CH521698A - Verfahren und Einrichtung zum Verbinden eines ersten mit einem zweiten Werkstück - Google Patents

Verfahren und Einrichtung zum Verbinden eines ersten mit einem zweiten Werkstück

Info

Publication number
CH521698A
CH521698A CH1933770A CH1933770A CH521698A CH 521698 A CH521698 A CH 521698A CH 1933770 A CH1933770 A CH 1933770A CH 1933770 A CH1933770 A CH 1933770A CH 521698 A CH521698 A CH 521698A
Authority
CH
Switzerland
Prior art keywords
workpiece
joining
Prior art date
Application number
CH1933770A
Other languages
English (en)
Inventor
Richard Herring Carl
John Schneider Fred
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of CH521698A publication Critical patent/CH521698A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CH1933770A 1969-12-31 1970-12-30 Verfahren und Einrichtung zum Verbinden eines ersten mit einem zweiten Werkstück CH521698A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US88944769A 1969-12-31 1969-12-31

Publications (1)

Publication Number Publication Date
CH521698A true CH521698A (de) 1972-04-15

Family

ID=25395107

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1933770A CH521698A (de) 1969-12-31 1970-12-30 Verfahren und Einrichtung zum Verbinden eines ersten mit einem zweiten Werkstück

Country Status (10)

Country Link
US (1) US3696985A (de)
BE (1) BE761038A (de)
CH (1) CH521698A (de)
DE (1) DE2064129A1 (de)
ES (1) ES387427A1 (de)
FR (1) FR2072157B1 (de)
GB (1) GB1329290A (de)
IE (1) IE34783B1 (de)
NL (1) NL7019010A (de)
SE (1) SE369551B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4207874A1 (de) * 1992-03-12 1993-09-16 Fraunhofer Ges Forschung Visuelle kontrolleinrichtung

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL165332C (nl) * 1970-10-07 1981-08-17 Philips Nv Inrichting voor het verbinden van een halfgeleider- inrichting met een substraat.
US3774834A (en) * 1971-07-20 1973-11-27 J And A Keller Machine Co Inc Bonding apparatus
US3771711A (en) * 1971-08-20 1973-11-13 Western Electric Co Compliant bonding
US3901429A (en) * 1972-05-01 1975-08-26 Western Electric Co Apparatus for compliant bonding
US3800409A (en) * 1972-05-01 1974-04-02 Western Electric Co Method for compliant bonding
US3900244A (en) * 1972-09-21 1975-08-19 Teledyne Inc Visual selection and precision isolation system for microelectronic units
US3909915A (en) * 1972-10-10 1975-10-07 Leopold Samuel Phillips Bonding apparatus
FR2205800B1 (de) * 1972-11-09 1976-08-20 Honeywell Bull Soc Ind
US3860405A (en) * 1972-11-13 1975-01-14 Western Electric Co Bonding of optical components
JPS5647697B2 (de) * 1973-06-26 1981-11-11
US3846905A (en) * 1973-07-09 1974-11-12 Texas Instruments Inc Assembly method for semiconductor chips
US3949926A (en) * 1974-01-30 1976-04-13 Diepeveen John C Apparatus for incremental movement of die frame
US4010885A (en) * 1974-09-30 1977-03-08 The Jade Corporation Apparatus for accurately bonding leads to a semi-conductor die or the like
US3946931A (en) * 1974-11-27 1976-03-30 Western Electric Company, Inc. Methods of and apparatus for bonding an article to a substrate
DE2841465B2 (de) * 1978-09-23 1980-08-21 Messerschmitt-Boelkow-Blohm Gmbh, 8000 Muenchen Vorrichtung zum Verschweißen von Kontaktfahnen mit Sonnenzellen
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Ind Co Ltd Device for mounting electronic part
US4832251A (en) * 1983-12-13 1989-05-23 General Electric Company Method of mounting semiconductor lasers providing improved lasing spot alignment
US4603802A (en) * 1984-02-27 1986-08-05 Fairchild Camera & Instrument Corporation Variation and control of bond force
FR2571923B1 (fr) * 1984-10-16 1987-02-20 Farco Sa Procede de soudage d'un composant electrique a un ensemble de pattes de connexion ainsi que machine et ruban pour la mise en oeuvre de ce procede
US4768698A (en) * 1986-10-03 1988-09-06 Pace Incorporated X-Y table with θ rotation
US4899921A (en) * 1988-10-28 1990-02-13 The American Optical Corporation Aligner bonder
JP3132269B2 (ja) * 1993-11-17 2001-02-05 松下電器産業株式会社 アウターリードボンディング装置
HUP9801827A3 (en) * 1995-02-07 2000-03-28 Procter & Gamble Protecting means for venting systems
US5637802A (en) * 1995-02-28 1997-06-10 Rosemount Inc. Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of plates
US6484585B1 (en) 1995-02-28 2002-11-26 Rosemount Inc. Pressure sensor for a pressure transmitter
JP3346983B2 (ja) * 1996-06-17 2002-11-18 松下電器産業株式会社 バンプボンディング装置及び方法
WO2001050106A1 (en) 2000-01-06 2001-07-12 Rosemount Inc. Grain growth of electrical interconnection for microelectromechanical systems (mems)
US6520020B1 (en) 2000-01-06 2003-02-18 Rosemount Inc. Method and apparatus for a direct bonded isolated pressure sensor
US6508129B1 (en) 2000-01-06 2003-01-21 Rosemount Inc. Pressure sensor capsule with improved isolation
US6505516B1 (en) 2000-01-06 2003-01-14 Rosemount Inc. Capacitive pressure sensing with moving dielectric
US6561038B2 (en) 2000-01-06 2003-05-13 Rosemount Inc. Sensor with fluid isolation barrier
US6848316B2 (en) 2002-05-08 2005-02-01 Rosemount Inc. Pressure sensor assembly
US6814273B2 (en) * 2002-09-12 2004-11-09 Visteon Global Technologies, Inc. Flatwire repair tool systems and methods
US7342402B2 (en) * 2003-04-10 2008-03-11 Formfactor, Inc. Method of probing a device using captured image of probe structure in which probe tips comprise alignment features
CN104048779B (zh) * 2014-05-30 2016-07-06 合肥京东方光电科技有限公司 一种测温样本制作治具和制作设备
CN113858078B (zh) * 2021-10-25 2023-04-07 山东瑞博电机有限公司 一种三相异步电动机壳体加工用夹具

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2710046A (en) * 1954-11-24 1955-06-07 Aristocrat Leather Products In Ornamental sheet material and method of making same
US3048690A (en) * 1960-11-02 1962-08-07 Bell Telephone Labor Inc Bonding apparatus
US3275795A (en) * 1963-09-25 1966-09-27 Westinghouse Electric Corp Welding apparatus
US3271555A (en) * 1965-03-29 1966-09-06 Int Resistance Co Handling and bonding apparatus
CA765233A (en) * 1965-04-21 1967-08-15 Western Electric Company, Incorporated Method of soldering with radiant energy
US3388848A (en) * 1966-07-15 1968-06-18 Signetics Corp Alignment and bonding device and method
US3520055A (en) * 1967-04-26 1970-07-14 Western Electric Co Method for holding workpieces for radiant energy bonding
US3448911A (en) * 1967-06-15 1969-06-10 Western Electric Co Compensating base for simultaneously bonding multiple leads
US3533155A (en) * 1967-07-06 1970-10-13 Western Electric Co Bonding with a compliant medium
US3458102A (en) * 1967-08-09 1969-07-29 Kulicke & Soffa Ind Inc Semiconductor wafer pickup and bonding tool
US3548493A (en) * 1967-09-05 1970-12-22 Wells Gardner Electronics Method and apparatus for assembling electrical components on printed circuit boards

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4207874A1 (de) * 1992-03-12 1993-09-16 Fraunhofer Ges Forschung Visuelle kontrolleinrichtung
DE4207874C2 (de) * 1992-03-12 2002-12-12 Fraunhofer Ges Forschung Visuelle Kontrolleinrichtung

Also Published As

Publication number Publication date
FR2072157A1 (de) 1971-09-24
BE761038A (fr) 1971-05-27
US3696985A (en) 1972-10-10
DE2064129A1 (de) 1971-07-08
GB1329290A (en) 1973-09-05
IE34783L (en) 1971-06-30
IE34783B1 (en) 1975-08-20
NL7019010A (de) 1971-07-02
FR2072157B1 (de) 1973-12-28
SE369551B (de) 1974-09-02
ES387427A1 (es) 1974-08-01

Similar Documents

Publication Publication Date Title
CH521698A (de) Verfahren und Einrichtung zum Verbinden eines ersten mit einem zweiten Werkstück
DE1918305B2 (de) Verfahren und vorrichtung zum entspannen eines werkstueckes durch schwingungsbeanspruchung
CH527428A (de) Verfahren und Vorrichtung zum Lokalisieren einer Fehlerstelle in einem Kabel
AT321685B (de) Verfahren und Vorrichtung zum Einschweißen eines metallischen Verschlußstopfens
CH532433A (de) Verfahren und Vorrichtung zum Wellen eines Rohres
CH542330A (de) Verfahren zum Verbinden von Teilen eines Bauelementes
CH485973A (de) Verfahren zum Verbinden eines Rohres mit einem Fitting
CH495842A (de) Verfahren zum Herstellen eines Schichtbauteils
CH543678A (de) Vorrichtung zum Verbinden eines ersten Verbinderteiles mit einem zweiten Verbinderteil
CH534024A (de) Verfahren zum Verbinden eines ersten Werkstückes mit einem zweiten Werkstück
AT337444B (de) Verfahren und vorrichtung zum kontinuierlichen formen eines kunststoffgegenstandes
CH526068A (de) Verfahren und Vorrichtung zum Abdichten eines Lecks in einer Leitung von innen her
DE2107101B2 (de) Verfahren zum aufspueren von gefuegeanomalien in einem werkstueck durch holografische interferometrie
CH498490A (de) Verfahren zum Herstellen eines Halbleiterbauelementes
CH525402A (de) Verfahren und Einrichtung zum dauerhaften Verbinden eines ersten Werkstückes mit einem zweiten Werkstück
CH527967A (de) Verfahren und Einrichtung zum Herstellen einer rauhen Oberfläche auf einem Fahrbahnbelag
AT310533B (de) Verfahren und Vorrichtung zum Recken eines langen Werkstückes
CH524410A (de) Verfahren zum Quetschen und Biegen eines Abschnittes von einem länglichen Bauteil
AT295967B (de) Verfahren und Vorrichtung zum Flämmen
CH536128A (de) Verfahren und Vorrichtung zum Entwässern eines Granulat-Wasser-Gemischs
CH505301A (de) Verfahren und Vorrichtung zum festen Verbinden einer ersten und einer zweiten Metallplatte
CH506884A (de) Verfahren zum Befestigen einer Anzahl von Anschlusselementen an Kontaktflächen eines Werkstückes
CH524041A (de) Verfahren und Vorrichtung zum Herstellen eines Heizölbehälters
CH498683A (de) Verfahren und Vorrichtung zum Entgraten oder Beseitigen von vorstehenden Teilen eines leitfähigen Werkstückes
AT308612B (de) Verfahren und Vorrichtung zum Herstellen von mit einem Filter versehenen Zigarettenhülsen

Legal Events

Date Code Title Description
PL Patent ceased