BE761038A - Procede et appareil pour l'alignement de pieces a travailler etla creation de liaisons entre elles - Google Patents

Procede et appareil pour l'alignement de pieces a travailler etla creation de liaisons entre elles

Info

Publication number
BE761038A
BE761038A BE761038A BE761038A BE761038A BE 761038 A BE761038 A BE 761038A BE 761038 A BE761038 A BE 761038A BE 761038 A BE761038 A BE 761038A BE 761038 A BE761038 A BE 761038A
Authority
BE
Belgium
Prior art keywords
workpieces
creation
links
alignment
Prior art date
Application number
BE761038A
Other languages
English (en)
French (fr)
Inventor
C R Herring
F J Schneider
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of BE761038A publication Critical patent/BE761038A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
BE761038A 1969-12-31 1970-12-30 Procede et appareil pour l'alignement de pieces a travailler etla creation de liaisons entre elles BE761038A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US88944769A 1969-12-31 1969-12-31

Publications (1)

Publication Number Publication Date
BE761038A true BE761038A (fr) 1971-05-27

Family

ID=25395107

Family Applications (1)

Application Number Title Priority Date Filing Date
BE761038A BE761038A (fr) 1969-12-31 1970-12-30 Procede et appareil pour l'alignement de pieces a travailler etla creation de liaisons entre elles

Country Status (10)

Country Link
US (1) US3696985A (de)
BE (1) BE761038A (de)
CH (1) CH521698A (de)
DE (1) DE2064129A1 (de)
ES (1) ES387427A1 (de)
FR (1) FR2072157B1 (de)
GB (1) GB1329290A (de)
IE (1) IE34783B1 (de)
NL (1) NL7019010A (de)
SE (1) SE369551B (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL165332C (nl) * 1970-10-07 1981-08-17 Philips Nv Inrichting voor het verbinden van een halfgeleider- inrichting met een substraat.
US3774834A (en) * 1971-07-20 1973-11-27 J And A Keller Machine Co Inc Bonding apparatus
US3771711A (en) * 1971-08-20 1973-11-13 Western Electric Co Compliant bonding
US3800409A (en) * 1972-05-01 1974-04-02 Western Electric Co Method for compliant bonding
US3901429A (en) * 1972-05-01 1975-08-26 Western Electric Co Apparatus for compliant bonding
US3900244A (en) * 1972-09-21 1975-08-19 Teledyne Inc Visual selection and precision isolation system for microelectronic units
US3909915A (en) * 1972-10-10 1975-10-07 Leopold Samuel Phillips Bonding apparatus
FR2205800B1 (de) * 1972-11-09 1976-08-20 Honeywell Bull Soc Ind
US3860405A (en) * 1972-11-13 1975-01-14 Western Electric Co Bonding of optical components
JPS5647697B2 (de) * 1973-06-26 1981-11-11
US3846905A (en) * 1973-07-09 1974-11-12 Texas Instruments Inc Assembly method for semiconductor chips
US3949926A (en) * 1974-01-30 1976-04-13 Diepeveen John C Apparatus for incremental movement of die frame
US4010885A (en) * 1974-09-30 1977-03-08 The Jade Corporation Apparatus for accurately bonding leads to a semi-conductor die or the like
US3946931A (en) * 1974-11-27 1976-03-30 Western Electric Company, Inc. Methods of and apparatus for bonding an article to a substrate
DE2841465B2 (de) * 1978-09-23 1980-08-21 Messerschmitt-Boelkow-Blohm Gmbh, 8000 Muenchen Vorrichtung zum Verschweißen von Kontaktfahnen mit Sonnenzellen
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Ind Co Ltd Device for mounting electronic part
US4832251A (en) * 1983-12-13 1989-05-23 General Electric Company Method of mounting semiconductor lasers providing improved lasing spot alignment
US4603802A (en) * 1984-02-27 1986-08-05 Fairchild Camera & Instrument Corporation Variation and control of bond force
FR2571923B1 (fr) * 1984-10-16 1987-02-20 Farco Sa Procede de soudage d'un composant electrique a un ensemble de pattes de connexion ainsi que machine et ruban pour la mise en oeuvre de ce procede
US4768698A (en) * 1986-10-03 1988-09-06 Pace Incorporated X-Y table with θ rotation
US4899921A (en) * 1988-10-28 1990-02-13 The American Optical Corporation Aligner bonder
DE4207874C2 (de) * 1992-03-12 2002-12-12 Fraunhofer Ges Forschung Visuelle Kontrolleinrichtung
JP3132269B2 (ja) * 1993-11-17 2001-02-05 松下電器産業株式会社 アウターリードボンディング装置
HUP9801827A3 (en) * 1995-02-07 2000-03-28 Procter & Gamble Protecting means for venting systems
US5637802A (en) * 1995-02-28 1997-06-10 Rosemount Inc. Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of plates
US6484585B1 (en) 1995-02-28 2002-11-26 Rosemount Inc. Pressure sensor for a pressure transmitter
JP3346983B2 (ja) * 1996-06-17 2002-11-18 松下電器産業株式会社 バンプボンディング装置及び方法
US6561038B2 (en) 2000-01-06 2003-05-13 Rosemount Inc. Sensor with fluid isolation barrier
US6508129B1 (en) 2000-01-06 2003-01-21 Rosemount Inc. Pressure sensor capsule with improved isolation
US6505516B1 (en) 2000-01-06 2003-01-14 Rosemount Inc. Capacitive pressure sensing with moving dielectric
JP3620795B2 (ja) 2000-01-06 2005-02-16 ローズマウント インコーポレイテッド 超小型電気機械システム用電気的相互接続部の結晶粒成長
US6520020B1 (en) 2000-01-06 2003-02-18 Rosemount Inc. Method and apparatus for a direct bonded isolated pressure sensor
US6848316B2 (en) 2002-05-08 2005-02-01 Rosemount Inc. Pressure sensor assembly
US6814273B2 (en) * 2002-09-12 2004-11-09 Visteon Global Technologies, Inc. Flatwire repair tool systems and methods
US7342402B2 (en) * 2003-04-10 2008-03-11 Formfactor, Inc. Method of probing a device using captured image of probe structure in which probe tips comprise alignment features
CN104048779B (zh) * 2014-05-30 2016-07-06 合肥京东方光电科技有限公司 一种测温样本制作治具和制作设备
CN113858078B (zh) * 2021-10-25 2023-04-07 山东瑞博电机有限公司 一种三相异步电动机壳体加工用夹具

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2710046A (en) * 1954-11-24 1955-06-07 Aristocrat Leather Products In Ornamental sheet material and method of making same
US3048690A (en) * 1960-11-02 1962-08-07 Bell Telephone Labor Inc Bonding apparatus
US3275795A (en) * 1963-09-25 1966-09-27 Westinghouse Electric Corp Welding apparatus
US3271555A (en) * 1965-03-29 1966-09-06 Int Resistance Co Handling and bonding apparatus
NL134969C (de) * 1965-04-21
US3388848A (en) * 1966-07-15 1968-06-18 Signetics Corp Alignment and bonding device and method
US3520055A (en) * 1967-04-26 1970-07-14 Western Electric Co Method for holding workpieces for radiant energy bonding
US3448911A (en) * 1967-06-15 1969-06-10 Western Electric Co Compensating base for simultaneously bonding multiple leads
US3533155A (en) * 1967-07-06 1970-10-13 Western Electric Co Bonding with a compliant medium
US3458102A (en) * 1967-08-09 1969-07-29 Kulicke & Soffa Ind Inc Semiconductor wafer pickup and bonding tool
US3548493A (en) * 1967-09-05 1970-12-22 Wells Gardner Electronics Method and apparatus for assembling electrical components on printed circuit boards

Also Published As

Publication number Publication date
IE34783B1 (en) 1975-08-20
FR2072157B1 (de) 1973-12-28
GB1329290A (en) 1973-09-05
SE369551B (de) 1974-09-02
US3696985A (en) 1972-10-10
NL7019010A (de) 1971-07-02
FR2072157A1 (de) 1971-09-24
CH521698A (de) 1972-04-15
ES387427A1 (es) 1974-08-01
IE34783L (en) 1971-06-30
DE2064129A1 (de) 1971-07-08

Similar Documents

Publication Publication Date Title
BE761038A (fr) Procede et appareil pour l'alignement de pieces a travailler etla creation de liaisons entre elles
BE819569A (fr) Appareil et procede pour souder
FR2279486A1 (fr) Procede et appareil de formage de pieces metalliques
BE751199A (fr) Procede et appareil pour le foncage d'elements de construction
BE746242A (fr) Procede pour former des gorges pour joints toriques
BE754558A (fr) Procede et appareil de filtrage de metaux en fusion
BE750359A (fr) Procede et appareil pour tronconner une matiere
BE765854A (fr) Procede et appareil pour inspecter les faces opposees de petitsobjets
FR2353355A1 (fr) Procede et appareil pour former des pieces frittees en superalliages
BE787505A (fr) Procede et appareil pour debiter des explosifs
BE745436A (fr) Procede et appareil d'usinage par decharge
BE812202A (fr) Appareil et procede de traitement de metaux en fusion
BE764651A (fr) Appareil et procede pour fabriquer des capsules
BE756471A (fr) Procede et appareil pour traiter les matieres semi-conductrices
BE758855A (fr) Procede et appareil d'etablissement de contact entre des fluides
BE802892A (fr) Perfectionnements apportes au procede et dispositif pour le refroidissement de joints de soudure
BE756703A (fr) Procede et appareil pour melanger des reactifs
BE862000A (fr) Appareil et procede pour inspecter le contour des articles
PT65056A (fr) Procede et dispositif pour la production des pieces fondues
BE756821A (fr) Procede et appareil perfectionnes de
FR2321717A1 (fr) Procede et appareil pour le developpement de surfaces collantes
BE753240A (fr) Procede et appareil de fabrication d'articles
BE760792A (fr) Procede et appareil pour la fabrication de recipients
BE745100A (fr) Procede et appareil pour l'emballage
BE753505A (fr) Appareil pour traiter les dechets