CH517381A - Verfahren zum Herstellen eines Halbleitergleichrichters und nach diesem Verfahren hergestellter Halbleitergleichrichter - Google Patents

Verfahren zum Herstellen eines Halbleitergleichrichters und nach diesem Verfahren hergestellter Halbleitergleichrichter

Info

Publication number
CH517381A
CH517381A CH1732369A CH1732369A CH517381A CH 517381 A CH517381 A CH 517381A CH 1732369 A CH1732369 A CH 1732369A CH 1732369 A CH1732369 A CH 1732369A CH 517381 A CH517381 A CH 517381A
Authority
CH
Switzerland
Prior art keywords
semiconductor rectifier
manufacturing
manufactured according
semiconductor
rectifier
Prior art date
Application number
CH1732369A
Other languages
English (en)
Inventor
Urquhart Macrae Alfred
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of CH517381A publication Critical patent/CH517381A/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F23COMBUSTION APPARATUS; COMBUSTION PROCESSES
    • F23QIGNITION; EXTINGUISHING-DEVICES
    • F23Q9/00Pilot flame igniters
    • F23Q9/02Pilot flame igniters without interlock with main fuel supply
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/085Isolated-integrated
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/106Masks, special
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/139Schottky barrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Element Separation (AREA)
CH1732369A 1968-11-22 1969-11-20 Verfahren zum Herstellen eines Halbleitergleichrichters und nach diesem Verfahren hergestellter Halbleitergleichrichter CH517381A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US77828568A 1968-11-22 1968-11-22

Publications (1)

Publication Number Publication Date
CH517381A true CH517381A (de) 1971-12-31

Family

ID=25112833

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1732369A CH517381A (de) 1968-11-22 1969-11-20 Verfahren zum Herstellen eines Halbleitergleichrichters und nach diesem Verfahren hergestellter Halbleitergleichrichter

Country Status (8)

Country Link
US (1) US3586542A (de)
JP (1) JPS4822020B1 (de)
BE (1) BE742022A (de)
CH (1) CH517381A (de)
FR (1) FR2024916B1 (de)
GB (1) GB1291450A (de)
NL (1) NL158655B (de)
SE (1) SE362733B (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6979877B1 (en) * 1965-09-28 2005-12-27 Li Chou H Solid-state device
US6849918B1 (en) * 1965-09-28 2005-02-01 Chou H. Li Miniaturized dielectrically isolated solid state device
US7038290B1 (en) 1965-09-28 2006-05-02 Li Chou H Integrated circuit device
US4946800A (en) * 1965-09-28 1990-08-07 Li Chou H Method for making solid-state device utilizing isolation grooves
US5696402A (en) * 1965-09-28 1997-12-09 Li; Chou H. Integrated circuit device
US5082793A (en) * 1965-09-28 1992-01-21 Li Chou H Method for making solid state device utilizing ion implantation techniques
US4916513A (en) * 1965-09-28 1990-04-10 Li Chou H Dielectrically isolated integrated circuit structure
GB1311748A (en) * 1969-06-21 1973-03-28 Licentia Gmbh Semiconductor device
US3638300A (en) * 1970-05-21 1972-02-01 Bell Telephone Labor Inc Forming impurity regions in semiconductors
GB1334520A (en) * 1970-06-12 1973-10-17 Atomic Energy Authority Uk Formation of electrically insulating layers in semiconducting materials
US3663308A (en) * 1970-11-05 1972-05-16 Us Navy Method of making ion implanted dielectric enclosures
US3707765A (en) * 1970-11-19 1973-01-02 Motorola Inc Method of making isolated semiconductor devices
US3648125A (en) * 1971-02-02 1972-03-07 Fairchild Camera Instr Co Method of fabricating integrated circuits with oxidized isolation and the resulting structure
FR2129992B1 (de) * 1971-03-25 1974-06-21 Lecrosnier Daniel
US3897274A (en) * 1971-06-01 1975-07-29 Texas Instruments Inc Method of fabricating dielectrically isolated semiconductor structures
US3711745A (en) * 1971-10-06 1973-01-16 Microwave Ass Inc Low barrier height gallium arsenide microwave schottky diodes using gold-germanium alloy
US3728161A (en) * 1971-12-28 1973-04-17 Bell Telephone Labor Inc Integrated circuits with ion implanted chan stops
US4017887A (en) * 1972-07-25 1977-04-12 The United States Of America As Represented By The Secretary Of The Air Force Method and means for passivation and isolation in semiconductor devices
US3897273A (en) * 1972-11-06 1975-07-29 Hughes Aircraft Co Process for forming electrically isolating high resistivity regions in GaAs
US3921199A (en) * 1973-07-31 1975-11-18 Texas Instruments Inc Junction breakdown voltage by means of ion implanted compensation guard ring
US3968272A (en) * 1974-01-25 1976-07-06 Microwave Associates, Inc. Zero-bias Schottky barrier detector diodes
DE2507366C3 (de) * 1975-02-20 1980-06-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Unterdrückung parasitärer Schaltungselemente
JPS51126761A (en) * 1975-04-25 1976-11-05 Sony Corp Schottky barrier type semi-conductor unit
US4105805A (en) * 1976-12-29 1978-08-08 The United States Of America As Represented By The Secretary Of The Army Formation of metal nitride oxide semiconductor (MNOS) by ion implantation of oxygen through a silicon nitride layer
US4358326A (en) * 1980-11-03 1982-11-09 International Business Machines Corporation Epitaxially extended polycrystalline structures utilizing a predeposit of amorphous silicon with subsequent annealing
US4403397A (en) * 1981-07-13 1983-09-13 The United States Of America As Represented By The Secretary Of The Navy Method of making avalanche photodiodes
JPS58111726U (ja) * 1982-01-25 1983-07-30 山本 政弘 平葺き用銅屋根板
USH569H (en) 1984-09-28 1989-01-03 Motorola Inc. Charge storage depletion region discharge protection
US5306649A (en) * 1991-07-26 1994-04-26 Avantek, Inc. Method for producing a fully walled emitter-base structure in a bipolar transistor
US20040144999A1 (en) * 1995-06-07 2004-07-29 Li Chou H. Integrated circuit device
US5859465A (en) * 1996-10-15 1999-01-12 International Rectifier Corporation High voltage power schottky with aluminum barrier metal spaced from first diffused ring

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1419572A (fr) * 1962-03-23 1965-12-03 Texas Instruments Inc Mise à l'état passif de jonction de semiconducteur
DD63253A3 (de) * 1966-12-05 1968-08-05

Also Published As

Publication number Publication date
NL158655B (nl) 1978-11-15
US3586542A (en) 1971-06-22
FR2024916B1 (de) 1973-10-19
DE1957774B2 (de) 1972-10-26
GB1291450A (en) 1972-10-04
NL6917558A (de) 1970-05-26
DE1957774A1 (de) 1970-05-27
SE362733B (de) 1973-12-17
FR2024916A1 (de) 1970-09-04
JPS4822020B1 (de) 1973-07-03
BE742022A (de) 1970-05-04

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Legal Events

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