CH521698A - Verfahren und Einrichtung zum Verbinden eines ersten mit einem zweiten Werkstück - Google Patents
Verfahren und Einrichtung zum Verbinden eines ersten mit einem zweiten WerkstückInfo
- Publication number
- CH521698A CH521698A CH1933770A CH1933770A CH521698A CH 521698 A CH521698 A CH 521698A CH 1933770 A CH1933770 A CH 1933770A CH 1933770 A CH1933770 A CH 1933770A CH 521698 A CH521698 A CH 521698A
- Authority
- CH
- Switzerland
- Prior art keywords
- workpiece
- joining
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Optical Couplings Of Light Guides (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US88944769A | 1969-12-31 | 1969-12-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH521698A true CH521698A (de) | 1972-04-15 |
Family
ID=25395107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1933770A CH521698A (de) | 1969-12-31 | 1970-12-30 | Verfahren und Einrichtung zum Verbinden eines ersten mit einem zweiten Werkstück |
Country Status (10)
Country | Link |
---|---|
US (1) | US3696985A (de) |
BE (1) | BE761038A (de) |
CH (1) | CH521698A (de) |
DE (1) | DE2064129A1 (de) |
ES (1) | ES387427A1 (de) |
FR (1) | FR2072157B1 (de) |
GB (1) | GB1329290A (de) |
IE (1) | IE34783B1 (de) |
NL (1) | NL7019010A (de) |
SE (1) | SE369551B (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4207874A1 (de) * | 1992-03-12 | 1993-09-16 | Fraunhofer Ges Forschung | Visuelle kontrolleinrichtung |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL165332C (nl) * | 1970-10-07 | 1981-08-17 | Philips Nv | Inrichting voor het verbinden van een halfgeleider- inrichting met een substraat. |
US3774834A (en) * | 1971-07-20 | 1973-11-27 | J And A Keller Machine Co Inc | Bonding apparatus |
US3771711A (en) * | 1971-08-20 | 1973-11-13 | Western Electric Co | Compliant bonding |
US3800409A (en) * | 1972-05-01 | 1974-04-02 | Western Electric Co | Method for compliant bonding |
US3901429A (en) * | 1972-05-01 | 1975-08-26 | Western Electric Co | Apparatus for compliant bonding |
US3900244A (en) * | 1972-09-21 | 1975-08-19 | Teledyne Inc | Visual selection and precision isolation system for microelectronic units |
US3909915A (en) * | 1972-10-10 | 1975-10-07 | Leopold Samuel Phillips | Bonding apparatus |
FR2205800B1 (de) * | 1972-11-09 | 1976-08-20 | Honeywell Bull Soc Ind | |
US3860405A (en) * | 1972-11-13 | 1975-01-14 | Western Electric Co | Bonding of optical components |
JPS5647697B2 (de) * | 1973-06-26 | 1981-11-11 | ||
US3846905A (en) * | 1973-07-09 | 1974-11-12 | Texas Instruments Inc | Assembly method for semiconductor chips |
US3949926A (en) * | 1974-01-30 | 1976-04-13 | Diepeveen John C | Apparatus for incremental movement of die frame |
US4010885A (en) * | 1974-09-30 | 1977-03-08 | The Jade Corporation | Apparatus for accurately bonding leads to a semi-conductor die or the like |
US3946931A (en) * | 1974-11-27 | 1976-03-30 | Western Electric Company, Inc. | Methods of and apparatus for bonding an article to a substrate |
DE2841465B2 (de) * | 1978-09-23 | 1980-08-21 | Messerschmitt-Boelkow-Blohm Gmbh, 8000 Muenchen | Vorrichtung zum Verschweißen von Kontaktfahnen mit Sonnenzellen |
JPS5599795A (en) * | 1979-01-25 | 1980-07-30 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
US4832251A (en) * | 1983-12-13 | 1989-05-23 | General Electric Company | Method of mounting semiconductor lasers providing improved lasing spot alignment |
US4603802A (en) * | 1984-02-27 | 1986-08-05 | Fairchild Camera & Instrument Corporation | Variation and control of bond force |
FR2571923B1 (fr) * | 1984-10-16 | 1987-02-20 | Farco Sa | Procede de soudage d'un composant electrique a un ensemble de pattes de connexion ainsi que machine et ruban pour la mise en oeuvre de ce procede |
US4768698A (en) * | 1986-10-03 | 1988-09-06 | Pace Incorporated | X-Y table with θ rotation |
US4899921A (en) * | 1988-10-28 | 1990-02-13 | The American Optical Corporation | Aligner bonder |
JP3132269B2 (ja) * | 1993-11-17 | 2001-02-05 | 松下電器産業株式会社 | アウターリードボンディング装置 |
KR19980701990A (ko) * | 1995-02-07 | 1998-06-25 | 레이서 제이코버스 코넬리스 | 통기 시스템용 보호 수단 |
US5637802A (en) * | 1995-02-28 | 1997-06-10 | Rosemount Inc. | Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of plates |
US6484585B1 (en) | 1995-02-28 | 2002-11-26 | Rosemount Inc. | Pressure sensor for a pressure transmitter |
JP3346983B2 (ja) * | 1996-06-17 | 2002-11-18 | 松下電器産業株式会社 | バンプボンディング装置及び方法 |
US6520020B1 (en) | 2000-01-06 | 2003-02-18 | Rosemount Inc. | Method and apparatus for a direct bonded isolated pressure sensor |
EP1244900B1 (de) | 2000-01-06 | 2005-01-05 | Rosemount Inc. | Kornwachstumsverfahren zur herstellung einer elektrischen verbindung für mikroelektromechanische systeme (mems) |
US6505516B1 (en) | 2000-01-06 | 2003-01-14 | Rosemount Inc. | Capacitive pressure sensing with moving dielectric |
US6508129B1 (en) | 2000-01-06 | 2003-01-21 | Rosemount Inc. | Pressure sensor capsule with improved isolation |
US6561038B2 (en) | 2000-01-06 | 2003-05-13 | Rosemount Inc. | Sensor with fluid isolation barrier |
US6848316B2 (en) | 2002-05-08 | 2005-02-01 | Rosemount Inc. | Pressure sensor assembly |
US6814273B2 (en) * | 2002-09-12 | 2004-11-09 | Visteon Global Technologies, Inc. | Flatwire repair tool systems and methods |
US7342402B2 (en) * | 2003-04-10 | 2008-03-11 | Formfactor, Inc. | Method of probing a device using captured image of probe structure in which probe tips comprise alignment features |
CN104048779B (zh) * | 2014-05-30 | 2016-07-06 | 合肥京东方光电科技有限公司 | 一种测温样本制作治具和制作设备 |
CN113858078B (zh) * | 2021-10-25 | 2023-04-07 | 山东瑞博电机有限公司 | 一种三相异步电动机壳体加工用夹具 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2710046A (en) * | 1954-11-24 | 1955-06-07 | Aristocrat Leather Products In | Ornamental sheet material and method of making same |
US3048690A (en) * | 1960-11-02 | 1962-08-07 | Bell Telephone Labor Inc | Bonding apparatus |
US3275795A (en) * | 1963-09-25 | 1966-09-27 | Westinghouse Electric Corp | Welding apparatus |
US3271555A (en) * | 1965-03-29 | 1966-09-06 | Int Resistance Co | Handling and bonding apparatus |
CA765233A (en) * | 1965-04-21 | 1967-08-15 | Western Electric Company, Incorporated | Method of soldering with radiant energy |
US3388848A (en) * | 1966-07-15 | 1968-06-18 | Signetics Corp | Alignment and bonding device and method |
US3520055A (en) * | 1967-04-26 | 1970-07-14 | Western Electric Co | Method for holding workpieces for radiant energy bonding |
US3448911A (en) * | 1967-06-15 | 1969-06-10 | Western Electric Co | Compensating base for simultaneously bonding multiple leads |
US3533155A (en) * | 1967-07-06 | 1970-10-13 | Western Electric Co | Bonding with a compliant medium |
US3458102A (en) * | 1967-08-09 | 1969-07-29 | Kulicke & Soffa Ind Inc | Semiconductor wafer pickup and bonding tool |
US3548493A (en) * | 1967-09-05 | 1970-12-22 | Wells Gardner Electronics | Method and apparatus for assembling electrical components on printed circuit boards |
-
1969
- 1969-12-31 US US889447A patent/US3696985A/en not_active Expired - Lifetime
-
1970
- 1970-12-03 IE IE1546/70A patent/IE34783B1/xx unknown
- 1970-12-23 SE SE17500/70D patent/SE369551B/xx unknown
- 1970-12-28 DE DE19702064129 patent/DE2064129A1/de active Pending
- 1970-12-29 GB GB6150370A patent/GB1329290A/en not_active Expired
- 1970-12-30 NL NL7019010A patent/NL7019010A/xx unknown
- 1970-12-30 ES ES387427A patent/ES387427A1/es not_active Expired
- 1970-12-30 FR FR7047373A patent/FR2072157B1/fr not_active Expired
- 1970-12-30 BE BE761038A patent/BE761038A/xx unknown
- 1970-12-30 CH CH1933770A patent/CH521698A/de not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4207874A1 (de) * | 1992-03-12 | 1993-09-16 | Fraunhofer Ges Forschung | Visuelle kontrolleinrichtung |
DE4207874C2 (de) * | 1992-03-12 | 2002-12-12 | Fraunhofer Ges Forschung | Visuelle Kontrolleinrichtung |
Also Published As
Publication number | Publication date |
---|---|
IE34783B1 (en) | 1975-08-20 |
NL7019010A (de) | 1971-07-02 |
FR2072157A1 (de) | 1971-09-24 |
BE761038A (fr) | 1971-05-27 |
ES387427A1 (es) | 1974-08-01 |
IE34783L (en) | 1971-06-30 |
FR2072157B1 (de) | 1973-12-28 |
GB1329290A (en) | 1973-09-05 |
US3696985A (en) | 1972-10-10 |
SE369551B (de) | 1974-09-02 |
DE2064129A1 (de) | 1971-07-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |