1 (fr) 2020-09-25 2022-09-09 Nexter Munitions Fusee electronique pour projectile

Also Published As

Publication number Publication date
DE2347049C2 (de) 1982-09-02
DE2347049A1 (de) 1975-02-27

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Legal Events

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