CH554076A - Verfahren zum abloesen von halbleiterchips von einer unterlage ohne stoerung der chip-orientierung. - Google Patents
Verfahren zum abloesen von halbleiterchips von einer unterlage ohne stoerung der chip-orientierung.Info
- Publication number
- CH554076A CH554076A CH479473A CH479473A CH554076A CH 554076 A CH554076 A CH 554076A CH 479473 A CH479473 A CH 479473A CH 479473 A CH479473 A CH 479473A CH 554076 A CH554076 A CH 554076A
- Authority
- CH
- Switzerland
- Prior art keywords
- pad
- semiconductor chips
- chip orientation
- releasing semiconductor
- interfering
- Prior art date
Links
- 230000002452 interceptive effect Effects 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US24753072A | 1972-04-26 | 1972-04-26 | |
| US00247614A US3851758A (en) | 1972-04-26 | 1972-04-26 | Semiconductor chip fixture |
| US247639A US3915784A (en) | 1972-04-26 | 1972-04-26 | Method of semiconductor chip separation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH554076A true CH554076A (de) | 1974-09-13 |
Family
ID=27400049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH479473A CH554076A (de) | 1972-04-26 | 1973-04-04 | Verfahren zum abloesen von halbleiterchips von einer unterlage ohne stoerung der chip-orientierung. |
Country Status (5)
| Country | Link |
|---|---|
| CH (1) | CH554076A (enrdf_load_stackoverflow) |
| DE (1) | DE2317649C3 (enrdf_load_stackoverflow) |
| FR (1) | FR2181842B1 (enrdf_load_stackoverflow) |
| IT (1) | IT981199B (enrdf_load_stackoverflow) |
| NL (1) | NL7304000A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005047509A1 (de) * | 2005-10-04 | 2007-04-05 | Sse Sister Semiconductor Equipment Gmbh | Vorrichtung zur Separierung eines flächigen Objektes von einem Körper, mit dem das Objekt mittels Adhäsionskraft verbunden ist |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4138304A (en) * | 1977-11-03 | 1979-02-06 | General Electric Company | Wafer sawing technique |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3632074A (en) * | 1967-10-09 | 1972-01-04 | Western Electric Co | Releasable mounting and method of placing an oriented array of devices on the mounting |
| US3590462A (en) * | 1968-11-18 | 1971-07-06 | Western Electric Co | Method and apparatus for expanding an array of articles |
-
1973
- 1973-03-08 IT IT2130973A patent/IT981199B/it active
- 1973-03-13 FR FR7310219A patent/FR2181842B1/fr not_active Expired
- 1973-03-22 NL NL7304000A patent/NL7304000A/xx not_active Application Discontinuation
- 1973-04-04 CH CH479473A patent/CH554076A/xx not_active IP Right Cessation
- 1973-04-07 DE DE19732317649 patent/DE2317649C3/de not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005047509A1 (de) * | 2005-10-04 | 2007-04-05 | Sse Sister Semiconductor Equipment Gmbh | Vorrichtung zur Separierung eines flächigen Objektes von einem Körper, mit dem das Objekt mittels Adhäsionskraft verbunden ist |
| DE102005047509B4 (de) * | 2005-10-04 | 2017-10-26 | Degotec Gmbh | Vorrichtung zur Separierung eines flächigen Objektes von einem Körper, mit dem das Objekt mittels Adhäsionskraft verbunden ist |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2181842A1 (enrdf_load_stackoverflow) | 1973-12-07 |
| FR2181842B1 (enrdf_load_stackoverflow) | 1977-07-29 |
| DE2317649A1 (de) | 1973-11-15 |
| DE2317649B2 (de) | 1975-04-03 |
| NL7304000A (enrdf_load_stackoverflow) | 1973-10-30 |
| IT981199B (it) | 1974-10-10 |
| DE2317649C3 (de) | 1975-11-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |